Investigations into the segregation behavior and line tension of triple lines in tricrystals of copper alloys

铜合金三晶中三线偏析行为和线张力的研究

• 批准号: 211077408
• 负责人: Professor Dr. Günter Gottstein
• 金额: --
• 依托单位: Abteilung für Materialphysik
• 依托单位国家: 德国
• 项目类别: Research Grants
• 财政年份: 2012
• 资助国家: 德国
• 起止时间: 2011-12-31 至 2013-12-31
• 项目状态: 已结题
• 来源: https://gepris.dfg.de/gepris/projekt/211077408?language=en
• 关键词: Investigations; into; segregation; behavior; line

It is proposed to combine tomographic atom probe characterization and atomic force microscopy to measure the segregation of alloying elements in copper to grain boundary triple junction lines and its effect on triple junction energy. This will be achieved by a measurement of the force equilibrium at a triple junction as established by the curvature of the adjourning grain boundary grooves at the root of the triple junction. A corresponding theoretical basis has been developed and first measurements on specimens of pure copper with random triple junction crystallography have been conducted. This methodology will be utilized in conjunction with tomographic atom probe analysis on tricrystals with defined triple line crystallography. It is expected that the obtained information can serve as a tool for grain boundary engineering at the nanoscale.

提出了层析原子探针表征和原子力显微镜相结合的方法来测量铜中合金元素在晶界三结线上的偏析及其对三结能的影响。这将通过测量三结处的力平衡来实现，该力平衡是由三结根部邻近晶界凹槽的曲率确定的。建立了相应的理论基础，并用随机三结晶体学对纯铜试样进行了首次测量。该方法将与层析原子探针分析结合使用，并具有定义的三线晶体学。期望获得的信息可以作为纳米尺度晶界工程的工具。

项目成果

Nano-analysis of grain boundary and triple junction transport in nanocrystalline Ni/Cu.

• DOI: 10.1016/j.ultramic.2012.12.002
• 发表时间: 2013-09
• 期刊: Ultramicroscopy
• 影响因子: 2.2
• 作者: Mohammed Reda Chellali;Z. Balogh;G. Schmitz

Embedded-atom study of low-energy equilibrium triple junction structures and energies

• DOI: 10.1016/j.actamat.2016.02.058
• 发表时间: 2016-05-01
• 期刊: ACTA MATERIALIA
• 影响因子: 9.4
• 作者: Eich, S. M.;Schmitz, G.
• 通讯作者: Schmitz, G.

Defect analysis by statistical fitting to 3D atomic maps.

通过统计拟合 3D 原子图进行缺陷分析

• DOI: 10.1016/j.ultramic.2012.12.020
• 发表时间: 2013
• 期刊: Ultramicroscopy
• 影响因子: 2.2
• 作者: Z. Balogh;C. Oberdorfer;M.R. Chellali;P. Stender;S. Nowak;G. Schmitz
• 通讯作者: G. Schmitz

The line tension of grain boundary triple junctions in a Cu-Ni alloy

• DOI: 10.1016/j.matlet.2014.09.048
• 发表时间: 2014-12
• 期刊: Materials Letters
• 影响因子: 3
• 作者: Bingbing Zhao;L. Shvindlerman;G. Gottstein

On the orientation dependence of grain boundary triple line energy in Cu

• DOI: 10.3139/146.111138
• 发表时间: 2014-12
• 期刊: International Journal of Materials Research
• 影响因子: 0.8
• 作者: Bingbing Zhao;L. Shvindlerman;G. Gottstein