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Evaluation Method of "Formablity" in Nano/Micro Processing and Its Application to Inprint Lithography

Evaluation Method of "Formablity" in Nano/Micro Processing and Its Application to Inprint Lithography
纳微加工“成形性”评价方法及其在压印光刻中的应用
批准号:
16560094
负责人:
INAMURA Toyoshiro
金额:
$2.37万
依托单位国家:
日本
项目类别:
Grant-in-Aid for Scientific Research (C)
财政年份:
2004
资助国家:
日本
项目状态:
已结题
起止时间:
2004 至 2005

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中文摘要
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英文摘要
An idea of "formability" which stands for fundamental possibility of forming and is independent of existing forming methods has been proposed. This idea can be used to evaluate how much the effort to develop a new forming technique for producing new products has practical possibility. In this study, we have developed a method of qualitative and quantitative evaluation of the "formability" in nano/micro processing and we have applied it to inprint lithography that is expected to be one of the new forming methods in the next generation. The application has clarified theoretical possibility and limits of the new method as follows :(1)"Formability" in inprint lithography consists of mold releasability and transferability. Mold releasability is, semi-quantitatively, classified into three levels depending on interfaces where separation begins : separation between mold/resin, separation between resin/resin and separation between resin/base. The basic factors for mold releasability are the ratio of cohesive energy of resin-mold to base-resin and the aspect ratio of a shape to be formed. Quantitatively, mold release is possible when the ratio of cohesive energy of resin-mold to base-resin is less than or equal to 1. However, in case of large aspect ratio, the ratio of cohesive energy should be decreased for condition of good mold release, because the ratio is in inverse proportion to the aspect ratio.(2)Transferability is, semi-quantitatively, classified into three levels based on the degree of deformation of resin after mold release. This transferability depends on the energy ratio (B/A) and the aspect ratio (E/D), where 'A' is cohesive energy of resin, 'B' is cohesive energy between resin and mold, and (E/D) is the aspect ratio of a shape to be formed. Quantitative condition for good transferability is(E/D)【less than or equal】-4×(B/A)+3,while for(E/D)【greater than or equal】-4×(B/A)+4,transfer from mold to resin is impossible.
期刊论文(23)
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会议论文
DOI: 10.1016/s0007-8506(07)60156-5
发表时间: 2005
期刊: CIRP Annals
影响因子: --
作者: [T. Inamura;N. Takezawa;T. Miura;K. Yamada]
通讯作者: T. Inamura;N. Takezawa;T. Miura;K. Yamada
DOI: --
发表时间: 2005
期刊: 2005年度精密工学会春季大会講演会論文集
影响因子: --
作者: [三島大介, 山田耕一郎, 武澤伸浩, 稲村豊四郎]
通讯作者: 稲村豊四郎
DOI: --
发表时间: 2005
期刊: 2005年度精密工学会春季大会講演会論文集
影响因子: --
作者: [橋本剛, 山田耕一郎, 武澤伸浩, 稲村豊四郎]
通讯作者: 稲村豊四郎
DOI: --
发表时间: 2005
期刊: Proc. 5^<th> EUSPEN Vol.2
影响因子: --
作者: [Y.J.Liu, T.Inamura, N.Takezawa]
通讯作者: N.Takezawa
Analysis of micro fracture mechanism of mono-crystalline silicon by using extended analytical-solution-controlled molecular dynamics
  • 批准号:
    20560106
  • 项目类别:
    Grant-in-Aid for Scientific Research (C)
  • 资助金额:
    $3.08万
  • 财政年份:
    2008
  • 负责人:
    INAMURA Toyoshiro
  • 依托单位:
Analysis of Micro-cutting Mechanisms using Continuum-Mechanics-Controlled Molecular Dynamics
  • 批准号:
    18560102
  • 项目类别:
    Grant-in-Aid for Scientific Research (C)
  • 资助金额:
    $2.37万
  • 财政年份:
    2006
  • 负责人:
    INAMURA Toyoshiro
  • 依托单位:
Development of An Extended Molecular Dynamics Capable of Simulating EmergentProcess and Its Application to Brittle/Ductile Transition Phenomena
  • 批准号:
    14550102
  • 项目类别:
    Grant-in-Aid for Scientific Research (C)
  • 资助金额:
    $1.6万
  • 财政年份:
    2002
  • 负责人:
    INAMURA Toyoshiro
  • 依托单位:
Development of Virtual Microscope Based on Renormalization Group Molecular Dyanamics and Its Application to Machining Process Observation
  • 批准号:
    08455075
  • 项目类别:
    Grant-in-Aid for Scientific Research (B)
  • 资助金额:
    $4.29万
  • 财政年份:
    1996
  • 负责人:
    INAMURA Toyoshiro
  • 依托单位:
海外基金