权益分类	功能权益	普通用户	{{item.name}}会员
{{category.name}}	{{benefitItem.name}}

Research on 3-D Highly Precise Self-alignment Process Using Resin Material for Assembly of Optical Device

光学器件组装用树脂材料3D高精度自对准工艺研究

基本信息

批准号：
13450143
负责人：
FUJIMOTO Kozo
金额：
$ 9.66万
依托单位：
OSAKA UNIVERSITY
依托单位国家：
日本
项目类别：
Grant-in-Aid for Scientific Research (B)
财政年份：
2001
资助国家：
日本
起止时间：
2001 至 2002
项目状态：
已结题

项目摘要

In resent years, along the advances of the information and communication apparatus, mass information are processe transmitted at high speed toward information and multimedia age and the need for miniaturization, higher mount de* lower cost and higher performance of advanced electronic packages have been accelerated. Furthermore, a research development of the high density surface mount technology (SMT) of electronic devices and the opto-electronic technolo* the consolidated optoelectronic multi-chip modules (OE-MCMs) of the optical devices (LD, PD, VCSEL, etc.) and elec* elements to an optical wiring board have been made remarkable progress. Especially, the highly precise alignment technologies have been required in high density SMT and interconnection of an optical devices and elements. In such a highly precise alignment technologies, it is necessary that new alternative self-alignment processes which are sufficient to process simply at low process temperature, low cost and without flux should be developed. The objective of this research is the developm* new alternative self-alignment processes which are sufficient to process simply at low process temperature, without flux* low cost. In this research, it is perceived that the positioning boundary of contact line resulted from the differen* wettability on the mounting material should be existed for the self-alignment capability. And new highly precise put* model, pull up model and 3-D model with metal sphere are established. The relationships between process-related paran* are demonstrated and design tool is developed using the mathematical single joint model. Also the self-alignment mechanism is established through the developed alignment dynamic model. At last, the practicabilities of deve* processes are verified through an analytic numerical method and self-alignment experiment.

近年来，沿着信息和通信设备的进步，大量信息被高速处理并向信息和多媒体时代传送，并且对先进电子封装的小型化、高安装、低成本和高性能的需求已经加速。此外，还介绍了电子器件的高密度表面贴装技术（SMT）和光电子技术（LD、PD、VCSEL等光学器件的集成光电多芯片组件（OE-MCM）的研究进展。和半导体元件到光布线板的应用已经取得了显著的进展。特别是在高密度SMT和光学器件和元件的互连中，要求高精度的对准技术。在这种高精度的对准技术中，有必要开发新的替代自对准工艺，其足以在低工艺温度下简单地加工，低成本并且不需要助焊剂。本研究的目的是开发新的替代自对准工艺，该工艺足以在低工艺温度下简单地加工，无需焊剂，成本低。在本研究中，我们认为，接触线的定位边界必须存在，因为接触线的定位边界是由贴装材料的润湿性所造成的。并建立了新的高精度放、拔模型和含金属球的三维模型。利用单关节的数学模型，论证了工艺参数之间的关系，并开发了设计工具。通过建立对准动力学模型，建立了自对准机理。最后，通过数值分析和自对准实验验证了设计过程的可行性。