I-Corps: Power Single-Layer Integration with Component Embedding for Wearable and Internet of Things (IoT) Electronics

I-Corps：为可穿戴和物联网 (IoT) 电子产品提供具有组件嵌入的单层集成电源

• 批准号: 2131701
• 负责人: Markondeya Raj Pulugurtha
• 金额: $ 5万
• 依托单位: Florida International University
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2021
• 资助国家: 美国
• 起止时间: 2021-06-01 至 2022-11-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=2131701&HistoricalAwards=false
• 关键词: Corps; Power; Single; Layer; Integration

The broader impact/commercial potential of this I-Corps project is the development of next-generation power delivery products for the wearable, Internet of Things (IoT), and portable electronics markets. The proposed manufacturing path may generate opportunities at all levels of the electronics supply chain as the technology is agnostic to the power delivery mode, extensibility to other system components, heterogeneous component integration, and compatibility with emerging chiplet packaging. Both supply chain (analog chip, passive component, and multiferroic component manufacturers) and end-users may benefit from the proposed technology by creating optimal building blocks with agile designs. The proposed technology may provide low-cost components with the required power densities, size, thickness and system interfaces that may be purchased by various end-users in healthcare, safety, and security. This I-Corps project is based on the development of power delivery subsystems with embedded power telemetry units, rectification, and storage in a single thin flex package. Such packages are proposed to be manufactured using low-cost, flex-embedding technologies. The proposed technology may transform biomedical electronic systems from their current 2D assembled architectures with pre-packaged devices to thin embedded modules. The underlying technology is based on a power telemetry approach with multiferroics to provide much higher power densities through external magnetic fields and embedded packaging of multiferroic power telemetry with capacitive storage and thin diodes. The power modules may be customized to different functions based on the required performance, physiological, and design constraints. Since future components are expected to be thinned and diced to chiplets of less than 100 micron thickness, this approach transforms wafers to systems with the least disruption to the supply chain where device manufacturers can directly adapt their devices to subsystems. This low-cost manufacturing path may enable high-volume production of power modules, bringing the best combination of multiferroic telemetry with rectification and storage. In addition, the modularity will allow easy extensibility to incorporate building-block component technologies.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

这个I-Corps项目更广泛的影响/商业潜力是为可穿戴设备、物联网（IoT）和便携式电子产品市场开发下一代电力输送产品。 所提出的制造路径可以在电子供应链的所有级别产生机会，因为该技术对功率输送模式、对其他系统组件的可扩展性、异构组件集成以及与新兴的小芯片封装的兼容性是不可知的。 供应链（模拟芯片，无源元件和多铁性元件制造商）和最终用户都可以通过创建具有敏捷设计的最佳构建模块来受益于所提出的技术。所提出的技术可以提供具有所需功率密度、尺寸、厚度和系统接口的低成本组件，其可以由医疗保健、安全和安保方面的各种终端用户购买。 这个I-Corps项目是基于电力输送子系统的开发，该子系统在单个薄柔性封装中具有嵌入式电力遥测单元、整流和存储。这种封装被提议使用低成本的柔性嵌入技术来制造。所提出的技术可以将生物医学电子系统从其当前的具有预封装器件的2D组装架构转变为薄的嵌入式模块。基础技术基于具有多铁性的功率遥测方法，以通过外部磁场和具有电容存储和薄二极管的多铁性功率遥测的嵌入式封装来提供更高的功率密度。 功率模块可以基于所需的性能、生理和设计约束来定制为不同的功能。由于未来的组件预计将被减薄并切割成厚度小于100微米的小芯片，因此这种方法将晶圆转换为对供应链干扰最小的系统，其中设备制造商可以直接将其设备适配到子系统。 这种低成本的制造途径可以实现功率模块的大批量生产，带来多铁遥测与整流和存储的最佳组合。此外，模块化将允许轻松扩展，以纳入构建块组件技术。该奖项反映了NSF的法定使命，并已被认为是值得通过使用基金会的智力价值和更广泛的影响审查标准进行评估的支持。