Collaborative Research: Wafer-Scale, Defect-Free Assembly of Three-Dimensional Plasmonic Nanoarchitectures

合作研究:晶圆级、三维等离子体纳米结构的无缺陷组装

基本信息

  • 批准号:
    1928788
  • 负责人:
  • 金额:
    $ 27.33万
  • 依托单位:
  • 依托单位国家:
    美国
  • 项目类别:
    Standard Grant
  • 财政年份:
    2019
  • 资助国家:
    美国
  • 起止时间:
    2019-09-01 至 2023-08-31
  • 项目状态:
    已结题

项目摘要

This grant supports research that contributes fundamental new knowledge in the manufacturing of three-dimensional functional nanoarchitectures with applications in light manipulation, thus promoting basic science and technology in the fields of plasmonics and advanced manufacturing. Guided manipulation of light through periodic patterns of three-dimensional plasmonic nanoarchitectures provides remarkable opportunities to harness light in a way that cannot be obtained with conventional optics. However, its practical implementation remains challenged by the low-yield, time-consuming, and limited scalability of conventional fabrication processes that largely rely on the use of nanolithography. This research studies a new nanomanufacturing process based on three-dimensional nanoassembly to fabricate the plasmonic nanoarchitectures. The integration of three-dimensional nanoarchitectures with diverse substrates is increasingly preferred for broad applications in imagers, sensors and lasers, which greatly benefits the U.S. economy and society. The project is multidisciplinary and involves mechanics, optics and advanced nanomanufacturing. It provides excellent educational opportunities for undergraduate and graduate students and fosters interest in science and engineering in women and under-represented minority groups. The fabrication of three-dimensional (3D) plasmonic nanoarchitectures largely relies upon the utilization of conventional nanolithography techniques that involve the use of either electron-beam, focused ion-beam, or beam interference. However, significant challenges exist in adopting these conventional techniques for diverse substrates including flexible or curved surfaces, especially, since they are principally designed to form nanopatterns on the flat surface of radiation-sensitive materials with the assistance of thermal or chemical post-treatments. This research is to develop a new nanomanufacturing technique that achieves deterministic assembly of 3D plasmonic nanoarchitectures on suitable receiver substrates in a way that allows the donor wafer to be reused for cost-savings. The process involves the use of water under ambient conditions without additional need of chemical, thermal or mechanical treatments, thereby substantially extending the type of receiver substrate to arbitrary materials. The collaborative research involves experiments to elucidate critical controlling parameters and underpinning solid-liquid interactions supported by multiscale/multiphysics computation modelling to predict manufacturing process parameters and their control with integration of atomistic simulation. The 3D plasmonic nanoarchitectures are integrated with hybrid pixel imagers to demonstrate the enhancement of their detection functionalities.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.
该补助金支持在光操纵应用中制造三维功能纳米结构方面贡献基础新知识的研究,从而促进等离子体和先进制造领域的基础科学和技术。通过三维等离子体纳米结构的周期性图案对光的引导操纵提供了以传统光学无法获得的方式利用光的显著机会。然而,它的实际实施仍然受到传统制造工艺的低产率,耗时和有限的可扩展性的挑战,这些工艺在很大程度上依赖于纳米光刻的使用。本研究以三维纳米组装技术为基础,探讨一种新的奈米制造制程,以制造电浆子奈米架构。三维纳米结构与不同衬底的集成越来越多地被用于成像器、传感器和激光器的广泛应用,这极大地造福于美国经济和社会。该项目是多学科的,涉及机械,光学和先进的纳米制造。它为本科生和研究生提供了极好的教育机会,并培养了妇女和代表性不足的少数群体对科学和工程的兴趣。三维(3D)等离子体纳米结构的制造很大程度上依赖于常规纳米光刻技术的利用,所述常规纳米光刻技术涉及使用电子束、聚焦离子束或束干涉。然而,在采用这些常规技术用于包括柔性或弯曲表面的各种衬底时存在重大挑战,特别是因为它们主要被设计成在热或化学后处理的辅助下在辐射敏感材料的平坦表面上形成纳米粒子。这项研究旨在开发一种新的纳米制造技术,该技术可以在合适的接收器衬底上实现3D等离子体纳米结构的确定性组装,从而允许供体晶片重复使用以节省成本。该方法涉及在环境条件下使用水,而不需要额外的化学、热或机械处理,从而基本上将接收器基底的类型扩展到任意材料。合作研究涉及实验,以阐明关键控制参数和支持多尺度/多物理场计算建模支持的固液相互作用,以预测制造工艺参数及其控制,并集成原子模拟。3D等离子体纳米架构与混合像素成像器集成,以展示其检测功能的增强。该奖项反映了NSF的法定使命,并通过使用基金会的知识价值和更广泛的影响审查标准进行评估,被认为值得支持。

