I-Corps: Power Single-Layer Integration with Component Embedding for Wearable and Internet of Things (IoT) Electronics

这个i-Corps项目的更广泛影响/商业潜力是为可穿戴设备、物联网(IoT)和便携式电子市场开发下一代电力输送产品。拟议的制造路径可能会在电子供应链的所有级别产生机会，因为该技术与电力输送模式、对其他系统组件的可扩展性、异类组件集成以及与新兴芯片封装的兼容性无关。供应链(模拟芯片、无源组件和多铁性组件制造商)和最终用户都可以通过灵活设计创建最佳构建块，从而从建议的技术中受益。所提出的技术可以提供具有所需功率密度、大小、厚度和系统接口的低成本组件，各种终端用户可以在医疗保健、安全和安保方面购买这些组件。这个i-Corps项目是基于电力传输子系统的开发，该系统在单一的FLEX封装中嵌入电力遥测单元、整流和存储。这样的封装被提议使用低成本、柔性嵌入技术来制造。这项拟议的技术可能会将生物医学电子系统从目前的带有预封装设备的2D组装体系结构转变为薄型嵌入式模块。基本技术基于多铁性电力遥测方法，通过外部磁场和具有电容存储和薄二极管的多铁性电力遥测嵌入式封装提供更高的功率密度。电源模块可以根据所需的性能、生理和设计约束来定制不同的功能。由于未来的组件预计将被减薄并切成厚度小于100微米的芯片，这种方法将晶圆转变为对供应链破坏最小的系统，在这种系统中，设备制造商可以直接将其设备适配到子系统。这种低成本的制造路径可能会实现电力模块的大批量生产，带来多铁遥测与整流和存储的最佳组合。此外，模块化将允许轻松扩展以纳入积木组件技术。该奖项反映了NSF的法定使命，并通过使用基金会的智力优势和更广泛的影响审查标准进行评估，被认为值得支持。

The broader impact/commercial potential of this I-Corps project is the development of next-generation power delivery products for the wearable, Internet of Things (IoT), and portable electronics markets. The proposed manufacturing path may generate opportunities at all levels of the electronics supply chain as the technology is agnostic to the power delivery mode, extensibility to other system components, heterogeneous component integration, and compatibility with emerging chiplet packaging. Both supply chain (analog chip, passive component, and multiferroic component manufacturers) and end-users may benefit from the proposed technology by creating optimal building blocks with agile designs. The proposed technology may provide low-cost components with the required power densities, size, thickness and system interfaces that may be purchased by various end-users in healthcare, safety, and security. This I-Corps project is based on the development of power delivery subsystems with embedded power telemetry units, rectification, and storage in a single thin flex package. Such packages are proposed to be manufactured using low-cost, flex-embedding technologies. The proposed technology may transform biomedical electronic systems from their current 2D assembled architectures with pre-packaged devices to thin embedded modules. The underlying technology is based on a power telemetry approach with multiferroics to provide much higher power densities through external magnetic fields and embedded packaging of multiferroic power telemetry with capacitive storage and thin diodes. The power modules may be customized to different functions based on the required performance, physiological, and design constraints. Since future components are expected to be thinned and diced to chiplets of less than 100 micron thickness, this approach transforms wafers to systems with the least disruption to the supply chain where device manufacturers can directly adapt their devices to subsystems. This low-cost manufacturing path may enable high-volume production of power modules, bringing the best combination of multiferroic telemetry with rectification and storage. In addition, the modularity will allow easy extensibility to incorporate building-block component technologies.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.