Analyses of Stress and Strain in IC Board and Prevention techniques of Board Fracture

本文研究了电子线路板热应力及防止电路板断裂的实验和理论技术，主要内容如下：（1）从电路板形状、材料组成和动态载荷条件等方面分析了印刷电路板和集成电路板等实际电路板的断裂条件;（2）提出了用特殊有限元法分析电路板热应力和热应变的数值方法。该方法是分析胶接结构的应用技术。利用该技术，对几种电子线路板的热应力和热应变分布进行了三维分析。(3)用模拟实际电路的模型对热应变分布进行了实验分析。将计算结果与有限元法的理论计算结果进行了比较。

Experimental and theoretical techniques to the thermal stresses of electronic circuit boards and to prevent the board fractures are studied.The studies are summarized as follows :(1) The fracture conditions of the practical electronic boards such as the printed electronic circuit boards and IC boards are analyzed in the viewpoints of board shape, material composition and dynamical load conditions(2) The numerical technique to analyze the thermal stresses and strains of electronic circuit boards is proposed by using the special finite element method. The method is the application technique to analyze the adhesive bonded structure. By using the technique, the thermal stress and strain distributions of several electronic circuit boards are analyzed three-dimensionally.(3) The models simulating the practical electronic circuits are used to analyze experimentally the thermal strain distributions. The results are compared with the theoretical results by the finite element method.