II-NEW: Testbed for High Performance Interconnects

集成电路的功能和复杂性日益增加，特别是用于高性能计算设备（如计算机）以及便携式和移动设备的集成电路，需要高频通信链路。在这些设备中，以不断增加的速度产生和处理的信息通过计算、存储和显示单元之间的高频通信链路流动。这些高频通信链路的设计和分析，就像计算、存储和显示单元本身一样，需要能够支持其多ghz操作范围的设计和测量设备。这个项目是为了获得这样一个高频互连的测量试验台，该试验台将位于宾夕法尼亚州费城的德雷塞尔大学。碰巧的是，测量试验台可用于测试许多类型的电路和系统，包括涉及微电子，光学，传感器，射频应用，纳米电子学和分子电子学的电路和系统。利用这种基础设施对电路和系统设备进行测量，使计算设备的开发变得越来越便携、快速，并且比当前的电子产品功耗要求低得多。测量测试平台用于开发高频测量的讲座模块，通过在本科教育中进行集成电路测量和测试的实际动手培训，弥合与美国微电子行业需求的差距。在许多计算和非计算项目中，宿主机构的大量教员（以及特拉华河谷地区的用户）使用了测量测试平台。该测量试验台的主要计算项目是开发高性能集成电路互连的新方法：1。片上无线互连；共振时钟互连，3。片上无线互连。由于支持晶圆上测试和多端口测量，测量测试平台可以作为一个整体或部分用于许多其他计算和非计算研究领域。这些额外的项目范围从用于太赫兹感应的降维光子学到用于储能的纳米线和基于集成电路的人工光合作用。

Increasing functionality and complexity of integrated circuits, particularly those used in high performance computational devices such as computers but also in portable and mobile devices, necessitate high frequency communication links. The information generated and processed at the relentlessly increasing pace in these devices flows over the high frequency communication links between computation, storage and display units. The design and analysis of these high frequency communication links, much like the computation, storage and display units themselves, necessitate design and measurement equipment that is capable of supporting their multi-GHz range of operation. This project is for the acquisition of such a measurement testbed for high frequency interconnects to be located at Drexel University in Philadelphia, PA. Opportunistically, the measurement testbed is used for testing of many types of circuits and systems including those involving microelectronics, optics, sensors, radio-frequency applications, nano-electronics and molecular-electronics. Measurements of the circuit and system devices enabled with this infrastructure enable the development of computing devices that are increasingly portable, fast and significantly less power demanding than the current electronic products. The measurement testbed is used to develop lecture modules on high frequency measurement, bridging a gap with the US microelectronics industry demand with practical hands-on training with integrated circuit measurement and testing in undergraduate education. The measurement testbed is used by a large number of faculty members at the host institution (and users in the Delaware Valley region) in a number of computing and non-computing projects. The primary computing projects that are enhanced by this measurement testbed are novel approaches in developing high performance integrated circuit interconnects: 1. On-chip wireless interconnects, 2. Resonant clock interconnects, 3. On-chip wireless interconnects. The measurement testbed is useful as a whole or in pieces to the many other computing and non-computing research areas thanks to enabling on-wafer testing and multi-port measurement. These additional projects range from reduced dimensional photonics for THz sensing to nanowires for energy storage and IC-based artificial photosynthesis.