Development and Corrosion Rate and Corrosion Mechanism of Dental Ag-Pd-Cu-Au alloys.
Development and Corrosion Rate and Corrosion Mechanism of Dental Ag-Pd-Cu-Au alloys.
批准号:
62570861
负责人:
MATSUDA Koichi
金额:
$1.34万
依托单位国家:
日本
项目类别:
Grant-in-Aid for General Scientific Research (C)
财政年份:
1987
资助国家:
日本
项目状态:
已结题
起止时间:
1987 至 1988
中文摘要
1.腐蚀速率(I_<corr>)使用以下等式获得; I_<corr>= K/Rp(K:恒定值)。采用6种Ag-Pd合金、4种Ag-Pd-Cu合金、1种Ag-Cu合金和4种市售牙科银基铸造合金作为试样,0. 1% HCl-Ringer溶液(pH=2)作为试验溶液。总之,<corr>与I/Rp成比例变化的I_的范围最小为2.3 × 10^<-8>,最大为4.4 × 10^<-5>(A/cm ^2),而K值则位于13.5 ~ 25.9 mV之间。平均K值为20 mV。因此,牙科用Ag基合金的Icorr可简单地由上述方程中的Rp代替20 mV的K来估算。结果表明,恒电量法可用于牙科合金腐蚀速率的快速测定。2.采用电化学技术、X射线光电子能谱表面分析和反射电子衍射研究了一种Ag-Pd-Cu-Ag合金在0.9%NaCl溶液中的腐蚀行为。在-100mV的负电位或损耗下,未观察到所测试的合金的腐蚀。在OmV ~+300mV电位范围内,合金表面氧化形成AgCl、AgO、Cu_2O、CuO、Cu(OH)Cl、CuO和CuCl_2等表面膜。合金中的Pd在+400mV和+500mV下被氧化成PdO_2。在+400mV和+500mV下阳极氧化的样品表面存在AgCl和Cu(OH)_2。AgCl的量大于Cu(OH)_2的量。
英文摘要
1. Corrosion rate (I_<corr>) is obtained using the following equation; I_<corr> = K/Rp (K:constant value). Six kinds of Ag-Pd alloys, four kinds of Ag-Pd-Cu alloys, one Ag-Cu alloy, and four kinds of commercial dental Ag-based casting alloys were used for the specimen and 0.1% H Cl ringer solution at pH=2, was used at the test solution in the study. In summary, I_<corr>, which changed in proportion to I/Rp, ranged from 2.3 x 10^<-8> at minimum and 4.4 x 10^<-5>(A/cm^2) at maximum, whereas the K values were localized between 13.5 and 25.9mV. The average K value was 20mV. Therefore, the Icorr of dental Ag-based alloys was estimated simply from the Rp substituting 20mV for K of the above equation. These findings revealed that the Coulostatic method is useful for rapid determination of the corrosion rate of dental alloys. 2. The corrosion behavior of a commercial Ag-Pd-Cu-Ag alloy in 0.9% NaCl solution was investigated by an electrochemical technique, surface analysis of X-ray photoelectron spectroscopy and reflection electron diffraction. No corrosion of the alloy examined was observed at negative potentials of -100mV or loss. In the potential region from OmV to +300mV, the alloy may be oxidized to form surface films of AgCl, AgO, Cu_2O, CuO, Cu(OH)Cl, CuO and CuCl_2 on the basis of the equilibrium potential for this system. Pd in the alloy was oxidized to form PdO_2 at +400mV and at +500mV. AgCl and Cu(OH)_2 were found on the sample surface anodized at +400mV and +500mV. The amount of AgCl was greater than that of Cu(OH)_2.
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坂田秀行: 歯科材料・器械. 7. (1988)
Hideyuki Sakata:牙科材料和仪器 7. (1988)
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通讯作者:
坂田秀行: 歯科材料・器械. 7. 769-778 (1988)
Hideyuki Sakata:牙科材料和仪器 7. 769-778 (1988)
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Hideyuki SAKAI: "Meaurement of Polarization Resistance of Ag-Pd Binary Alloys by the Wave Current Linear Polarization Resistance Method the Coulostatic Method" The Journal of the Japanese Society for Dental Materials and Devices. 7. 270-278 (1988)
Hideyuki SAKAI:“通过波电流线性极化电阻法和恒电量法测量银-钯二元合金的极化电阻”日本牙科材料与设备学会杂志。
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Hideyuki SAKAI: "Evaluation of Corrosion of Dental Ag-based Alloys by Coulostatic Method" The Journal of the Japanese Society for Dental Materials and Devices. 7. 769-778 (1988)
Hideyuki SAKAI:“通过恒流法评估牙科银基合金的腐蚀”日本牙科材料与设备学会杂志。
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Koichi Matsuda: "In vitro Corrosion of Ag-Pd-Cu-Au Alloy in 0.9% NaCl Solution Part 1 Surface Analysis of Corrosion Products" Dental Materials Journal. 6. 1-8 (1987)
Koichi%20松田:%20"In%20vitro%20Corrosion%20of%20Ag-Pd-Cu-Au%20Alloy%20in%200.9%%20NaCl%20Solution%20Part%201%20Surface%20Analysis%20of%20Corrosion%20Products"%20Dental
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