课题基金 / 基金详情

Clarification of Coalescence Mechanism of Metal Fillers in Self-Organization Assembly Process

Clarification of Coalescence Mechanism of Metal Fillers in Self-Organization Assembly Process
阐明自组织组装过程中金属填料的聚结机制
批准号:
19201027
负责人:
FUJIMOTO Kozo
金额:
$24.96万
依托单位:
依托单位国家:
日本
项目类别:
Grant-in-Aid for Scientific Research (A)
财政年份:
2007
资助国家:
日本
项目状态:
已结题
起止时间:
2007 至 2009

项目摘要

项目成果

FUJIMOTO Kozo的其他基金

相似基金

相关文献

中文摘要
翻译
在这项研究中,我们研究了在新提出的自组织组装过程中,熔融的填充金属在树脂中流动、聚集和结合的基本原理。特别是,我们发现,由于表面氧化膜的退化而引起的表面能变化是熔化的填充金属流动的驱动力。研究还发现,填充金属表面氧化膜的降解和树脂粘度的变化是影响自组织组装过程组装性能的主要因素。此外,还给出了IC芯片上数千个电极端子连接的材料设计或工艺设计指南。
英文摘要
In this study, we investigated the fundamental principles of the flow, cohesion, and coalescence of the molten filler metals in the resin in the newly proposed self-organization assembly process. In particular, we found that the surface energy change due to degradation of the surface oxide film is the driving force of the molten filler metal flow. We also found that degradation of oxide film on the filler metals and viscosity change of the resin are major influence for the assembly property of the self-organization assembly process. In addition, guidelines of material design or process design for terminal connection on the thousands of electrodes on IC chip has been given.
期刊论文(28)
专著(0)
科研奖励(0)
会议论文
Observation of Solder Fillers Coalescence in Resin for Development of Self-Organization Assembly Process
观察树脂中焊料填料的聚结,以开发自组织组装工艺
DOI: --
发表时间: 2008
期刊: e-Proceedings of the 33rd International Electronics Manufacturing Technology Conference No.C5.1
影响因子: --
作者: [K. Ohta, M. Toya, K. Yasuda, M. Matsushima, K. Fujimoto]
通讯作者: K. Fujimoto
Movement of solder fillers because of the unevenness of interfacial tension in self-organization assembly process
自组织组装过程中由于界面张力不均匀导致焊料填料移动
DOI: --
发表时间: 2009
期刊: Journal of Physics: Conference Series Vol.165
影响因子: --
作者: [K. Ohta, K. Yasuda, M. Matsushima, K. Fujimoto]
通讯作者: K. Fujimoto
自己組織化実装法におけるフィラー表面酸化膜分解挙動の定量的評価
自组装安装法中填料表面氧化膜分解行为的定量评价
DOI: --
发表时间: 2010
期刊:
影响因子: --
作者: [有光拓史, 大田皓之, 井上宗, 藤本公三]
通讯作者: 藤本公三
Movement Mechanism of Solder Fillers in Self-Organization Assembly Process
自组织组装过程中焊料填充物的运动机制
DOI: --
发表时间: 2008
期刊: Proceedings of 8th International Welding Symposium Vol. 8
影响因子: --
作者: [岡田浩幸, 松島綾美, 劉 暁輝, 下東康幸, 緒方秀輔・増木新悟・奥村稔・清家泰, 橋本道廣, 羽田 肇, Koushi Ohta]
通讯作者: Koushi Ohta
16
    Development of novel electronic device packaging using hybrid resin sheet containing solder particles
    • 批准号:
      26630158
    • 项目类别:
      Grant-in-Aid for Challenging Exploratory Research
    • 资助金额:
      $2.41万
    • 财政年份:
      2014
    • 负责人:
      FUJIMOTO Kozo
    • 依托单位:
    3D wafer-scale packaging by multiphase bonding using layered metal films
    • 批准号:
      25289242
    • 项目类别:
      Grant-in-Aid for Scientific Research (B)
    • 资助金额:
      $11.73万
    • 财政年份:
      2013
    • 负责人:
      FUJIMOTO Kozo
    • 依托单位:
    Research on 3-D Highly Precise Self-alignment Process Using Resin Material for Assembly of Optical Device
    • 批准号:
      13450143
    • 项目类别:
      Grant-in-Aid for Scientific Research (B)
    • 资助金额:
      $9.66万
    • 财政年份:
      2001
    • 负责人:
      FUJIMOTO Kozo
    • 依托单位:
    Study on Vision System for High Accurate Positioning and Process Control in Micro-Joining
    • 批准号:
      07455290
    • 项目类别:
      Grant-in-Aid for Scientific Research (B)
    • 资助金额:
      $0.58万
    • 财政年份:
      1995
    • 负责人:
      FUJIMOTO Kozo
    • 依托单位:
    海外基金