项目成果

期刊论文数量(8)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)
Material assembly by droplet drying: From mechanics theories to applications
  • DOI:
    10.1002/dro2.76
  • 发表时间:
    2023-08
  • 期刊:
  • 影响因子:
    0
  • 作者:
    Ziyu Chen;Kangyi Peng;Baoxing Xu
  • 通讯作者:
    Ziyu Chen;Kangyi Peng;Baoxing Xu
Electro-chemo-mechanics theory in transfer printing of thin films in electrolyte solutions
A perspective on intelligent design of engineered materials and structures by interface mechanics
  • DOI:
    10.1016/j.mechrescom.2021.103668
  • 发表时间:
    2022-01-20
  • 期刊:
  • 影响因子:
    2.4
  • 作者:
    Xu, Baoxing
  • 通讯作者:
    Xu, Baoxing
{{ item.title }}
{{ item.translation_title }}
  • DOI:
    {{ item.doi }}
  • 发表时间:
    {{ item.publish_year }}
  • 期刊:
  • 影响因子:
    {{ item.factor }}
  • 作者:
    {{ item.authors }}
  • 通讯作者:
    {{ item.author }}

数据更新时间:{{ journalArticles.updateTime }}

{{ item.title }}
  • 作者:
    {{ item.author }}

数据更新时间:{{ monograph.updateTime }}

{{ item.title }}
  • 作者:
    {{ item.author }}

数据更新时间:{{ sciAawards.updateTime }}

{{ item.title }}
  • 作者:
    {{ item.author }}

数据更新时间:{{ conferencePapers.updateTime }}

{{ item.title }}
  • 作者:
    {{ item.author }}

数据更新时间:{{ patent.updateTime }}

Baoxing Xu其他文献

An indentation fatigue depth propagation law
压痕疲劳深度传播定律
  • DOI:
    10.1016/j.scriptamat.2009.01.027
  • 发表时间:
    2009
  • 期刊:
  • 影响因子:
    6
  • 作者:
    Baoxing Xu;Z. Yue;Xi Chen
  • 通讯作者:
    Xi Chen
Printable and Highly Stretchable Viscoelastic Conductors with Kinematically Reconstructed Conductive Pathways
具有运动学重建导电路径的可印刷和高拉伸粘弹性导体
  • DOI:
    10.1002/adma.202202418
  • 发表时间:
    2022-05
  • 期刊:
  • 影响因子:
    29.4
  • 作者:
    Tao Wang;Qingchang Liu;Haitao Liu;Baoxing Xu;Hangxun Xu
  • 通讯作者:
    Hangxun Xu
Microneedle Patches: 3D Printed Microheater Sensor‐Integrated, Drug‐Encapsulated Microneedle Patch System for Pain Management (Adv. Healthcare Mater. 23/2019)
微针贴片:用于疼痛管理的 3D 打印微加热器传感器集成、药物封装微针贴片系统(Adv. Healthcare Mater. 23/2019)
  • DOI:
    10.1002/adhm.201970093
  • 发表时间:
    2019
  • 期刊:
  • 影响因子:
    10
  • 作者:
    Mengtian Yin;Li Xiao;Qingchang Liu;Sung;Yi Zhang;Poonam R Sharma;Li Jin;X. Li;Baoxing Xu
  • 通讯作者:
    Baoxing Xu
Liquid-Evaporation-Assisted Self-Folding of One-Dimensional Nanomaterials
一维纳米材料的液体蒸发辅助自折叠
  • DOI:
  • 发表时间:
    2018
  • 期刊:
  • 影响因子:
    0
  • 作者:
    Qingchang Liu;Baoxing Xu
  • 通讯作者:
    Baoxing Xu
Infectious hematopoietic necrosis virus (IHNV) nucleoprotein amino acid residues affect viral virulence and immunogenicity in rainbow trout (emOncorhynchus mykiss/em)
传染性造血坏死病毒(IHNV)核蛋白氨基酸残基影响虹鳟(Oncorhynchus mykiss)的病毒毒力和免疫原性
  • DOI:
    10.1016/j.fsi.2022.08.028
  • 发表时间:
    2022-11-01
  • 期刊:
  • 影响因子:
    3.900
  • 作者:
    Jiahui Li;Dong Xia;Mengmeng Zhang;Yanru Zhang;Xuefei Liu;Jinhui Sun;Baoxing Xu;Jiawei Yang;Na Wang;Wen Shi;Xueting Guan;Min Liu
  • 通讯作者:
    Min Liu

Baoxing Xu的其他文献

{{ item.title }}
{{ item.translation_title }}
  • DOI:
    {{ item.doi }}
  • 发表时间:
    {{ item.publish_year }}
  • 期刊:
  • 影响因子:
    {{ item.factor }}
  • 作者:
    {{ item.authors }}
  • 通讯作者:
    {{ item.author }}

{{ truncateString('Baoxing Xu', 18)}}的其他基金

Collaborative Research: Nanofluidics Enabled Attenuation of Dynamic Impacts and Stress Waves
合作研究:纳米流体能够减弱动态冲击和应力波
  • 批准号:
    1805451
  • 财政年份:
    2018
  • 资助金额:
    $ 27.33万
  • 项目类别:
    Standard Grant
Chemomechanics of Thin Film Detachment in Liquid-Assisted Transfer Printing
液体辅助转移印刷中薄膜分离的化学力学
  • 批准号:
    1728149
  • 财政年份:
    2017
  • 资助金额:
    $ 27.33万
  • 项目类别:
    Standard Grant

