GOALI: Electrochemistry-based Atomic Layer Etching of Metals for Integrated Circuits

GOALI:基于电化学的集成电路金属原子层蚀刻

基本信息

  • 批准号:
    1661565
  • 负责人:
  • 金额:
    $ 32万
  • 依托单位:
  • 依托单位国家:
    美国
  • 项目类别:
    Standard Grant
  • 财政年份:
    2017
  • 资助国家:
    美国
  • 起止时间:
    2017-06-01 至 2021-05-31
  • 项目状态:
    已结题

项目摘要

Microprocessors and memory devices are central to electronic gadgets used in virtually every aspect of modern life. At the heart of a microprocessor is a complex integrated circuitry, which consists of billions of intricately fabricated nanostructures. Miniaturization of micro-circuit structures and ensuing exponential increase in computing speed and processing power has followed the predictions of "Moore's Law". Such aggressive miniaturization necessitates a paradigm shift from traditional manufacturing approaches to newer nanomanufacturing technologies for atomically precise manipulation, deposition and etching of materials. In spite of numerous efforts, a versatile technology for atomically precise etching that meets the requirements of cost and atomic-level control is presently unavailable. This Grant Opportunity for Academic Liaison with Industry (GOALI) project advances knowledge in scalable, low-cost electrochemical processes with the creation of pathways for tailoring and etching of metals with atomic precision. The project bridges various disciplines in science and engineering, including chemistry, electrochemical engineering, process design, and materials characterization. The research provides educational experiences, industrial traineeships and fellowships to graduate and undergraduate students including students from underrepresented groups. Engagement with industry helps develop a model platform for industry-university collaboration on cutting-edge electrochemical technologies for next generation integrated circuits. To date, much progress has been made in the atomic layer etching of semiconductors. However, atomic layer etching of metals is still in its infancy. Plasma-assisted approaches to etch metals have encountered many technical hurdles including surface contamination by volatile byproducts and lack of atomic-level precision. The project investigates a new liquid-phase electrochemical approach for the atomic layer etching of metals. Through the use of novel self-limiting electrochemical reactions and selective etching chemistries, this research advances knowledge in atomically precise etching of metals such as copper. Fundamental aspects of the chemistry of atomic layer etching are investigated leading to the identification of process parameters for precision etching of integrated circuits. To assess the scale-up potential of the atomic layer etching process, nano-patterned geometries on large area silicon wafers are created with in situ diagnostics and process monitoring and studied. The resulting process could become an enabler of atomically precise manufacturing of structures in future nanoelectronics circuits.
微处理器和存储设备是现代生活中几乎每个方面都使用的电子产品的核心。微处理器的核心是一个复杂的集成电路,它由数十亿个复杂的纳米结构组成。微电路结构的小型化以及随之而来的计算速度和处理能力的指数级增长遵循了“摩尔定律”的预测。这种积极的小型化需要从传统的制造方法到新的纳米制造技术的原子级精确操纵,沉积和蚀刻材料的范式转变。尽管进行了许多努力,但目前还没有一种满足成本和原子级控制要求的用于原子级精确蚀刻的通用技术。这个资助机会学术联络与工业(GOALI)项目推进知识在可扩展的,低成本的电化学过程与创建的途径,定制和蚀刻的金属原子精度。该项目连接了科学和工程领域的各个学科,包括化学、电化学工程、工艺设计和材料表征。这项研究为研究生和本科生,包括来自代表性不足群体的学生提供教育经验、工业培训和奖学金。与工业界的合作有助于为下一代集成电路的尖端电化学技术开发一个产学合作的模型平台。迄今为止,在半导体的原子层蚀刻方面已经取得了很大进展。然而,金属的原子层蚀刻仍处于起步阶段。等离子体辅助蚀刻金属的方法遇到了许多技术障碍,包括挥发性副产物造成的表面污染和缺乏原子级精度。该项目研究了一种新的液相电化学方法,用于金属的原子层蚀刻。通过使用新的自限性电化学反应和选择性蚀刻化学,这项研究在原子级精确蚀刻铜等金属方面取得了进展。原子层蚀刻的化学的基本方面进行了调查,导致识别的工艺参数,精密蚀刻集成电路。为了评估原子层蚀刻工艺的放大潜力,在大面积硅晶片上创建纳米图案化几何形状,并进行原位诊断和工艺监测和研究。由此产生的过程可能成为未来纳米电子电路中原子级精确制造结构的推动者。

项目成果

期刊论文数量(3)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)
Communication—Electrochemical Atomic Layer Etching of Copper
通信 – 铜的电化学原子层蚀刻
  • DOI:
    10.1149/2.0901807jes
  • 发表时间:
    2018
  • 期刊:
  • 影响因子:
    3.9
  • 作者:
    Gong, Yukun;Venkatraman, Kailash;Akolkar, Rohan
  • 通讯作者:
    Akolkar, Rohan
Thermodynamic Considerations in the Design of Electrochemical Atomic Layer Etching of Copper
铜电化学原子层蚀刻设计中的热力学考虑
Electrochemical Atomic Layer Etching of Ruthenium
钌的电化学原子层蚀刻
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Rohan Akolkar其他文献

