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SHF: Medium: ASKS - Architecture Support for darK Silicon

SHF: Medium: ASKS - Architecture Support for darK Silicon
SHF:中:ASKS - 对 darK Silicon 的架构支持
批准号:
1500848
负责人:
Yuan Xie
金额:
$89.64万
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
2014
资助国家:
美国
项目状态:
已结题
起止时间:
2014-08-16 至 2019-07-31

项目摘要

项目成果

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中文摘要
翻译
提议的ask(暗硅架构支持)项目为未来的多核微处理器提供架构支持,这些微处理器采用新兴技术或围绕新兴技术设计,以应对即将到来的暗硅革命的挑战。为了保持历史性能曲线,未来的多核将包含更多的晶体管,而不是所有晶体管同时持续供电。因此,我们面临的前景是?黑硅,?其中有些芯片?元器件必须关闭(变暗)才能留在芯片内?S功率/热预算。在这种情况下确保最佳性能是一项具有挑战性的任务。特别是,在具有不同类型组件(内核、缓存、片上网络(NoC,或片上互连)、内存控制器等)的体系结构中,在功率预算范围内可能存在许多不同的on- dark配置。然而,它们可能表现出显著不同的性能。此外,非核心组件(共享缓存、片上互连、内存架构)的功耗也很大,因此非核心组件在联合性能/功耗/热优化方面发挥着重要作用。因此,需要一种更具包容性的方法。我们的架构设计空间探索将主要集中在非核心空间(共享缓存、片上互连结构、内存架构),目标是未来基于noc的多核微处理器,利用新兴的3D芯片堆叠(3D IC)和非易失性存储器(NVM)技术。这个项目将在两个主要方面推进为暗硅革命做准备的技术水平。1)以非核心组件为重点的跨层整体优化:非核心组件在联合性能/功率/热优化中发挥重要作用。该项目提出了一种集成方法,其中核心和非核心组件协作,在功率和热约束以及动态变化的程序行为和执行参数下最大化性能。2)在新兴技术背景下研究暗硅:新兴的3D集成电路和NVM技术被认为是设计未来多核架构的有前途的方法。采用这些新兴技术对暗硅提出了新的挑战(例如3D堆叠芯片中的热分布加剧),但也为架构创新带来了新的机会,例如新颖的电源管理技术和对存储系统异构性的更大利用。这个项目更广泛的影响包括对未来微处理器性能的提高,即使面对即将到来的暗硅革命。通过与几个行业合作伙伴的密切合作,ppi设想将许多想法直接转移到行业。本项目开发的工具和技术将用于现有课程的教学和新课程的开发,并将通过网络提供给其他教育工作者、研究人员和行业从业者使用。研究成果的传播也将通过会议辅导、小组讨论和讲习班进行。我们将共同努力,让代表性不足的群体和本科生参与这项研究。
英文摘要
The proposed ASKS (Architecture Support for darK Silicon) project proposes architectural support for future many-core microprocessors designed with and around emerging technologies to address the challenges of the coming dark silicon revolution. Future many-cores, to stay on the historical performance curve, will contain more transistors than can all be sustainably powered at the same time. Thus, we face the prospect of ?dark silicon,? wherein some of a chip?s components must be powered-off (darkened) in order to stay within the chip?s power/thermal budget. Ensuring peak performance under these circumstances is a challenging task. In particular, in an architecture with different types of components (cores, caches, network on chip (NoC, or on-chip interconnet), memory controllers, etc.), there can be many different on-dim-dark configurations within the power budget. However, these can exhibit significantly varying performances. Additionally, the power consumption of uncore components (shared caches, on-chip interconnect, memory architecture) is significant, thus the uncore components play an important role in joint performance/power/thermal optimization. Therefore, a more inclusive approach is needed. Our architectural design space exploration will mainly focus on the uncore space (shared caches, on-chip interconnect structures, memory architecture), targeting future NoC-based many-core microprocessors that exploit the emerging technologies of 3D die-stacking (3D IC) and non-volatile memories (NVM). This project will advance the state of the art in preparing for the dark silicon revolution in two main aspects. 1) Cross-layer holistic optimization with a focus on uncore components: The uncore components play important roles in joint performance/power/thermal optimization. This project proposes an integrated approach in which the cores and uncore components collaborate to maximize performance under power and thermal constraints as well as under dynamically changing program behavior and execution parameters. 2) Investigating dark silicon in the context of emerging technologies: Emerging 3D ICs and NVM technologies are envisioned as promising ways to design future many-core architectures. The adoption of such emerging technologies poses new challenges for dark silicon (such as aggravated thermal profiles in 3D stacked chips), but also brings new opportunities for architectural innovations such as novel power management techniques and greater exploitation of memory system heterogeneity. The broader impact of this project includes the contribution to the increased performance for future microprocessors even in the face of the coming dark silicon revolution. Through close collaboration with several industry partners, the PIs envision direct transfer of many ideas to industry. The tools and techniques developed in this project will be used in teaching existing courses and developing new courses, and will be made available through the web for use by other educators, researchers, and industry practitioners. Dissemination of research findings will also be carried out through conference tutorials, panel discussions, and workshops. A concerted effort will be made to involve under-represented groups and undergraduate students in this research.
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