SNM: 3D Nanomanufacturing by Imprint and Strain Engineering (3D NISE)

三维(3D)纳米结构的制造和组装能够为科学和技术提供重要的新能力，使用现有的工程方法是具有挑战性的。可伸缩纳米制造奖(SNM)旨在利用理论和实验方法开发和优化具有成本效益的方法，利用硅、化合物半导体或压电陶瓷等高质量设备级材料创建大量精确图案化和集成化的3D纳米结构。基于印记和应变工程的三维纳米制造(3D NISE)是一种新的方法，通过结合各种方法来在纳米尺度上对薄膜进行图案化和操纵性操作，从而实现低成本的纳米制造。拟议的跨学科研究将通过设计、建模和制造方面的新课程元素融入课程工作。该项目将促进本科生和K-12学生的研究体验，并特别努力纳入代表人数不足的群体的学生。此外，3D NISE将通过主持研究体验、创建巡回展览、多媒体以及与媒体的互动，试图激发先进的纳米制造对更广泛的公众和社会的吸引力。该奖项旨在将基于印章的平行图案制作和转移工艺与自下而上的自组装范例相结合，通过弯曲、弯曲、弯曲和折叠以高度平行和具有成本效益的方式形成3D纳米结构。这项研究旨在将平行平面构图工艺融入3D组装工艺；特别构建材料异质性，以创建晶体管、传感器、模拟、天线、光电和能量收集/存储元件等功能器件，并研究和优化制造工艺。该项目将利用由设计、力学、多尺度建模和模拟驱动的系统方法，使结构能够使用计算机模型来创建，以提高精度、可调性和产量。要开发这种可重复制造的范例，将克服重大的工程和材料挑战，包括开发高通量转移和成型协议、对准模块、实验的统计设计、将纳米尺度与宏观尺度联系起来的理论模型，同时考虑不同尺度的潜在物理、附着力的操纵和缺陷计量。

The manufacture and assembly of three-dimensional (3D) nanostructures which can provide significant new capabilities for science and technology are challenging to achieve using existing engineering methods. This Scalable NanoManufacturing (SNM) award seeks to utilize theoretical and experimental approaches to develop and optimize cost-effective methods to create large numbers of precisely patterned and integrated 3D-nanostructures with high quality device grade materials such as silicon, compound semiconductors or piezeoelectric ceramics. 3D nanomanufacturing by imprint and strain engineering (3D NISE) is a new methodology to enable cost effective nanomanufacturing by combining methods to pattern and manipulate properties in thin films at the nanoscale. The proposed interdisciplinary research will be infused into coursework via new curriculum elements in design, modelling and manufacturing. The project will facilitate research experiences for undergraduate and K-12 students and make a special effort to include students from underrepresented groups. In addition, through hosting research experiences, creating travelling exhibits, multimedia and by interactions with the press, 3D NISE will attempt to excite the appeal of advanced nanomanufacturing to the broader public and society.This award seeks to combine top-down stamp based parallel patterning and transfer processes with bottom-up paradigm of self-assembly via curving, bending, buckling and folding to form 3D nanostructures in a highly parallel and cost-effective manner. The research seeks to incorporate parallel planar patterning processes into 3D assembly processes; build in material heterogeneity specially to create functional devices such as transistors, sensors, analog, antennas, optoelectronic and energy harvesting / storage elements and investigate and optimize the manufacturing process. The project will utilize a systematic approach driven by design, mechanics multiscale modelling and simulations to enable structures to be created using computer models for increased precision, tunability and yield. Significant engineering and material challenges will be overcome to develop this reproducible fabrication paradigm including the development of high-throughput transfer and molding protocols, modules for alignment, statistical design of experiments, theoretical models that link the nanoscale to the macroscale while accounting for the underlying physics at different scales, manipulation of adhesion, and defect metrology.