次世代型1,3ポリオール合成法の確立に向けた触媒的不斉多重アルドール反応の開発
催化不对称多重醛醇缩合反应的发展,建立下一代1,3多元醇合成方法
  • DOI:
  • 发表时间:
    2015
  • 期刊:
  • 影响因子:
    0
  • 作者:
    林太郎;Rohan Akolkar;横井昌幸;岡本尚樹;齊藤丈靖;近藤和夫;三ツ沼 治信, 林 禄清, 山本 久美子, 井田 貴志, 松永 茂樹, 金井 求
  • 通讯作者:
    三ツ沼 治信, 林 禄清, 山本 久美子, 井田 貴志, 松永 茂樹, 金井 求
Modeling of the Current Distribution in Aluminum Anodization
  • DOI:
    10.1023/b:jach.0000035611.87036.36
  • 发表时间:
    2004-08-01
  • 期刊:
  • 影响因子:
    3.000
  • 作者:
    Rohan Akolkar;Uziel Landau;Harry Kuo;Yar-Ming Wang
  • 通讯作者:
    Yar-Ming Wang
めっき中に生成されるビア/スルーホール内部のCu+濃度分布シミュレーション
模拟电镀过程中产生的通孔/通孔内的 Cu+ 浓度分布
  • DOI:
  • 发表时间:
    2014
  • 期刊:
  • 影响因子:
    0
  • 作者:
    林太郎;Rohan Akolkar;横井昌幸;岡本尚樹;齊藤丈靖;近藤和夫;三ツ沼 治信, 林 禄清, 山本 久美子, 井田 貴志, 松永 茂樹, 金井 求;林 太郎
  • 通讯作者:
    林 太郎
Possibility to enhance teraherz emission from intrinsic Josephson junction by external local heating
通过外部局部加热增强本征约瑟夫森结的太赫兹发射的可能性
  • DOI:
    10.1088/1742-6596/507/4/042002
  • 发表时间:
    2014
  • 期刊:
  • 影响因子:
    0
  • 作者:
    林太郎;Rohan Akolkar;横井昌幸;岡本尚樹;齊藤丈靖;近藤和夫;三ツ沼 治信, 林 禄清, 山本 久美子, 井田 貴志, 松永 茂樹, 金井 求;林 太郎;林 太郎;林 太郎;林 太郎;林 太郎;林 太郎;林太郎;林太郎;林太郎;林太郎;Hidehiro Asai and Shiro Kawabata
  • 通讯作者:
    Hidehiro Asai and Shiro Kawabata
Electrochemical characterization of micro-cracks in polyurethane resin films deposited on metallic surfaces
  • DOI:
    10.1007/s10800-016-1005-6
  • 发表时间:
    2016-10-01
  • 期刊:
  • 影响因子:
    3.000
  • 作者:
    Karun K. Rao;Molly Ferguson;Kyle Murphy;Jean Zhao;Daniel Lacks;Rohan Akolkar
  • 通讯作者:
    Rohan Akolkar

Rohan Akolkar的其他文献

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{{ truncateString('Rohan Akolkar', 18)}}的其他基金

GOALI: An Electrochemical Atomic Layer Deposition Process for Scalable Nanomanufacturing of On-chip Copper-based Interconnects
GOALI:用于可扩展纳米制造片上铜基互连的电化学原子层沉积工艺
  • 批准号:
    1461557
  • 财政年份:
    2015
  • 资助金额:
    $ 32万
  • 项目类别:
    Standard Grant

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Development of new electrochemistry based on synthesis of hydroxide ion conductive ionic liquids
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  • 批准号:
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Nanomaterials based on solid-state electrochemistry
基于固态电化学的纳米材料
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    17H03048
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    2017
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    $ 32万
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    Grant-in-Aid for Scientific Research (B)
A new alloy design concept for high-corrosion resistant steels based on micro-electrochemistry of local dissolution and repassivation
基于局部溶解和再钝化微电化学的高耐腐蚀钢新合金设计理念
  • 批准号:
    17H01331
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    2017
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    $ 32万
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Development of bio-cell and food / environment analyzer for teaching materials based on electrochemistry and science education using those devices
使用这些设备开发基于电化学和科学教育教材的生物细胞和食品/环境分析仪
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    2016
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    Grant-in-Aid for Scientific Research (C)
INTRACELLULAR ELECTROCHEMISTRY WITH CARBON NANOTUBE-BASED SENSORS
基于碳纳米管的传感器的细胞内电化学
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