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Study on Microscale Heat Transfer in Microelectronic Devices and Effective Cooling using Boiling Heat Transfer

微电子器件中的微观传热及沸腾传热有效冷却研究

基本信息

批准号：
06452185
负责人：
HIJIKATA Kunio
金额：
$ 4.42万
依托单位：
TOKYO INSTITUTE OF TECHNOLOGY
依托单位国家：
日本
项目类别：
Grant-in-Aid for General Scientific Research (B)
财政年份：
1994
资助国家：
日本
起止时间：
1994 至 1995
项目状态：
已结题

项目摘要

Microscale heat transfer from very small heating elements in a substrate has been investigated from the view point of cooling technology of microelectronic devises. Conjugate heat transfer of microscale heat conduction in the substrate and macroscale forced convective cooling by fluid was numerically analyzed by using a domain decomposition technique. The effect of periodic heating was also taken into account by using the Fourier transforms. The calculated heater temperature was correlated with nondimensional parameters such as Reynolds, Biot, Fourier numbers, length ratio of the heating element and substrate, etc.A simplified model was proposed to predict the element temperature in a certain range of nondimensional parameters. Boiling heat transfer from very small heating elements in a substrate was also investigated both for pool boiling and forced convective boiling. With the decrease of heater size, the effect of heat conduction becomes dominant. Further, because the heating element is smaller than the bubble diameter, the element temperature fluctuates corresponding to the bubble growth and departure, which indicates an extraordinary large surface heat transfer at the moment of the bubble departure. The effective surface heat transfer coefficient was estimated with the aid of numerical analysis of the substrate conduction. Finally, as a fundamental technique of temperature measurement in the microscale, thermoelectirc power due to the point contact of a needle to the surface was analyzed by considering both the electron tunneling effect through the surface oxide layr and the nonequilibrium effect at the point contact. The analysis well explained the experimental results.

从微电子器件冷却技术的角度出发，研究了微细加热元件在基板上的微尺度换热。采用区域分解技术，对微尺度导热与宏观流体强制对流冷却的耦合换热进行了数值分析。利用傅立叶变换考虑了周期性加热的影响。将计算得到的加热器温度与无因次参数雷诺数、毕奥数、傅立叶数、加热元件与基板的长度比等进行了关联，提出了一种在一定的无量纲参数范围内预测元件温度的简化模型。在池沸腾和强制对流沸腾两种情况下，还研究了衬底中极小加热元件的沸腾换热。随着加热器尺寸的减小，导热作用占主导地位。此外，由于加热元件小于气泡直径，元件温度随气泡的生长和离开而波动，这表明在气泡离开时刻有非常大的表面换热。通过对衬底导热的数值分析，估算了有效表面换热系数。最后，作为微尺度温度测量的一种基本技术，考虑了表面氧化层的电子隧穿效应和点接触处的非平衡效应，分析了针尖与表面的点接触产生的温差电功率。分析很好地解释了实验结果。