System integration for optical and wireless Pbit/s communication in high performance computing (A10)

点击翻译按钮获取中文摘要

Project A10 deals with the development of an electro-optical packaging of optical and wireless hybrid transceivers. For a complete co-integration of mm-wave and optical modules into a package, additive manufacturing (AM) methods using simultaneous IC-device embedding and chip-carrier fabrication with subsequent fabrication of RF and optical interconnect network will be developed. Using these methods, arrayed passive components (optical couplers, Butler matrices, and antennas) will be integrated with the embedded active IC-chips, in order to realize RF-E/O-transceivers.