Reactive Ion Beam Machining of Diamond Tools

为了将氧、氢离子反应离子束加工应用于金刚石工具的超精密加工，主要研究了加工过程中离子能量、离子入射角、离子流密度和工件温度对金刚石（100）面加工率的影响。包括物理溅射和化学蚀刻的“活性”氧离子束加工的加工速率比仅引起物理溅射的使用“惰性”氩离子的离子束加工的加工速率快约十倍。此外，使用原子力显微镜测量的氧离子束加工后的金刚石芯片的表面粗糙度比加工前小约6倍。从加工特性，如加工速率的角度依赖性等，结果表明，氢离子束加工的机理是物理溅射，不存在化学反应，分子动力学模拟离子束加工是一种有效的方法，了解单晶金刚石的辐射损伤。

In order to apply the reactive ion beam machining with oxygen and hydrogen ions to ultra-precision processing of diamond tools, the dependence of the machining rate of (100) face of diamond chips on the ion energy, ion incidence angle, the ion current density and the wotk-piece temparature during processing were mainly investigated. The machining rate for "reactive" oxygen ion beam machining which includes both physical sputtering and chemical etching is about ten times faster than that for ion beam machining using "inert" argon ions which causes only physical sputtering. Moreover, the surface roughness of the diamond chip after oxygen ion beam machining which was measured using Atomic Force Microscope is about six times smaller than that before machining.From machining characteristics such as angular dependence of the machining rate and so on, it is concluded that machining mechanisum in the casehydrogen ions is physical sputtering without chemical reaction.Molecular dynamics simulation of ion beam machining is usefull for understanding the radiation damage of single crystal diamond.