FuSe-TG: STAMPEDE: Scalable Technology And Manufacturing of Photonics for Extreme information-Density

FuSe-TG:STAMPEDE:可扩展的光子学技术和制造,以实现极端信息密度

基本信息

  • 批准号:
    2235443
  • 负责人:
  • 金额:
    $ 48万
  • 依托单位:
  • 依托单位国家:
    美国
  • 项目类别:
    Standard Grant
  • 财政年份:
    2023
  • 资助国家:
    美国
  • 起止时间:
    2023-04-15 至 2025-03-31
  • 项目状态:
    未结题

项目摘要

The integration of both classical and quantum photonic integrated circuits (PICs) is poised to revolutionize information communications technology, computing, and sensing systems. These advances are made possible through novel manufacturing processes that integrate heterogeneous materials onto integrated circuits to introduce light generation, information encoding, and signal transmission and transduction. These functions are necessary to achieve large information capacity that deliver unprecedented data transfer speeds within data centers and packaged semiconductor integrated circuits. STAMPEDE has assembled a team of experts in materials, photonics, manufacturing, and education to rapidly advance research and skilled STEM workforce training pertaining to this emerging generation of integrated photonic systems. It will provide low-cost scalable nanomanufacturing solutions, photonic chip designs for high-density information with anti-counterfeiting features and embedded hardware security against cyber physical attacks. Concomitantly, this project will enhance education and access to state-of-the-art photonics science and technology for broad audiences including community colleges, undergraduate and graduate students with a strong emphasis in material processing, semiconductor manufacturing and sustainable technologies. These advances are expected to benefit consumers of electronic products with an efficient photonic integrated platform that will provide fast, reliable and energy-efficient computing and communications, and, at the same time, provide an educational and workforce pipeline for the US-industry to lead the forefront of the global semiconductor industry. STAMPEDE will demonstrate (i) III-V semiconductor heterogeneous integration onto silicon via selective-area growth method of III-V nanowire array light-emitting diodes and its micro-transfer printing onto silicon substrates, (ii) scalable 3D nanopatterning of infrared optical microscale elements via electrochemical nanoimprinting that improve light coupling efficiency, (iii) hardware systems for handling information dense tasks secured with physical unclonable functions (PUFs) that can prevent cyberattacks, and (iv) machine learning models to enable inverse design of PUFs in waveguide structures, while allowing scalable process integration with standard foundry manufacturing. STAMPEDE’s educational and workforce development plan include: (1) strengthening undergraduate and graduate education through new photonics program offerings, bootcamps, course innovations, and cross-institutional learning, (2) workforce advancement through the development of massive open online courses and virtual learning opportunities, and (3) growth of face-to-face photonics bootcamps and establishment of an annual STAMPEDE workshop organized in conjunction with the Electronic Materials Conference. In close collaboration with partner minority serving institution (i.e., Bridgewater State University) and community colleges (i.e., Cape Cod Community College, Massasoit Community College, Monroe Community College), STAMPEDE seeks to advance opportunities for underrepresented groups in pursuing graduate education, enhance STEM career training, and increase exposure to semiconductor manufacturing concepts at the undergraduate level.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.
经典和量子光子集成电路(PIC)的集成有望彻底改变信息通信技术,计算和传感系统。这些进步是通过将异质材料集成到集成电路上以引入光产生、信息编码以及信号传输和转导的新型制造工艺实现的。这些功能对于实现大信息容量是必要的,这些信息容量在数据中心和封装半导体集成电路内提供前所未有的数据传输速度。STAMPEDE组建了一个材料、光子学、制造和教育方面的专家团队,以快速推进与这一新兴一代集成光子系统相关的研究和熟练的STEM劳动力培训。它将提供低成本可扩展的纳米制造解决方案,具有防伪功能的高密度信息光子芯片设计以及针对网络物理攻击的嵌入式硬件安全性。与此同时,该项目将加强教育和获得最先进的光子科学和技术的广泛受众,包括社区学院,本科生和研究生,重点是材料加工,半导体制造和可持续技术。这些进步预计将使电子产品的消费者受益于高效的光子集成平台,该平台将提供快速,可靠和节能的计算和通信,同时为美国工业提供教育和劳动力管道,以引领全球半导体行业的前沿。STAMPEDE将展示(i)通过III-V纳米线阵列发光二极管的选择性区域生长方法将III-V族半导体异质集成到硅上,并将其微转印到硅衬底上,(ii)通过电化学纳米压印可提高光耦合效率的红外光学微尺度元件的可扩展3D纳米图案化,(iii)用于处理信息密集任务的硬件系统,其利用可以防止网络攻击的物理不可克隆功能(PUF)来保护,以及(iv)机器学习模型,其使得能够对波导结构中的PUF进行逆向设计,同时允许与标准铸造制造的可扩展的工艺集成。STAMPEDE的教育和劳动力发展计划包括:(1)通过新的光子学课程、训练营、课程创新和跨机构学习加强本科生和研究生教育,(2)通过开发大规模开放式在线课程和虚拟学习机会提高劳动力水平,和(3)面对面的光子学训练营的增长和建立一个年度STAMPEDE研讨会与电子材料会议一起组织。与少数群体服务机构伙伴密切合作(即,布里奇沃特州立大学)和社区学院(即,科德角社区学院、马萨诸塞州社区学院、门罗社区学院),STAMPEDE旨在为代表性不足的群体提供攻读研究生教育的机会,加强STEM职业培训,该奖项反映了NSF的法定使命,并通过使用基金会的知识价值和更广泛的影响审查进行评估,被认为值得支持的搜索.

项目成果

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Bruno Azeredo其他文献

Bruno Azeredo的其他文献

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{{ truncateString('Bruno Azeredo', 18)}}的其他基金

CAREER: Electrochemical Nanoimprinting of Inorganic Semiconductors: Towards Manufacturing of Three-dimensional Free-Form Optical Devices
职业:无机半导体的电化学纳米压印:迈向三维自由形状光学器件的制造
  • 批准号:
    1944750
  • 财政年份:
    2020
  • 资助金额:
    $ 48万
  • 项目类别:
    Standard Grant
Low-Temperature Laser-Sinterable Nanostructured Feedstock to Improve the Speed of Metal 3D Printing, and to Enable Polymer-Metal Concomitant Printing
低温激光烧结纳米结构原料可提高金属 3D 打印速度,并实现聚合物-金属协同打印
  • 批准号:
    1932899
  • 财政年份:
    2019
  • 资助金额:
    $ 48万
  • 项目类别:
    Standard Grant

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