权益分类	功能权益	普通用户	{{item.name}}会员
{{category.name}}	{{benefitItem.name}}

CNS Core: Small: Wireless Interconnect Networks on Multi-Die Systems

CNS 核心：小型：多芯片系统上的无线互连网络

基本信息

批准号：
2008629
负责人：
Baris Taskin
金额：
$ 46.5万
依托单位：
Drexel University
依托单位国家：
美国
项目类别：
Standard Grant
财政年份：
2020
资助国家：
美国
起止时间：
2020-10-01 至 2024-09-30
项目状态：
已结题

来源：
https://www.nsf.gov/awardsearch/showAward?AWD_ID=2008629&HistoricalAwards=false
关键词：
CNS Core Small Wireless Interconnect

项目摘要

Advances in semiconductor technology have enabled sophisticated computing systems to be integrated in small form-factor devices that are widely used in not only in computers, but in consumer electronics such as cellphones and have enabled a host of applications, such as the internet-of-things, wearable electronics, portable medical devices, etc. The integration of multiple computing and storage units in a single semiconductor device necessitates the scaling of networking science, typically developed for constraints between computers (such as the internet), down to a single-chip level, in order to enable efficient communication between on-chip elements. This enables data-center-like operation on an individual chip populated with hundreds of processing elements, with computation capabilities that are equivalent to a network of computers, but with much improved portability, cost-effectiveness and energy-efficiency. Such advancements are important to maintain US leadership of the computing, networking and semiconductor industries, as well as improving the connectivity of national human resources and the physical infrastructure.This project investigates computing system, VLSI, antenna design and networking principles for the integration of a novel Through-Silicon-Via-Antenna (TVSA)-based wireless network system into semiconductor devices packaged in the form factor of heterogeneous multi-die integration. The proposed wireless network for multi-die systems aims to create a scalable, reliable, and efficient network interconnect for current and emerging industry-standard multi-die processors. Through-Silicon-Via-Antennas are highly suited for on-chip wireless communication at minuscule footprints. This project focuses on the following tasks: (a) design and characterization of on-package TSVA; (b) wireless propagation modelling and channel characterization for multi-die systems using a Software Defined Radio (SDR) prototyping testbed; and (c) interconnect network system design by considering routing, latency, and throughput via cycle-accurate system-level simulations.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

半导体技术的进步已经使得复杂的计算系统能够被集成在小形状因子设备中，所述小形状因子设备不仅广泛用于计算机中，而且广泛用于诸如手机的消费电子产品中，并且已经使得能够实现诸如物联网、可穿戴电子产品、便携式医疗设备、智能手机、智能在单个半导体器件中集成多个计算和存储单元使得网络科学的缩放成为必要，网络科学通常是针对计算机之间的约束而开发的（诸如因特网），下至单芯片级，以便实现芯片上元件之间的有效通信。这使得在一个单独的芯片上进行类似数据中心的操作，该芯片上有数百个处理元件，其计算能力相当于计算机网络，但具有更高的便携性，成本效益和能源效率。这些进步对于保持美国在计算、网络和半导体行业的领导地位以及改善国家人力资源和物理基础设施的连通性非常重要。本项目研究计算系统、超大规模集成电路、天线设计和网络原理的集成一种新的硅通孔天线（TVSA）-基于无线网络系统的半导体器件封装在异构多芯片集成的形状因子中。所提出的用于多芯片系统的无线网络旨在为当前和新兴的行业标准多芯片处理器创建可扩展的、可靠的和高效的网络互连。硅通孔阵列非常适合于芯片上的无线通信在微小的足迹。该项目的重点是以下任务：（a）封装上TSVA的设计和表征;（B）使用软件定义无线电（SDR）原型测试平台对多管芯系统进行无线传播建模和信道表征;以及（c）通过考虑路由，等待时间，通过循环精确的系统，该奖项反映了NSF的法定使命，并被认为是值得通过评估使用基金会的知识优点和更广泛的影响审查标准。