SNM: 3D Nanomanufacturing by Imprint and Strain Engineering (3D NISE)

三维（3D）纳米结构的制造和组装，可以为科学和技术提供重要的新能力，是具有挑战性的，以实现使用现有的工程方法。这个可扩展的纳米制造（SNM）奖旨在利用理论和实验方法来开发和优化具有成本效益的方法，以使用高质量的器件级材料（如硅，化合物半导体或压电陶瓷）创建大量精确图案化和集成的3D纳米结构。压印和应变工程3D纳米制造（3D NISE）是一种新的方法，通过组合方法来图案化和操纵纳米尺度下薄膜的性质，从而实现具有成本效益的纳米制造。 拟议的跨学科研究将通过设计，建模和制造的新课程元素注入课程。该项目将促进本科生和K-12学生的研究经验，并特别努力包括来自代表性不足群体的学生。此外，通过举办研究体验，创建巡回展览，多媒体和与媒体的互动，3D NISE将试图激发先进的纳米制造对更广泛的公众和社会的吸引力。该奖项旨在将联合收割机自上而下的基于印章的平行图案化和转移过程与自下而上的自组装范例结合起来，通过弯曲，弯曲，弯曲和折叠以高度平行和成本有效的方式形成3D纳米结构。该研究旨在将并行平面图案化工艺纳入3D组装工艺;特别是构建材料异质性，以创建功能器件，如晶体管，传感器，模拟，天线，光电和能量收集/存储元件，并研究和优化制造工艺。该项目将利用由设计、力学多尺度建模和模拟驱动的系统方法，使结构能够使用计算机模型创建，以提高精度、可调性和产量。重大的工程和材料的挑战将被克服，以开发这种可重复的制造模式，包括高通量的传输和成型协议，模块对齐，统计设计的实验，理论模型，链接到宏观尺度的纳米级，同时占基础物理在不同的尺度，操纵的粘附力，和缺陷计量的发展。

The manufacture and assembly of three-dimensional (3D) nanostructures which can provide significant new capabilities for science and technology are challenging to achieve using existing engineering methods. This Scalable NanoManufacturing (SNM) award seeks to utilize theoretical and experimental approaches to develop and optimize cost-effective methods to create large numbers of precisely patterned and integrated 3D-nanostructures with high quality device grade materials such as silicon, compound semiconductors or piezeoelectric ceramics. 3D nanomanufacturing by imprint and strain engineering (3D NISE) is a new methodology to enable cost effective nanomanufacturing by combining methods to pattern and manipulate properties in thin films at the nanoscale. The proposed interdisciplinary research will be infused into coursework via new curriculum elements in design, modelling and manufacturing. The project will facilitate research experiences for undergraduate and K-12 students and make a special effort to include students from underrepresented groups. In addition, through hosting research experiences, creating travelling exhibits, multimedia and by interactions with the press, 3D NISE will attempt to excite the appeal of advanced nanomanufacturing to the broader public and society.This award seeks to combine top-down stamp based parallel patterning and transfer processes with bottom-up paradigm of self-assembly via curving, bending, buckling and folding to form 3D nanostructures in a highly parallel and cost-effective manner. The research seeks to incorporate parallel planar patterning processes into 3D assembly processes; build in material heterogeneity specially to create functional devices such as transistors, sensors, analog, antennas, optoelectronic and energy harvesting / storage elements and investigate and optimize the manufacturing process. The project will utilize a systematic approach driven by design, mechanics multiscale modelling and simulations to enable structures to be created using computer models for increased precision, tunability and yield. Significant engineering and material challenges will be overcome to develop this reproducible fabrication paradigm including the development of high-throughput transfer and molding protocols, modules for alignment, statistical design of experiments, theoretical models that link the nanoscale to the macroscale while accounting for the underlying physics at different scales, manipulation of adhesion, and defect metrology.