I-Corps: Power Single-Layer Integration with Component Embedding for Wearable and Internet of Things (IoT) Electronics

I-Corps项目的更广泛影响/商业潜力是为可穿戴设备、物联网（IoT）和便携式电子市场开发下一代电力输送产品。所提出的制造路径可能会在电子供应链的各个层面产生机会，因为该技术与电源传输模式无关，可扩展到其他系统组件，异构组件集成以及与新兴芯片封装的兼容性。供应链（模拟芯片、无源元件和多铁性元件制造商）和最终用户都可以通过创建具有敏捷设计的最佳构建块从所建议的技术中受益。所提议的技术可以提供具有所需功率密度、尺寸、厚度和系统接口的低成本组件，这些组件可以由医疗保健、安全和安保领域的各种最终用户购买。I-Corps项目的基础是在一个单薄柔性封装中开发具有嵌入式电力遥测单元、整流和存储的电力传输子系统。这种封装被提议使用低成本的柔性嵌入技术来制造。所提出的技术可能会将生物医学电子系统从目前带有预封装设备的2D组装架构转变为薄嵌入式模块。基础技术是基于多铁性功率遥测方法，通过外部磁场和电容存储和薄二极管的多铁性功率遥测的嵌入式封装提供更高的功率密度。电源模块可以根据不同的性能要求、生理要求和设计要求定制不同的功能。由于未来的组件预计将被减薄并切割成厚度小于100微米的芯片，因此这种方法将晶圆转换为对供应链干扰最小的系统，设备制造商可以直接将其设备适应子系统。这种低成本的制造路径可以实现功率模块的大批量生产，将多铁遥测与整流和存储相结合。此外，模块化将允许轻松扩展，以合并构建块组件技术。该奖项反映了美国国家科学基金会的法定使命，并通过使用基金会的知识价值和更广泛的影响审查标准进行评估，被认为值得支持。

The broader impact/commercial potential of this I-Corps project is the development of next-generation power delivery products for the wearable, Internet of Things (IoT), and portable electronics markets. The proposed manufacturing path may generate opportunities at all levels of the electronics supply chain as the technology is agnostic to the power delivery mode, extensibility to other system components, heterogeneous component integration, and compatibility with emerging chiplet packaging. Both supply chain (analog chip, passive component, and multiferroic component manufacturers) and end-users may benefit from the proposed technology by creating optimal building blocks with agile designs. The proposed technology may provide low-cost components with the required power densities, size, thickness and system interfaces that may be purchased by various end-users in healthcare, safety, and security. This I-Corps project is based on the development of power delivery subsystems with embedded power telemetry units, rectification, and storage in a single thin flex package. Such packages are proposed to be manufactured using low-cost, flex-embedding technologies. The proposed technology may transform biomedical electronic systems from their current 2D assembled architectures with pre-packaged devices to thin embedded modules. The underlying technology is based on a power telemetry approach with multiferroics to provide much higher power densities through external magnetic fields and embedded packaging of multiferroic power telemetry with capacitive storage and thin diodes. The power modules may be customized to different functions based on the required performance, physiological, and design constraints. Since future components are expected to be thinned and diced to chiplets of less than 100 micron thickness, this approach transforms wafers to systems with the least disruption to the supply chain where device manufacturers can directly adapt their devices to subsystems. This low-cost manufacturing path may enable high-volume production of power modules, bringing the best combination of multiferroic telemetry with rectification and storage. In addition, the modularity will allow easy extensibility to incorporate building-block component technologies.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.