相似国自然基金

Research on Quantum Field Theory without a Lagrangian Description
  • 批准号:
    24ZR1403900
  • 批准年份:
    2024
  • 资助金额:
    0.0 万元
  • 项目类别:
    省市级项目
Cell Research
  • 批准号:
    31224802
  • 批准年份:
    2012
  • 资助金额:
    24.0 万元
  • 项目类别:
    专项基金项目
Cell Research
  • 批准号:
    31024804
  • 批准年份:
    2010
  • 资助金额:
    24.0 万元
  • 项目类别:
    专项基金项目
Cell Research (细胞研究)
  • 批准号:
    30824808
  • 批准年份:
    2008
  • 资助金额:
    24.0 万元
  • 项目类别:
    专项基金项目
Research on the Rapid Growth Mechanism of KDP Crystal
  • 批准号:
    10774081
  • 批准年份:
    2007
  • 资助金额:
    45.0 万元
  • 项目类别:
    面上项目

相似海外基金

Collaborative Research: Data-Driven Metrology and Inspection Technology for Semiconductor Wafer-Level Manufacturing
合作研究:用于半导体晶圆级制造的数据驱动计量和检测技术
  • 批准号:
    2124999
  • 财政年份:
    2021
  • 资助金额:
    $ 27.33万
  • 项目类别:
    Standard Grant
Collaborative Research: Data-Driven Metrology and Inspection Technology for Semiconductor Wafer-Level Manufacturing
合作研究:用于半导体晶圆级制造的数据驱动计量和检测技术
  • 批准号:
    2125826
  • 财政年份:
    2021
  • 资助金额:
    $ 27.33万
  • 项目类别:
    Standard Grant
Collaborative Research: Wafer-Scale, Defect-Free Assembly of Three-Dimensional Plasmonic Nanoarchitectures
合作研究:晶圆级、三维等离子体纳米结构的无缺陷组装
  • 批准号:
    1928784
  • 财政年份:
    2019
  • 资助金额:
    $ 27.33万
  • 项目类别:
    Standard Grant
Collaborative Research: Wafer-Scale Nanomanufacturing of 2D Atomic Layer Material Heterostructures Through Exfoliation and Transfer
合作研究:通过剥离和转移进行二维原子层材料异质结构的晶圆级纳米制造
  • 批准号:
    1825731
  • 财政年份:
    2018
  • 资助金额:
    $ 27.33万
  • 项目类别:
    Standard Grant
Collaborative Research: Wafer-Scale Nanomanufacturing of 2D Atomic Layer Material Heterostructures Through Exfoliation and Transfer
合作研究:通过剥离和转移进行二维原子层材料异质结构的晶圆级纳米制造
  • 批准号:
    1825256
  • 财政年份:
    2018
  • 资助金额:
    $ 27.33万
  • 项目类别:
    Standard Grant
MRI: Acquisition of Precision Wafer Aligner and Bonder for Research, Education, and Training in 3-D Micro- and Nano- Mechanical, Electrical and Optical Systems
MRI:采购精密晶圆对准器和键合机,用于 3D 微纳米机械、电气和光学系统的研究、教育和培训
  • 批准号:
    1126077
  • 财政年份:
    2011
  • 资助金额:
    $ 27.33万
  • 项目类别:
    Standard Grant
BRIGE: Research and Education on Mechanical Behavior of Wafer-Level Films in Integrated Systems
BRIGE:集成系统中晶圆级薄膜机械行为的研究和教育
  • 批准号:
    1032630
  • 财政年份:
    2010
  • 资助金额:
    $ 27.33万
  • 项目类别:
    Standard Grant
Research on Chemo-Mechanical Grinding Process for Extremely-thin Si Wafer Used in Next Generation Power Devices
下一代功率器件用极薄硅片化学机械研磨工艺研究
  • 批准号:
    16360061
  • 财政年份:
    2004
  • 资助金额:
    $ 27.33万
  • 项目类别:
    Grant-in-Aid for Scientific Research (B)
CAREER: Fundamental Research on Silicon Wafer Fine Grinding to Foster a Quantum Leap in Manufacturing of Silicon Wafers
事业:硅片精磨基础研究,促进硅片制造的飞跃
  • 批准号:
    0348290
  • 财政年份:
    2004
  • 资助金额:
    $ 27.33万
  • 项目类别:
    Standard Grant
US-Germany Cooperative Research: Development of Silicon-on-Diamond Wafer Technology
美德合作研究:金刚石硅片技术开发
  • 批准号:
    0340662
  • 财政年份:
    2004
  • 资助金额:
    $ 27.33万
  • 项目类别:
    Standard Grant
{{ showInfoDetail.title }}

作者:{{ showInfoDetail.author }}

知道了