PFI-TT: A chip-scale laser sensing module for precision navigation and metrology
PFI-TT: A chip-scale laser sensing module for precision navigation and metrology
批准号:
2016561
负责人:
Chee Wei Wong
金额:
$25.0万
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
2020
资助国家:
美国
项目状态:
已结题
起止时间:
2020-08-15 至 2023-07-31
中文摘要
该创新技术转化伙伴关系(PFI-TT)项目的更广泛影响/商业潜力是开发高精度、芯片级激光测距模块,作为感知堆栈中的关键传感模式。该工具将为自动驾驶汽车、机器人平台和其他需要高精度环境和周围环境知识的应用提供新的技术和传感能力。光探测和测距(LiDAR)是通过测量光的飞行时间来实现距离测距和计量的核心元件。最近,已经有大量的努力来构建模块化激光雷达单元。目前大多数最先进的激光雷达传感器都是基于机械旋转激光阵列或大块固体激光单元,这些激光单元体积大、重量重、成本高、功耗大。最近,加州大学洛杉矶分校的研究小组展示了一个芯片级的激光雷达架构,该架构基于光子学和硅电子-光子集成,在一个紧凑的模块中。芯片级电子-光子系统具有先进的高数据采集速率和高分辨率的外部环境感知。该团队将进一步开发和实施他们的商业化战略,与技术商业化导师和早期行业合作伙伴合作。该项目研究了一种新的芯片级激光雷达架构,该架构具有脉冲相干、分段、飞行时间测量,以实现高分辨率和高采样率。提出的研究目标是实现外部环境的3D点云传感,其范围侧重于展示可扩展的核心组件、封装和功能原型。在方法方面,所提出的光子源基于独特的芯片级激光元件,读出基于硅CMOS技术电路。该团队将共同优化光子和电子元件规格,以实现高分辨率和高采样率的演示。将对探测器噪声和激光稳定性进行检查和演示,并辅以技术评估和降低风险的方法。该PFI项目旨在将目前的实验室演示转化为商业传感原型,与最终用户和制造合作伙伴代工合作,实现芯片级精密导航和计量。该奖项反映了美国国家科学基金会的法定使命,并通过使用基金会的知识价值和更广泛的影响审查标准进行评估,被认为值得支持。
英文摘要
The broader impact/commercial potential of this Partnerships for Innovation - Technology Translation (PFI-TT) project is the development of a high-precision, chip-scale, laser ranging module, as a key sensing modality in the perception stack. This tool will enable new technological endeavors and sensing capabilities in autonomous vehicles, robotic platforms and other applications requiring high precision knowledge of the environment and surroundings. Light detection and ranging (LiDAR) is a core element for distance ranging and metrology by measuring the light time-of-flight. Recently there have been substantial efforts to build modular LiDAR units. Most current state-of-the-art LiDAR sensors are based on mechanical rotating laser arrays or bulk solid-state laser units that are large, heavy, costly and consume large amounts of power. Recently the UCLA team has demonstrated a chip-scale LiDAR architecture, based on photonics and silicon electronic-photonic integration, in a compact module. The chip-scale electronic-photonic system has state-of-the-art high data acquisition rates and high resolution in sensing the external environment. The team will further develop and implement their commercialization strategy, working with a technology commercialization mentor and early-stage industry partners. The proposed project examines a new chip-scale LiDAR architecture of pulsed-coherent, segmented, time-of-flight measurement to achieve the high-resolution and high sampling rate. The goal of the proposed research is to achieve a 3D point cloud sensing of the external environment, with scope focused on demonstrating the scalable core components, packaging, and functional prototype. In terms of methodology, the proposed photonics source is based on the unique chip-scale laser element, and readout based on a silicon CMOS technology circuits. The team will co-optimize the photonic and electronic component specifications to achieve a high resolution and high sampling rate demonstration. Detector noise and laser stability will be examined and demonstrated, supported with a technology assessment and risk mitigation approach. This PFI project is aimed at translating the current laboratory demonstration into a commercial sensing prototype, working with end-users and a manufacturing partner foundry towards chip-scale precision navigation and metrology.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.
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