Radio Frequency Microelectromechanical Systems for Wireless Communications

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Current and future Wireless appliances require increased functionality, frequency of operation, and component integration along with reduced manufacturing costs, size, weight, and power consumption. Micro electro mechanical systems for radio frequency with versatility to integrate both electronic (2-D) and microelectro-mechanical (3-D) devices represent the technology that can offer wide operational bandwidths, on-chip passive components, negligible interconnections, almost ideal switches and resonators, in a planar fabrication process, compatible with existing integrated circuits and monolithic microwave integrated circuits. The outcomes of this project will be of significant benefit to the Australian Telecommunication industry.