Wafer-Scale Ultrathin Layered Device Array Assembly through a Precision Soft-Robotic Stamp Transfer Process

通过精密软机器人印模转移工艺组装晶圆级超薄分层器件阵列

• 批准号: 2243477
• 负责人: Lei Zhou
• 金额: $ 52.09万
• 依托单位: University of Wisconsin-Madison
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2023
• 资助国家: 美国
• 起止时间: 2023-05-01 至 2026-04-30
• 项目状态: 未结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=2243477&HistoricalAwards=false
• 关键词: Wafer; Scale; Ultrathin; Layered; Device

MMonolayer materials such as graphene can be vertically stacked into van der Waals heterostructures (vdWH) to realize new ultrathin layered optoelectronic, electronic, and quantum devices, which have significant potential to revolutionize nanoelectronics for a wide range of applications. Despite the tremendous opportunity, today’s assembly of vdWH-based devices is mainly through manual operation, which lacks the precision, repeatability, and throughput needed to manufacture vdWH-based device arrays at scale. This award supports fundamental research to remove technical barriers toward a scalable, precise, and high-yield technology to assemble patterned monolayer materials into vdWH-based device arrays at wafer scale. The researched new assembly approach uses a novel soft-robotic stamp transfer process with precision alignment and adhesion control. Inline measurements and data analytics enable defect monitoring and feedback control. This research holds a strong potential to enable deterministic, high-throughput, and high-yield manufacturing of vdWH-based device arrays and circuits for next-generation transparent displays, sensor arrays, and logic and memory circuits, thereby benefiting society at large. In addition, this award supports the training of graduate and undergraduate students in research, incorporating the research into curricula, and outreach to K-12 students.Two scientific barriers prevent the realization of deterministic and scalable stamp transfer assembly of vdWH-based device arrays at wafer scale: (a) the lack of quantitative knowledge in the adhesion control for the stamp-monolayer-substrate interfaces, and (b) the lack of methods to achieve precise interlayer registration over a large area. This project aims to address these knowledge gaps and to enable the scalable, precise, and high-yield assembly of patterned monolayer materials into vdWH device arrays. In particular, this project (i) characterizes the interfacial adhesion between the stamp, monolayer materials, and substrates under various stimuli aiming to achieve the deterministic control of monolayer pick-up and release, (ii) creates a novel soft-robotic stamp transfer machine prototype that can provide precision interlayer alignment with micron-level accuracy and deterministic transfer actions, and (iii) creates inline and offline metrology and data analysis tools and use the measurements to improve the manufacturing process and thus reduce defect rate. The performance of the envisioned manufacturing machine and process is evaluated through experiments involving vdWH device array assembly and a series of metrology results for the process and productsThis award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

单层材料如石墨烯可以垂直堆叠成货车德瓦尔斯异质结构（vdWH），以实现新的多层光电、电子和量子器件，其具有革命性的纳米电子学的巨大潜力，用于广泛的应用。尽管存在巨大的机会，但今天基于vdWH的器件的组装主要是通过手动操作，这缺乏大规模制造基于vdWH的器件阵列所需的精度、可重复性和吞吐量。该奖项支持基础研究，以消除可扩展，精确和高产技术的技术障碍，将图案化单层材料组装成晶圆级基于vdWH的器件阵列。所研究的新的装配方法使用了一种新的软机器人印章转移过程与精确对准和粘附控制。在线测量和数据分析可实现缺陷监控和反馈控制。这项研究具有很强的潜力，可以实现下一代透明显示器，传感器阵列以及逻辑和存储器电路的基于vdWH的器件阵列和电路的确定性，高吞吐量和高产量制造，从而使整个社会受益。此外，该奖项还支持研究生和本科生的研究培训，将研究纳入课程，并推广到K-12学生。两个科学障碍阻碍了在晶圆级实现基于vdWH的器件阵列的确定性和可扩展的印模转移组装：（a）缺乏对印模-单层-基底界面的粘附控制的定量知识，和（B）缺乏在大面积上实现精确的层间对准的方法。该项目旨在解决这些知识差距，并使图案化单层材料的可扩展，精确和高产率组装成vdWH器件阵列。特别是，该项目（i）表征了各种刺激下印章、单层材料和基底之间的界面粘附力，旨在实现单层拾取和释放的确定性控制，（ii）创建一种新型的软机器人印章转移机原型，可以提供微米级精度的精确层间对准和确定性的转移动作，以及（iii）创建在线和离线计量和数据分析工具，并使用测量来改进制造过程，从而降低缺陷率。通过涉及vdWH设备阵列组装的实验以及工艺和产品的一系列计量结果来评估所设想的制造机器和工艺的性能。该奖项反映了NSF的法定使命，并被认为值得通过使用基金会的智力价值和更广泛的影响审查标准进行评估来支持。

项目成果

Semi-Automated Soft Robotic Stamp Transfer Machine for Van Der Waals Heterostructure Device Assembly

用于范德瓦尔斯异质结构器件组装的半自动软机器人印章转移机

• DOI: 10.1115/msec2023-101118
• 发表时间: 2023
• 期刊: American Society of Mechanical Engineers
• 作者: Ahn, Seong-Hyo;Chavarria, Juan;Mu, Haoxuan;Liao, Yifeng;Warner, Jamie;Zhou, Lei
• 通讯作者: Zhou, Lei