EFRI ACQUIRE: A Scalable Integrated Quantum Photonic Interconnect

摘要题目：EFRI ACQUIRE：一个可扩展的集成量子光子互连非技术描述：量子信息科学采用量子力学的基本原理进行信息处理，随着过去几十年的发展，现在已经进入了真正实际应用的工程时代。分布式量子网络实际实现的一个关键挑战在于实现多功能集成量子光子电路的技术难度，这些电路不仅能够执行各种量子功能，而且还能够在网络系统的不同和/或物理分离的部分之间共享和交换量子信息。提出的研究旨在通过探索和开发碳化硅（SiC）平台上的集成混合量子光子电路来解决这一挑战，用于高保真和节能的量子信息处理，该电路与光纤通信链路无缝接口，用于量子信息的安全通信和分发。最终目标是实现一个在室温下稳定运行的多用途芯片级多功能集成混合量子光子处理器，为构建可扩展集成量子光子互连奠定基础。这项研究为集成量子光子学提供了一条变革性的途径，最终可能会改变量子信息处理的复杂性和能力，用于安全通信、计量、传感和高级计算。拟议的研究预计将产生一类新的设备技术，这些技术具有以前无法获得的属性和优点，最终可能对工业部门产生深远的商业影响。碳化硅光子学的发展可能为最近成立的美国制造集成光子学研究所（AIM photonics）的路线图开辟了一条新的途径。在令人着迷的设备物理和系统集成方面的发现将为从K-12到研究生的学生教育提供非凡的教育材料和灵感。在扩大代表性不足和经济上处于不利地位的群体的参与方面，法律顾问小组建立了良好的记录和持续的创造性努力。这些pi将把教育工作与AIM光子学学院的教育人力发展结合起来。技术描述：提出的研究旨在探索和开发一个完全集成的可扩展量子光子互连，该互连由芯片级集成碳化硅（SiC）量子光子处理器组成，该处理器作为局部量子节点，用于高保真的量子态操作、处理、存储和转导，并与光纤量子通道无缝接口，用于量子节点之间的安全通信和量子信息分发。提出的研究利用了一种设计和制造方法，该方法认识到并利用了SiC突出的材料特性和独特的缺陷特征，以及创新的器件设计和先进的纳米制造，为广泛的量子光子应用提供了一个有前途的芯片级平台。通过与世界领先的专家团队的协同研究，我们建议开展创新的器件/电路/系统工程，以实现强光子-缺陷和光子-光子相互作用，从而实现光子量子态和可扩展量子比特的有效生成和操纵，以及在光纤通信链路上的量子信息芯片到芯片的分布。旨在实现一种可在室温下稳定运行的多用途芯片级多功能集成混合量子光子处理器，为构建可扩展集成量子光子互连奠定基础。我们团队强大的专业知识和丰富的经验使我们在实现这一目标方面具有独特的地位。

Abstract Title: EFRI ACQUIRE: A Scalable Integrated Quantum Photonic InterconnectNon-Technical Description: Quantum information science employs the fundamental quantum mechanical principles for information processing, which, with the advances in the past decades, has now come to the engineering era of real practical application. A key challenge for practical implementation of distributed quantum network lies in the technical difficulty in realizing multifunctional integrated quantum photonic circuits that are not only able to perform diverse quantum functionalities, but are also able to share and exchange quantum information between disparate and/or physically separated parts of a network system. The proposed research aims to address this challenge, by exploring and developing integrated hybrid quantum photonic circuits on the silicon carbide (SiC) platform for high-fidelity and energy-efficient quantum information processing, which interface seamlessly with fiber-optic communication links for secure communication and distribution of quantum information. The ultimate goal is to realize a versatile chip-scale multifunctional integrated hybrid quantum photonic processor with robust operation at room temperature that forms the fundamental building blocks to construct a scalable integrated quantum photonic interconnect. The proposed research promises a transformative avenue towards integrated quantum photonics that may ultimately transform the complexity and capacity of quantum information processing for secure communication, metrology, sensing, and advanced computing. The proposed research is expected to result in a new class of device technologies with previously inaccessible attributes and merits that may eventually have profound commercial impact on the industrial sectors. The development of SiC photonics may open up a novel avenue for the roadmap of the recently installed American Institute for Manufacturing Integrated Photonics (AIM Photonics). Findings in the fascinating device physics and system integration will generate extraordinary educational materials and inspiration for education of students from K-12 to graduate students. The team PIs have established strong records and sustained creative efforts in broadening the participation from underrepresented and economically disadvantageous groups. The PIs will incorporate the educational efforts with the educational workforce development of the AIM Photonics Academy.Technical Description: The proposed research aims to explore and develop a fully integrated scalable quantum photonic interconnect that consists of chip-scale integrated silicon carbide (SiC) quantum photonic processors functioning as localized quantum nodes for high-fidelity manipulation, processing, storage, and transduction of quantum states, which interface seamlessly with fiber-optic quantum channels for secure communication and distribution of quantum information between quantum nodes. The proposed research utilizes a design and fabrication methodology that recognizes and leverages the fact that outstanding material properties and unique defect characteristics of SiC, together with innovative device designs and advanced nanofabrication, offer a promising chip-scale platform for broad quantum photonic applications. With the synergetic research effort among a team of world-leading experts, we propose to carry out innovative device/circuit/system engineering to realize strong photon-defect and photon-photon interactions that would enable efficient generation and manipulation of photonic quantum states and scalable quantum bits, and chip-to-chip distribution of quantum information over fiber-optic communication links, aiming to realize a versatile chip-scale multifunctional integrated hybrid quantum photonic processor with robust operation at room temperature that forms the fundamental building blocks to construct a scalable integrated quantum photonic interconnect. The strong expertise and extensive experiences of our team position us uniquely for achieving this goal.