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Ultra Low Power GHz-Band RF DSP for Software Defined Radio Terminals

适用于软件定义无线电终端的超低功耗 GHz 频段 RF DSP

基本信息

批准号：
14205053
负责人：
TSUBOUCHI Kazuo
金额：
$ 34.61万
依托单位：
Tohoku University
依托单位国家：
日本
项目类别：
Grant-in-Aid for Scientific Research (A)
财政年份：
2002
资助国家：
日本
起止时间：
2002 至 2005
项目状态：
已结题

来源：
https://kaken.nii.ac.jp/en/grant/KAKENHI-PROJECT-14205053/
关键词：
Software Defined Radio Ultra Low Power RF DSP Currrent Mode Signal Processing Spread Spectrum Communication OFDM FIR Filter ASIC 電流モードアナログ信号処理

项目摘要

Software defined radio (SDR) is a promising solution for multi-mode and multi-band mobile communication system. One of key component of SDR is programmable filter, i.e., the radio frequency/immediate frequency band pass filter, the root roll off filter and so on. Although the recent digital signal processing (DSP) operates at high frequency, power of consumption of the filters using DSP is over 100mW.We have already proposed and implemented the current-cut switched current matched filter (CC-SIMF). The power consumption of CC-SIMF can be remarkably reduced.In this work, we propose the switched current analog programmable finite impulse response (FIR) filter for SDR terminals. New programmable tap circuits are proposed. Furthermore, implementation and measurement of the tap circuit are described and power consumption of 16-tap FIR filter is estimated.For realizing flexible RF module, we propose a new concept of 3-D multilayer-stacked SiP. The new 3-D packaging concept includes (1) design guideline for interconnection lengths, (2) bridging register circuits in LSI chips, (3) flip-chip microbump bonding technology of chips onto system-buildup printed wiring boards (PWB), (4) multilayer-stacked 3-D package of several sets of chips and PWB, and (5)100-μm-diameter bumps at peripheral region of PWB as vertical via-bump bus lines.

软件无线电（SDR）是一种很有前途的多模多频段移动的通信系统解决方案。软件无线电的关键部件之一是可编程滤波器，本文提出并实现了电流截止开关电流匹配滤波器（CC-SIMF）。在本论文中，我们提出了一种可应用于软件无线电终端的开关电流模拟可编程有限脉冲响应滤波器。提出了一种新的可编程抽头电路。在此基础上，给出了抽头电路的实现和测量方法，并对16抽头FIR滤波器的功耗进行了估算。为了实现灵活的射频模块，提出了三维多层堆叠SiP的新概念。新的三维封装概念包括（1）互连长度的设计准则，（2）LSI芯片中的桥接寄存器电路，（3）芯片到系统组装印刷线路板（PWB）的倒装芯片微凸块键合技术，（4）多组芯片和PWB的多层堆叠三维封装，以及（5）PWB外围区域的100 μ m直径凸块作为垂直通孔凸块总线。