ANODIC BONDING BETWEEN CERAMICS AND METAL, AND ITS ANALYSIS OF BONDING MECHANISM
ANODIC BONDING BETWEEN CERAMICS AND METAL, AND ITS ANALYSIS OF BONDING MECHANISM
批准号:
16560634
负责人:
SASAKI Gen
金额:
$2.37万
依托单位:
依托单位国家:
日本
项目类别:
Grant-in-Aid for Scientific Research (C)
财政年份:
2004
资助国家:
日本
项目状态:
已结题
起止时间:
2004 至 2005
中文摘要
点击翻译按钮获取中文摘要
英文摘要
Anodic bonding by lapping metal to ceramics and then applying electric al potential has grate-watched recently on the point of low-temperature bonding, Unfortunately, the effect of applied potential on the microstructure around bonded interface and the diffusion of the elements has still unknown. So that, it has unknown that the anodic bonding is suitable for the assemble technique for sensor and actuator. The aim of this study is to clarify the effect of the bonding conditions on the interfacial structure and to research the possibility for the application use. At first, in order to understand the effect of electrical potential on the atomic diffusion, metal film was evaporated on the ionic conductor and then the effect of the condition of the electrical potential on current density and microstructure were estimated. Ionic conductors used in this study were boro-silicate glass and sodium containing beta alumina Cathode side was glass and beta alumina, and Anode side was aluminum file … More side, respectively. As electrical potential with several potential patterns applied to aluminum coated ionic conductor at 523-673K, the change of electric current in aluminum coated glass and beta alumina was measured. Therefore, the electric current increased dramatically on the morrow of applying potential and show the maximum point and then decreased gradually. This phenomena is related with the mobility of sodium ion in ionic conductor quantitatively. As increasing treatment temperature, movable ions increased. But the increment of current density obtund as increasing temperature. From result of EPMA analysis and TEM observation, the content of sodium element decreased as approaching bonded interface, which is sodium depletion layer. This layer shows malignancy for use the sensor. Furthermore, aluminum element diffused in sodium depletion layer. As the sodium contents in glass are more than that in beta aluminum, the total current and the movement of sodium ion in beta aluminum is more than that of glass. Less
期刊论文(26)
专著(0)
科研奖励(0)
会议论文
登录
查看更多内容
Anodic Bonding and, its Interfacial Reaction between Metals and Ionic Conductor
阳极键合及其金属与离子导体之间的界面反应
DOI:
--
发表时间:
2006
期刊:
Proc.of 2nd JSME/ASME International Conference on Materials and Processing 2005 (CD-ROM)
影响因子:
--
作者:
[G.Sasaki, K.Mastugi, O.Yanagisawa]
通讯作者:
O.Yanagisawa
Anodic Bonding and its interfacial reaction of metals and ionic conductor
金属与离子导体的阳极键合及其界面反应
DOI:
--
发表时间:
2004
期刊:
Proc.of annual meeting for Japan institute of metals, chugoku, and shikoku branch. 12
影响因子:
--
作者:
[G.Sasaki, K.Matsugi, O.Yanagisawa]
通讯作者:
O.Yanagisawa
イオン伝導体/金属界面の電圧印加の影響
施加电压对离子导体/金属界面的影响
DOI:
--
发表时间:
2006
期刊:
日本金属学会中国四国支部鉄鋼47回金属第44回講演大会概要
影响因子:
--
作者:
[佐々木元, 亀島純一, 松木一弘, 柳澤平]
通讯作者:
柳澤平
Effect of applied potential on interface between ionic conductor and metal.
施加电势对离子导体和金属之间界面的影响。
DOI:
--
发表时间:
2005
期刊:
Proc.of annual meeting for Japan institute of metals, chugoku, and shikoku branch. 27
影响因子:
--
作者:
[H.Oka, G.Sasaki, K.Matsugi, O.Yanagisawa]
通讯作者:
O.Yanagisawa
Anodic Bonding of metals and ionic conductor ceramics.
金属和离子导体陶瓷的阳极键合。
DOI:
--
发表时间:
2004
期刊:
Proc.of 12^<th> M&P
影响因子:
--
作者:
[G.Sasaki, Y.-B.Choi, K.Matsugi, O.Yanagisawa]
通讯作者:
O.Yanagisawa
共 8 条
Development of manufacturing process for multi-functional metal matrix composites with high shape flexibility
-
批准号:21560771
-
项目类别:Grant-in-Aid for Scientific Research (C)
-
资助金额:$3.08万
-
财政年份:2009
-
负责人:SASAKI Gen
-
依托单位:
Microscopic analysis of deformation and fracture of metal matrix composites
-
批准号:09650749
-
项目类别:Grant-in-Aid for Scientific Research (C)
-
资助金额:$2.3万
-
财政年份:1997
-
负责人:SASAKI Gen
-
依托单位:
海外基金