Development of Evaluation methods for mechanical properties in micro-sized components for MEMS devices

MEMS器件微型部件机械性能评价方法的开发

基本信息

  • 批准号:
    17560611
  • 负责人:
  • 金额:
    $ 2.18万
  • 依托单位:
  • 依托单位国家:
    日本
  • 项目类别:
    Grant-in-Aid for Scientific Research (C)
  • 财政年份:
    2005
  • 资助国家:
    日本
  • 起止时间:
    2005 至 2006
  • 项目状态:
    已结题

项目摘要

Firstly, bending tests were developed using micro-sized bending specimens made of SU-8 photo resist to clarify the bending properties of a micro-sized polymer. A digital microscope was used for the in situ observation of elastic and plastic deformation of cantilever type bend specimens, which had been cut from sheets using a laser cutting system. Loads were applied to these cantilevers using a mechanical testing machine, which was developed by us for micro-sized materials for Micro-electro mechanical systems (MEMS). Load-displacement curve under bending load conditions in micro-sized SU-8 specimens clearly shows ductile manner, although SU-8 is usually brittle material. Shear band like deformation was appeared near root of the specimens after maximum load, and then this plastic deformation area was expanded during loading. The ductile behavior in a micro-sized SU-8 may be caused by regional shear band deformation near the root.Secondly, micro-sized bending tests were performed using epoxy type photo-resist, SU-8, to clarify effects of a processing condition, UV exposure, Post baking and heat curing conditions on bending properties. Form the results in the first year, photo-masks for micro-sized bending specimens were planed. Load-displacement curves of most microsized SU-8 specimens show in an extremely ductile manner and all the specimens were failed by root of the beam. Young's modulus, Yield point and bending strength of SU-8 specimens remarkably increase with increasing exposure dose and heat curing. All the results clarify that bending properties of microsized photoresist are strongly affected by UV exposure and heat curing.
首先,使用由Su-8 Photo制成的微型弯曲标本抗澄清微型聚合物的弯曲特性,开发了弯曲测试。数字显微镜用于原位观察悬臂式弯曲样品的弹性和塑性变形,该样品已使用激光切割系统从板上切割。使用机械测试机将载荷用于这些悬臂,该机械测试机是为微型电动机械系统(MEMS)的微型材料开发的。微型SU-8标本中弯曲负荷条件下的负载置换曲线清楚地显示了延性方式,尽管Su-8通常是脆性材料。最大载荷后,出现了像剪切带一样的变形,然后在加载过程中扩大了该塑料变形区域。微型SU-8中的延性行为可能是由根部附近的区域剪切带变形引起的。第二,使用环氧类型的光抗光剂SU-8进行微型弯曲测试,以阐明处理条件,UV暴露,紫外线暴露,烘烤后和热固化条件对弯曲特性的影响。在第一年形成结果,计划了用于微型弯曲标本的照相罩。大多数微化SU-8试样的负载置换曲线以极为延展的方式显示出,所有样品都被梁的根而失败。 SU-8标本的Young模量,产量点和弯曲强度随着暴露剂量和热量固化的增加而显着增加。所有结果都阐明了微化光晶鼠的弯曲特性受紫外线暴露和热固化的强烈影响。

项目成果

期刊论文数量(7)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)
Bending deformation behaviour of a micro-sized SU-8 photo-resist for MEMS
MEMS 微型 SU-8 光刻胶的弯曲变形行为
マイクロサイズ曲げ試験によるMEMS用厚膜レジストSU-8の塑性変形挙動
通过微尺寸弯曲测试用于MEMS的厚膜抗蚀剂SU-8的塑性变形行为
MEMS用微小構造部材の接着強度測定評価法の開発と評価
MEMS微结构元件粘合强度测量与评价方法的开发与评价
Effects of Exposure on Bending Properties in Micro-sized Photo-resist for MEMS
曝光对 MEMS 微型光刻胶弯曲性能的影响
MEMS用フォトレジストのマイクロサイズ曲げ特性に及ぼす露光量の影響
曝光剂量对MEMS光刻胶微尺寸弯曲性能的影响
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