SaTC: EDU: Collaborative: An Educational Initiative on Cybersecurity in Additive Manufacturing

SaTC：EDU：协作：增材制造网络安全教育计划

• 批准号: 1932185
• 负责人: Xiangdong Li
• 金额: $ 3.6万
• 依托单位: CUNY New York City College of Technology
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2019
• 资助国家: 美国
• 起止时间: 2019-10-01 至 2022-09-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1932185&HistoricalAwards=false
• 关键词: SaTC; EDU; Collaborative; Educational; Initiative

Additive manufacturing (AM), widely known as 3D printing, is the process of making three dimensional objects from a digital file. AM is enabling product innovation in a wide range of fields including automobiles, aircraft, spacecraft, toys, consumer products, food and medical implants and devices. A 3D printer is now located on the International Space Station to print parts on demand. Such high-value parts are designed by making extensive use of design, simulation and analysis tools, including high-performance computing, and make use of cloud-based resources throughout the process chain. In this project, New York University (NYU) is partnering with New York City College of Technology (City Tech) to educate students and to engage a wide range of stakeholders as the project builds capacity in the emerging field of AM security. The project will first develop an introductory graduate level course on AM security to be taught at both schools. This course will be part of a new Master of Science program and a new certificate program, both in AM. An on-line version of the course will also be offered. Complementing the course, the project will organize the HACK3D hackathon to build the security mindset of students for approaching digital manufacturing. In addition, the project will start an annual workshop and undergraduate summer research program in innovative research on the cybersecurity of digital manufacturing.The educational framework in this project will be first of its kind to address the security challenge in AM field by a collaborative team of a mechanical engineer and a computer science cybersecurity expert. The NYU team has pioneered the AM attack taxonomy and design-based security scheme that are the core areas of this project. The security scheme requires a collaborative approach because innovative design features are embedded in the 3D solid models and extensively tested for possible breaches according to the proposed taxonomy of threats. The interdisciplinary framework by this project enables the creation of a cross-disciplinary course on cybersecurity in AM. The associated educational and continuing resources will prepare many undergraduates and graduate students as well as working professionals in cybersecurity in AM.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

增材制造（AM），广泛称为3D打印，是从数字文件制作三维物体的过程。 AM正在广泛的领域实现产品创新，包括汽车，飞机，航天器，玩具，消费品，食品和医疗植入物和设备。现在，国际空间站上有一台3D打印机，可以按需打印零件。这些高价值的零件是通过广泛使用设计、仿真和分析工具（包括高性能计算）来设计的，并在整个工艺链中利用基于云的资源。在这个项目中，纽约大学（NYU）与纽约市理工学院（City Tech）合作，教育学生并吸引广泛的利益相关者，因为该项目在新兴的AM安全领域建立能力。该项目将首先开发一个介绍性的研究生水平的课程上午安全将在两所学校教授。本课程将成为新的理学硕士课程和新的证书课程的一部分，均为上午课程。还将提供在线版课程。作为课程的补充，该项目将组织HACK3D黑客培训，以建立学生接近数字制造的安全思维。此外，该项目还将启动年度研讨会和本科生暑期研究计划，对数字制造的网络安全进行创新研究。该项目的教育框架将是由机械工程师和计算机科学网络安全专家组成的合作团队首次解决AM领域的安全挑战。纽约大学团队率先提出了AM攻击分类法和基于设计的安全方案，这是该项目的核心领域。该安全方案需要一种协作方法，因为创新的设计功能嵌入在三维实体模型中，并根据拟议的威胁分类法对可能的漏洞进行了广泛的测试。该项目的跨学科框架使得能够在AM中创建跨学科的网络安全课程。相关的教育和持续资源将为许多本科生和研究生以及AM网络安全专业人员做好准备。该奖项反映了NSF的法定使命，并被认为值得通过使用基金会的智力价值和更广泛的影响审查标准进行评估来支持。