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Study of Ion Beam Machining of Single Point Diamond Tools for Ultra-Precision Turning

超精密车削单点金刚石刀具离子束加工研究

基本信息

批准号：
63550109
负责人：
MIYAMOTO Iwao
金额：
$ 1.28万
依托单位：
Science University of Tokyo
依托单位国家：
日本
项目类别：
Grant-in-Aid for General Scientific Research (C)
财政年份：
1988
资助国家：
日本
起止时间：
1988 至 1989
项目状态：
已结题

项目摘要

In order to investigate reasons for the adhesion between diamond tools formed or sharpened with Ar ions and substrates to be turned, we have examined the crystallinity of diamond machined with argon ions and hydrogen plasma under various conditions by RHEED and microstrength of the processed diamond by Hertz indentation. Also, in order to evaluate the cutting performance of diamond knives finished with argon ions of 0.2 and 1.0 keV, a piece of Mouse liver enclosed within epoxy regions was cut with the processed diamond knives using a microtome. Moreover, a computer simulation method has been developed for predictions the profile changes and facets angle (angle of the negative land) of diamond tools. The conclusions are summarized as follows:(1) The damaged layer of the diamond specimen machined with argon ions of 1.0 key can be removed by the processing with hydrogen plasma at 800 - 850 ﾟC. (2) The diamond specimens machined with argon ions at 400 - 800 ﾟC have good crystallinity. (3) Microstrength of the diamond specimen machined with argon iong of 1.0 key is increased by the processing with hydrogen plasma. (4) Fine cut sections of mouse liver enclosed within epoxy resins can be obtained using a microtome with diamond knives sharpened by argon ions of 0.2 and 1.0 keV. (5) The computer simulation method is useful for the prediction of profile changes and facets angle of hemicylindrical object such as single point diamonnd diamond tools and diamond knives. (6) Fine surface of aluminum substrates can be not obtained with the processed single point diamond tools due to the surface contamination of the processed diamond tools during the fitting the diamond chip to a shank.

为了调查的原因，形成或尖锐的金刚石工具与Ar离子和基板之间的粘附要打开，我们已经研究了在各种条件下，通过RHEED和赫兹压痕加工金刚石的微观强度与氩离子和氢等离子体加工的金刚石的结晶度。此外，为了评估用0.2和1.0 keV氩离子处理的金刚石刀的切割性能，使用切片机用经过处理的金刚石刀切割了一块封闭在环氧树脂区域内的小鼠肝脏。此外，还提出了一种计算机模拟方法，用于预测金刚石工具的轮廓变化和刻面角（负刃面角）。结果表明：（1）在800 ~ 850 ℃温度范围内，氢等离子体处理可以去除1.0键氩离子加工金刚石试样的损伤层。(2)在400 ~ 800 ℃温度范围内用氩离子加工的金刚石试样具有良好的结晶度。(3)用氢等离子体处理1.0键长的金刚石试样，可提高其显微强度。(4)用0.2和1.0 keV的氩离子使金刚石刀锋利的切片机可以获得封入环氧树脂中的小鼠肝脏的细切切片。(5)计算机模拟方法可用于预测单点金刚石、金刚石工具和金刚石刀具等半圆柱体的轮廓变化和刻面角度。(6)由于在将金刚石芯片装配到柄部期间加工的金刚石工具的表面污染，用加工的单点金刚石工具不能获得铝基底的精细表面。