EFRI ACQUIRE: A Scalable Integrated Quantum Photonic Interconnect

摘要标题：EFRI收购：一种可扩展的集成量子光子互连非技术描述：量子信息科学采用量子力学的基本原理进行信息处理，随着过去几十年的发展，现在已经进入了真实的实际应用的工程时代。分布式量子网络实际实现的一个关键挑战在于实现多功能集成量子光子电路的技术困难，这些电路不仅能够执行不同的量子功能，而且还能够在网络系统的不同和/或物理分离的部分之间共享和交换量子信息。拟议的研究旨在通过在碳化硅（SiC）平台上探索和开发集成混合量子光子电路来应对这一挑战，以实现高保真和节能的量子信息处理，该量子光子电路与光纤通信链路无缝对接，以实现量子信息的安全通信和分发。最终目标是实现一个通用的芯片级多功能集成混合量子光子处理器，在室温下具有强大的操作，形成基本的构建块，以构建一个可扩展的集成量子光子互连。拟议中的研究有望为集成量子光子学提供一条变革性的途径，最终可能会改变量子信息处理的复杂性和能力，以实现安全通信、计量、传感和高级计算。这项拟议的研究预计将产生一类新的设备技术，这些技术具有以前无法获得的属性和优点，最终可能对工业部门产生深远的商业影响。SiC光子学的发展可能会为最近成立的美国集成光子学制造研究所（AIM光子学）的路线图开辟一条新的途径。在迷人的设备物理和系统集成的发现将产生非凡的教育材料和灵感的学生从K-12到研究生的教育。 团队PI在扩大代表性不足和经济弱势群体的参与方面建立了良好的记录和持续的创造性努力。PI将把教育工作与AIM Photonics Academy的教育劳动力发展结合起来。技术描述：拟议的研究旨在探索和开发一种完全集成的可扩展量子光子互连，该互连由芯片级集成碳化硅（SiC）量子光子处理器组成，用作本地化量子节点，用于高保真操纵，处理，存储和量子态的转换，其与光纤量子信道无缝接口，用于量子节点之间的量子信息的安全通信和分发。拟议的研究利用了一种设计和制造方法，该方法认识到并利用了SiC出色的材料特性和独特的缺陷特性，以及创新的器件设计和先进的纳米纤维，为广泛的量子光子应用提供了一个有前途的芯片级平台。通过世界领先的专家团队的协同研究，我们计划开展创新的器件/电路/系统工程，以实现强光子-缺陷和光子-光子相互作用，从而实现光子量子态和可扩展量子比特的有效产生和操纵，以及量子信息在光纤通信链路上的芯片到芯片分发，旨在实现在室温下具有鲁棒操作的通用芯片级多功能集成混合量子光子处理器，其形成构建可缩放集成量子光子互连的基本构建块。我们团队的强大专业知识和丰富经验使我们能够实现这一目标。

Abstract Title: EFRI ACQUIRE: A Scalable Integrated Quantum Photonic InterconnectNon-Technical Description: Quantum information science employs the fundamental quantum mechanical principles for information processing, which, with the advances in the past decades, has now come to the engineering era of real practical application. A key challenge for practical implementation of distributed quantum network lies in the technical difficulty in realizing multifunctional integrated quantum photonic circuits that are not only able to perform diverse quantum functionalities, but are also able to share and exchange quantum information between disparate and/or physically separated parts of a network system. The proposed research aims to address this challenge, by exploring and developing integrated hybrid quantum photonic circuits on the silicon carbide (SiC) platform for high-fidelity and energy-efficient quantum information processing, which interface seamlessly with fiber-optic communication links for secure communication and distribution of quantum information. The ultimate goal is to realize a versatile chip-scale multifunctional integrated hybrid quantum photonic processor with robust operation at room temperature that forms the fundamental building blocks to construct a scalable integrated quantum photonic interconnect. The proposed research promises a transformative avenue towards integrated quantum photonics that may ultimately transform the complexity and capacity of quantum information processing for secure communication, metrology, sensing, and advanced computing. The proposed research is expected to result in a new class of device technologies with previously inaccessible attributes and merits that may eventually have profound commercial impact on the industrial sectors. The development of SiC photonics may open up a novel avenue for the roadmap of the recently installed American Institute for Manufacturing Integrated Photonics (AIM Photonics). Findings in the fascinating device physics and system integration will generate extraordinary educational materials and inspiration for education of students from K-12 to graduate students. The team PIs have established strong records and sustained creative efforts in broadening the participation from underrepresented and economically disadvantageous groups. The PIs will incorporate the educational efforts with the educational workforce development of the AIM Photonics Academy.Technical Description: The proposed research aims to explore and develop a fully integrated scalable quantum photonic interconnect that consists of chip-scale integrated silicon carbide (SiC) quantum photonic processors functioning as localized quantum nodes for high-fidelity manipulation, processing, storage, and transduction of quantum states, which interface seamlessly with fiber-optic quantum channels for secure communication and distribution of quantum information between quantum nodes. The proposed research utilizes a design and fabrication methodology that recognizes and leverages the fact that outstanding material properties and unique defect characteristics of SiC, together with innovative device designs and advanced nanofabrication, offer a promising chip-scale platform for broad quantum photonic applications. With the synergetic research effort among a team of world-leading experts, we propose to carry out innovative device/circuit/system engineering to realize strong photon-defect and photon-photon interactions that would enable efficient generation and manipulation of photonic quantum states and scalable quantum bits, and chip-to-chip distribution of quantum information over fiber-optic communication links, aiming to realize a versatile chip-scale multifunctional integrated hybrid quantum photonic processor with robust operation at room temperature that forms the fundamental building blocks to construct a scalable integrated quantum photonic interconnect. The strong expertise and extensive experiences of our team position us uniquely for achieving this goal.