Evaluation Method of "Formablity" in Nano/Micro Processing and Its Application to Inprint Lithography

纳微加工“成形性”评价方法及其在压印光刻中的应用

• 批准号: 16560094
• 负责人: INAMURA Toyoshiro
• 金额: $ 2.37万
• 依托单位: Nagoya Institute of Technology
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (C)
• 财政年份: 2004
• 资助国家: 日本
• 起止时间: 2004 至 2005
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/en/grant/KAKENHI-PROJECT-16560094/
• 关键词: molecular dynamics; imprint lithography; nano-technology; mold releasability; transferability; simulation; cohesive energy; aspect ratio; ナノリソグラフィー; 濡れ性; 粘性; 繰り込み

An idea of "formability" which stands for fundamental possibility of forming and is independent of existing forming methods has been proposed. This idea can be used to evaluate how much the effort to develop a new forming technique for producing new products has practical possibility. In this study, we have developed a method of qualitative and quantitative evaluation of the "formability" in nano/micro processing and we have applied it to inprint lithography that is expected to be one of the new forming methods in the next generation. The application has clarified theoretical possibility and limits of the new method as follows :(1)"Formability" in inprint lithography consists of mold releasability and transferability. Mold releasability is, semi-quantitatively, classified into three levels depending on interfaces where separation begins : separation between mold/resin, separation between resin/resin and separation between resin/base. The basic factors for mold releasability are the ratio of cohesive energy of resin-mold to base-resin and the aspect ratio of a shape to be formed. Quantitatively, mold release is possible when the ratio of cohesive energy of resin-mold to base-resin is less than or equal to 1. However, in case of large aspect ratio, the ratio of cohesive energy should be decreased for condition of good mold release, because the ratio is in inverse proportion to the aspect ratio.(2)Transferability is, semi-quantitatively, classified into three levels based on the degree of deformation of resin after mold release. This transferability depends on the energy ratio (B/A) and the aspect ratio (E/D), where 'A' is cohesive energy of resin, 'B' is cohesive energy between resin and mold, and (E/D) is the aspect ratio of a shape to be formed. Quantitative condition for good transferability is(E/D)【less than or equal】-4×(B/A)+3,while for(E/D)【greater than or equal】-4×(B/A)+4,transfer from mold to resin is impossible.

提出了独立于现有成形方法的“成形性”概念，它代表成形的基本可能性。这一概念可以用来评估开发一种新的成形技术以生产新产品的努力有多大的实际可能性。在这项研究中，我们已经开发了一种方法的定性和定量评估的“可成形性”在纳米/微米加工，我们已经将其应用到压印光刻，预计将成为新的形成方法之一，在下一代。应用表明，该方法的理论可行性和局限性如下：（1）压印光刻中的“成形性”包括脱模性和转印性。根据分离开始的界面，将脱模性半定量地分为三个级别：模具/树脂之间的分离、树脂/树脂之间的分离和树脂/基体之间的分离。脱模性的基本因素是树脂模具与基体树脂的结合能之比和要形成的形状的纵横比。定量地说，当树脂-模具与基础树脂的内聚能之比小于或等于1时，脱模是可能的。但是，在大的长径比情况下，为了获得良好的脱模性，应降低内聚能的比率，因为该比率与长径比成反比。（2）根据脱模后树脂的变形程度，将转移性半定量地分为三个等级。该转印性取决于能量比（B/A）和纵横比（E/D），其中“A”是树脂的内聚能，“B”是树脂和模具之间的内聚能，并且（E/D）是要形成的形状的纵横比。转移性好的定量条件是（E/D）[≤]-4×（B/A）+3，而（E/D）[≥]-4×（B/A）+4时，不能从模具转移到树脂。

项目成果

Molecular Dynamics Simulation of Dimple Formation Process on Ductile Fracture Surface

• DOI: 10.1016/s0007-8506(07)60156-5
• 发表时间: 2005
• 期刊: CIRP Annals
• 作者: T. Inamura;N. Takezawa;T. Miura;K. Yamada

ナノインプリンティング法のMDシミュレーション

纳米压印方法的MD模拟

• 发表时间: 2005
• 期刊: 2005年度精密工学会春季大会講演会論文集
• 作者: 三島大介;山田耕一郎;武澤伸浩;稲村豊四郎
• 通讯作者: 稲村豊四郎

ディップペン・ナノリソグラフィーの分子動力学シミュレーション

浸笔纳米光刻的分子动力学模拟

• 发表时间: 2005
• 期刊: 2005年度精密工学会春季大会講演会論文集
• 作者: 橋本剛;山田耕一郎;武澤伸浩;稲村豊四郎
• 通讯作者: 稲村豊四郎

Effects and possible roles of atmospheric molecules in ultra-micro cutting of monocrystalline silicon

大气分子对单晶硅超微切割的影响及可能的作用

• 发表时间: 2005
• 期刊: Proc. 5^<th> EUSPEN Vol.2
• 作者: Y.J.Liu;T.Inamura;N.Takezawa
• 通讯作者: N.Takezawa

MD Simulation of Ultra-Micro Cutting of Monocrystalline Silicon with Effects of Air

• DOI: 10.1299/jsmec.49.70
• 发表时间: 2006-03
• 期刊: Jsme International Journal Series C-mechanical Systems Machine Elements and Manufacturing
• 作者: Yanjie Liu;T. Inamura;N. Takezawa