SNM: 3D Nanomanufacturing by Imprint and Strain Engineering (3D NISE)

三维（3D）纳米结构的制造和组装可以为科学和技术提供重要的新功能，使用现有的工程方法是具有挑战性的。该可扩展纳米制造（SNM）奖旨在利用理论和实验方法开发和优化具有成本效益的方法，以高质量的器件级材料（如硅，化合物半导体或压电陶瓷）创建大量精确图案和集成的3d纳米结构。通过压印和应变工程的3D纳米制造（3D NISE）是一种新的方法，通过结合在纳米尺度上对薄膜进行图案和操纵特性的方法，实现具有成本效益的纳米制造。拟议的跨学科研究将通过设计、建模和制造的新课程元素融入课程作业中。该项目将促进本科生和K-12学生的研究经验，并特别努力包括来自代表性不足群体的学生。此外，通过举办研究体验，创建巡回展览，多媒体和与媒体的互动，3D NISE将试图激发先进纳米制造对更广泛的公众和社会的吸引力。该奖项旨在将自上而下的基于印章的平行图案和转移过程与自下而上的自组装范例结合起来，通过弯曲、弯曲、屈曲和折叠，以高度平行和具有成本效益的方式形成3D纳米结构。该研究旨在将平行平面图案化过程纳入三维装配过程；构建材料异质性，专门用于创建功能器件，如晶体管，传感器，模拟，天线，光电和能量收集/存储元件，并研究和优化制造过程。该项目将采用由设计、力学、多尺度建模和模拟驱动的系统方法，利用计算机模型创建结构，以提高精度、可调性和产量。为了开发这种可重复的制造范式，将克服重大的工程和材料挑战，包括高通量转移和成型协议的开发、对准模块、实验的统计设计、将纳米尺度与宏观尺度联系起来的理论模型，同时考虑不同尺度下的潜在物理、粘合操作和缺陷计量。

The manufacture and assembly of three-dimensional (3D) nanostructures which can provide significant new capabilities for science and technology are challenging to achieve using existing engineering methods. This Scalable NanoManufacturing (SNM) award seeks to utilize theoretical and experimental approaches to develop and optimize cost-effective methods to create large numbers of precisely patterned and integrated 3D-nanostructures with high quality device grade materials such as silicon, compound semiconductors or piezeoelectric ceramics. 3D nanomanufacturing by imprint and strain engineering (3D NISE) is a new methodology to enable cost effective nanomanufacturing by combining methods to pattern and manipulate properties in thin films at the nanoscale. The proposed interdisciplinary research will be infused into coursework via new curriculum elements in design, modelling and manufacturing. The project will facilitate research experiences for undergraduate and K-12 students and make a special effort to include students from underrepresented groups. In addition, through hosting research experiences, creating travelling exhibits, multimedia and by interactions with the press, 3D NISE will attempt to excite the appeal of advanced nanomanufacturing to the broader public and society.This award seeks to combine top-down stamp based parallel patterning and transfer processes with bottom-up paradigm of self-assembly via curving, bending, buckling and folding to form 3D nanostructures in a highly parallel and cost-effective manner. The research seeks to incorporate parallel planar patterning processes into 3D assembly processes; build in material heterogeneity specially to create functional devices such as transistors, sensors, analog, antennas, optoelectronic and energy harvesting / storage elements and investigate and optimize the manufacturing process. The project will utilize a systematic approach driven by design, mechanics multiscale modelling and simulations to enable structures to be created using computer models for increased precision, tunability and yield. Significant engineering and material challenges will be overcome to develop this reproducible fabrication paradigm including the development of high-throughput transfer and molding protocols, modules for alignment, statistical design of experiments, theoretical models that link the nanoscale to the macroscale while accounting for the underlying physics at different scales, manipulation of adhesion, and defect metrology.