Research on 3-D Highly Precise Self-alignment Process Using Resin Material for Assembly of Optical Device

近年来，随着信息和通信设备的进步，海量信息被高速传输，信息和多媒体时代的到来，加速了对先进电子封装小型化、高安装、低成本和高性能的要求。此外，电子器件的高密度表面贴装技术（SMT）和光学器件（LD、PD、VCSEL等）的集成光电多芯片模块（oe - mcm）和光布线板上的电子元件的光电技术也取得了显著进展。特别是在高密度SMT和光器件互连中，对高精度对准技术提出了更高的要求。在这种高精度的对准技术中，有必要开发新的替代自对准工艺，使其足以在低工艺温度下进行简单的加工，低成本和无助焊剂。本研究的目的是开发新的可选自校准工艺，该工艺足以在低工艺温度下进行简单的加工，无需助焊剂，成本低。本研究认为，由于安装材料的润湿性不同，接触线的定位边界必须存在，以实现自对准能力。建立了高精度的放*模型、拉*模型和金属球三维模型。说明了工艺相关参数之间的关系，并利用单节点数学模型开发了设计工具。通过建立的对准动力学模型，建立了自对准机构。最后，通过解析数值方法和自对准实验验证了设计工艺的实用性。

In resent years, along the advances of the information and communication apparatus, mass information are processe transmitted at high speed toward information and multimedia age and the need for miniaturization, higher mount de* lower cost and higher performance of advanced electronic packages have been accelerated. Furthermore, a research development of the high density surface mount technology (SMT) of electronic devices and the opto-electronic technolo* the consolidated optoelectronic multi-chip modules (OE-MCMs) of the optical devices (LD, PD, VCSEL, etc.) and elec* elements to an optical wiring board have been made remarkable progress. Especially, the highly precise alignment technologies have been required in high density SMT and interconnection of an optical devices and elements. In such a highly precise alignment technologies, it is necessary that new alternative self-alignment processes which are sufficient to process simply at low process temperature, low cost and without flux should be developed. The objective of this research is the developm* new alternative self-alignment processes which are sufficient to process simply at low process temperature, without flux* low cost. In this research, it is perceived that the positioning boundary of contact line resulted from the differen* wettability on the mounting material should be existed for the self-alignment capability. And new highly precise put* model, pull up model and 3-D model with metal sphere are established. The relationships between process-related paran* are demonstrated and design tool is developed using the mathematical single joint model. Also the self-alignment mechanism is established through the developed alignment dynamic model. At last, the practicabilities of deve* processes are verified through an analytic numerical method and self-alignment experiment.