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ANODIC BONDING BETWEEN CERAMICS AND METAL, AND ITS ANALYSIS OF BONDING MECHANISM

陶瓷与金属的阳极键合及其键合机理分析

基本信息

批准号：
16560634
负责人：
SASAKI Gen
金额：
$ 2.37万
依托单位：
HIROSHIMA UNIVERSITY
依托单位国家：
日本
项目类别：
Grant-in-Aid for Scientific Research (C)
财政年份：
2004
资助国家：
日本
起止时间：
2004 至 2005
项目状态：
已结题

项目摘要

Anodic bonding by lapping metal to ceramics and then applying electric al potential has grate-watched recently on the point of low-temperature bonding, Unfortunately, the effect of applied potential on the microstructure around bonded interface and the diffusion of the elements has still unknown. So that, it has unknown that the anodic bonding is suitable for the assemble technique for sensor and actuator. The aim of this study is to clarify the effect of the bonding conditions on the interfacial structure and to research the possibility for the application use. At first, in order to understand the effect of electrical potential on the atomic diffusion, metal film was evaporated on the ionic conductor and then the effect of the condition of the electrical potential on current density and microstructure were estimated. Ionic conductors used in this study were boro-silicate glass and sodium containing beta alumina Cathode side was glass and beta alumina, and Anode side was aluminum file … More side, respectively. As electrical potential with several potential patterns applied to aluminum coated ionic conductor at 523-673K, the change of electric current in aluminum coated glass and beta alumina was measured. Therefore, the electric current increased dramatically on the morrow of applying potential and show the maximum point and then decreased gradually. This phenomena is related with the mobility of sodium ion in ionic conductor quantitatively. As increasing treatment temperature, movable ions increased. But the increment of current density obtund as increasing temperature. From result of EPMA analysis and TEM observation, the content of sodium element decreased as approaching bonded interface, which is sodium depletion layer. This layer shows malignancy for use the sensor. Furthermore, aluminum element diffused in sodium depletion layer. As the sodium contents in glass are more than that in beta aluminum, the total current and the movement of sodium ion in beta aluminum is more than that of glass. Less

通过将金属研磨到陶瓷上然后施加电势的阳极键合最近在低温键合方面引起了人们的关注，不幸的是，施加电势对键合界面周围的微观结构和元素扩散的影响仍然未知。因此，阳极键合是否适用于传感器和执行器的组装技术尚不清楚。本研究的目的是阐明粘合条件对界面结构的影响并研究应用的可能性。首先，为了了解电势对原子扩散的影响，在离子导体上蒸发金属膜，然后估计电势条件对电流密度和微观结构的影响。本研究中使用的离子导体是硼硅酸盐玻璃和含钠β氧化铝，阴极侧分别为玻璃和β氧化铝，阳极侧分别为铝锉侧。当在523-673K下将具有多种电势模式的电势施加到镀铝离子导体时，测量了镀铝玻璃和β氧化铝中的电流变化。因此，电流在施加电位的第二天急剧增加并呈现最大点，然后逐渐减小。这种现象与钠离子在离子导体中的迁移率定量有关。随着处理温度的升高，可移动离子增加。但电流密度的增加随着温度的升高而减弱。从EPMA分析和TEM观察的结果来看，钠元素的含量随着接近键合界面（即贫钠层）而降低。该层显示出使用传感器的恶性程度。此外，铝元素在钠贫化层中扩散。由于玻璃中钠的含量比β铝多，因此β铝中钠离子的总电流和运动量比玻璃多。较少的

项目成果

期刊论文数量（26）

专著数量（0）

科研奖励数量（0）

会议论文数量（0）

专利数量（0）

Anodic Bonding and, its Interfacial Reaction between Metals and Ionic Conductor

阳极键合及其金属与离子导体之间的界面反应

DOI：
发表时间：
2006
期刊：
Proc.of 2nd JSME/ASME International Conference on Materials and Processing 2005 (CD-ROM)
影响因子：
0
作者：
G.Sasaki;K.Mastugi;O.Yanagisawa
通讯作者：
O.Yanagisawa

Anodic Bonding and its interfacial reaction of metals and ionic conductor

金属与离子导体的阳极键合及其界面反应

DOI：
发表时间：
2004
期刊：
Proc.of annual meeting for Japan institute of metals, chugoku, and shikoku branch. 12
影响因子：
0
作者：
G.Sasaki;K.Matsugi;O.Yanagisawa
通讯作者：
O.Yanagisawa

イオン伝導体/金属界面の電圧印加の影響

施加电压对离子导体/金属界面的影响

DOI：
发表时间：
2006
期刊：
日本金属学会中国四国支部鉄鋼47回金属第44回講演大会概要
影响因子：
0
作者：
佐々木元;亀島純一;松木一弘;柳澤平
通讯作者：
柳澤平

Effect of applied potential on interface between ionic conductor and metal.

施加电势对离子导体和金属之间界面的影响。

DOI：
发表时间：
2005
期刊：
Proc.of annual meeting for Japan institute of metals, chugoku, and shikoku branch. 27
影响因子：
0
作者：
H.Oka;G.Sasaki;K.Matsugi;O.Yanagisawa
通讯作者：
O.Yanagisawa

Anodic Bonding of metals and ionic conductor ceramics.

金属和离子导体陶瓷的阳极键合。