Nano-indentation of thin films on materials surface

材料表面薄膜的纳米压痕

• 批准号: 04452269
• 负责人: TANAKA Kohichi
• 金额: $ 4.48万
• 依托单位: Nagaoka University of Technology
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for General Scientific Research (B)
• 财政年份: 1992
• 资助国家: 日本
• 起止时间: 1992 至 1993
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/en/grant/KAKENHI-PROJECT-04452269/
• 关键词: Nanoindentation; Thin film; Surface; Berkovich indenter; Elastic modulus; Fiber optic sensor; Finite element method; Three-dimensional elastic analysis; 極超微小硬度; 圧子; FEM解析; ガラス; カーボン薄膜; フェライト; 機械加工層

We constructed an advanced nanoindentation tester to evaluate the mechanical property of materials surface in the depth as small as 10nm. Using this instrument, we examined various materials such as substrate glass, thin film rigid disks and ferrite heads. The results were analyzed by the three-dimensional finite element method (FEM). The main research results obtained are as follows.(a) Three-demensional analysis by FEM was conducted on the elastic behavior of nanoindentation with a Berkovich triangular prismatic indenter. We proposed a theoretical relationship between applied load and displacement for the Berkovich indentation, including the effect of the tip truncation.(b) We developed a nanoindentation tester with 0.1muN load and 0.1nm displacement resolutions. The instrument was capable of detecting contact of the indenter tip with the sample surface with the accuracy of 0.2nm when operated under displacement controlled conditions.(c) The nanoindentation behavior of a substrate glass to a depth only 5nm was examined using an 5nm truncated Berkovich tip. We found that the plastic deformation initiated when the Mises stress underneath the tip attained the theoretical strength of glass.(d) The nanoindentation test was applied to estimate the Young's modulus of overcoat films on the thin film rigid disks. The damage of surface finishing by mechanical lapping was also evaluated for the slider surface of magnetic recording heads.

我们建立了一个先进的纳米压痕测试仪，以评估材料表面的机械性能，在深度为10纳米。使用该仪器，我们检查了各种材料，如基板玻璃，薄膜硬盘和铁氧体磁头。采用三维有限元法对试验结果进行了分析。取得的主要研究成果如下。(a)采用有限元法对布氏三棱柱压头纳米压痕的弹性行为进行了三维分析。我们提出了一个理论上的布氏压痕的载荷和位移之间的关系，包括尖端截断的影响。(b)我们研制了一台具有0.1 μ N载荷和0.1nm位移分辨率的纳米压痕测试仪。当在位移控制条件下操作时，该仪器能够以0.2nm的精度检测压头尖端与样品表面的接触。(c)使用5nm截短的Berkovich针尖检查基板玻璃的纳米压痕行为至仅5nm的深度。我们发现当针尖下方的Mises应力达到玻璃的理论强度时，塑性变形开始。(d)采用纳米压痕法测量了薄膜硬磁盘保护膜的杨氏模量。对磁头滑块表面进行了机械研磨的损伤评价。

项目成果

Y.Murakami: "Elastic Analysis of Triangular Pyramidal Indentation by Finite Element Method and its Application to Nano-Indentation Measurement of Glasses" Philosophical Magazine A. 69. 1131-1153 (1994)

Y.Murakami：“三角锥体压痕的有限元法弹性分析及其在玻璃纳米压痕测量中的应用”哲学杂志A.69.1131-1153（1994）

村上敬宣: "有限要素法による三角錐圧子の弾性押込み解析" 日本機械学会論文集(A編). 59. 835-841 (1993)

Takanobu Murakami：“使用有限元法对三角锥压头进行弹性压痕分析”日本机械工程师学会会刊（A 版）59. 835-841（1993 年）。

Y.Murakami, M.Itokazu and K.Tanaka: "Analysis of Triangular Pyramid Indentation by the Finite-Element Method (in Japanese)" ASME (A). 59 (559). 835-841 (1993)

Y.Murakami、M.Itokazu 和 K.Tanaka：“用有限元法分析三角锥压痕（日语）”ASME (A)。

A.Shimamoto, and K.Tanaka: "Optical Fiber Bundle Displacement Sensor Using an ac-Modulated Light Source with Subnanometer Resolution and Low Thermal Drift" Applied Optics. 34. 5854-5860 (1995)

A.Shimamoto 和 K.Tanaka：“使用具有亚纳米分辨率和低热漂移的交流调制光源的光纤束位移传感器”应用光学。

A.Shimamoto, K.Tanaka, Y.Akiyama, and H.Yoshizaki: "Nanoindentation of Glass with a Tip-Truncated Berkovich Indenter" Phil Mag. (to be published).

A.Shimamoto、K.Tanaka、Y.Akiyama 和 H.Yoshizaki：“用尖端截短的伯科维奇压头进行玻璃纳米压痕” Phil Mag。