II-NEW: Testbed for High Performance Interconnects

II-新：高性能互连测试平台

• 批准号: 1305350
• 负责人: Baris Taskin
• 金额: $ 70万
• 依托单位: Drexel University
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2013
• 资助国家: 美国
• 起止时间: 2013-10-01 至 2019-06-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1305350&HistoricalAwards=false
• 关键词: II; NEW; Testbed; Performance; Interconnects

Increasing functionality and complexity of integrated circuits, particularly those used in high performance computational devices such as computers but also in portable and mobile devices, necessitate high frequency communication links. The information generated and processed at the relentlessly increasing pace in these devices flows over the high frequency communication links between computation, storage and display units. The design and analysis of these high frequency communication links, much like the computation, storage and display units themselves, necessitate design and measurement equipment that is capable of supporting their multi-GHz range of operation. This project is for the acquisition of such a measurement testbed for high frequency interconnects to be located at Drexel University in Philadelphia, PA. Opportunistically, the measurement testbed is used for testing of many types of circuits and systems including those involving microelectronics, optics, sensors, radio-frequency applications, nano-electronics and molecular-electronics. Measurements of the circuit and system devices enabled with this infrastructure enable the development of computing devices that are increasingly portable, fast and significantly less power demanding than the current electronic products. The measurement testbed is used to develop lecture modules on high frequency measurement, bridging a gap with the US microelectronics industry demand with practical hands-on training with integrated circuit measurement and testing in undergraduate education. The measurement testbed is used by a large number of faculty members at the host institution (and users in the Delaware Valley region) in a number of computing and non-computing projects. The primary computing projects that are enhanced by this measurement testbed are novel approaches in developing high performance integrated circuit interconnects: 1. On-chip wireless interconnects, 2. Resonant clock interconnects, 3. On-chip wireless interconnects. The measurement testbed is useful as a whole or in pieces to the many other computing and non-computing research areas thanks to enabling on-wafer testing and multi-port measurement. These additional projects range from reduced dimensional photonics for THz sensing to nanowires for energy storage and IC-based artificial photosynthesis.

集成电路（尤其是在诸如计算机的高性能计算设备中以及在便携式和移动的设备中使用的集成电路）的日益增加的功能性和复杂性需要高频通信链路。 在这些设备中以不断增加的速度产生和处理的信息通过计算、存储和显示单元之间的高频通信链路流动。 这些高频通信链路的设计和分析，就像计算、存储和显示单元本身一样，需要能够支持其多GHz工作范围的设计和测量设备。 该项目是为收购这样一个测量测试台的高频互连将位于费城，宾夕法尼亚州德雷克塞尔大学。 从理论上讲，测量测试台用于测试许多类型的电路和系统，包括涉及微电子学、光学、传感器、射频应用、纳米电子学和分子电子学的电路和系统。 利用该基础设施实现的电路和系统设备的测量使得计算设备的开发变得越来越便携、快速并且比当前电子产品的功率要求显著更低。 测量测试平台用于开发高频测量的讲座模块，通过在本科教育中进行集成电路测量和测试的实际动手培训，弥合了与美国微电子行业需求的差距。主办机构的大量教职员工（以及特拉华州山谷地区的用户）在许多计算和非计算项目中使用该测量测试台。 主要的计算项目，增强了这个测量测试平台是新的方法，在开发高性能集成电路互连：1。片上无线互连，2.谐振时钟互连，3.片上无线互连。由于能够进行晶圆上测试和多端口测量，该测量测试台作为一个整体或部分对许多其他计算和非计算研究领域非常有用。 这些额外的项目范围从用于THz传感的降维光子学到用于能量存储和基于IC的人工光合作用的纳米线。