Elementary processes of photon, radical, and electron irradiation and their synergetic effects for plasma-surface interaction

本研究的目的是阐明等离子体过程中来自等离子体的入射物质与表面材料之间的相互作用及其协同效应，即，非线性效应不能用基元反应过程的叠加来解释。在这项研究中，它已被证明，在一定的条件下，从等离子体的紫外线（UV）照射对蚀刻速率的影响不能忽略不计，并已获得的条件下，由氢注入造成的损害和松弛过程影响的最终状态的处理材料。根据这些结果，已经阐明了在高精度等离子体处理中需要如何控制氢和UV照射的能量和通量。

The goal of this research is to clarify the interactions between incoming species from the plasma and the surface material in a plasma process and their synergetic effects, i.e., nonlinear effects that cannot be accounted for by superposition of elementary reaction processes. In this study, it has been shown that, under certain conditions, effects of ultraviolet (UV) irradiation from the plasma on etching rates cannot be negligible and the conditions under which damages and relaxation processes caused by hydrogen injection affect the final states of the processed materials have been obtained. With these results, it has been clarified how energies and fluxes of hydrogen and UV irradiations need to be controlled for high-precision plasma processing.