Exposure assessment and health surveillance in compound semiconductor production

1. 工作环境和个人接触取样的暴露评估：在砷化镓硅片制造厂，测量了区域和个人样品的砷和镓浓度。工艺包括液体封装法（LEC）、铸锭切片法、晶圆研磨法、晶圆抛光法和金属有机气相外延法。大多数工艺中的砷/镓浓度极低。然而，LEC清洁工人的砷元素暴露水平相对较高。切割钢锭的工人可能会暴露在高浓度的砷化镓中。通过生物监测对砷化镓硅片生产企业的砷暴露进行生物监测，方法是对尿液和毛发中的砷进行化学种类测定。提示切锭工人尿中无机砷浓度升高。健康监测：对工人进行血液学、生化和免疫学测试，并测定尿卟啉代谢物（比例卟啉），以评估工人的健康状况。没有暴露相关的变化。结论：LEC清洗和铸锭切片是砷和砷化镓元素暴露水平较高的工序。然而，如果采用适当的控制技术，工人的健康状况是可以保持良好的。

1. Exposure assessment by working environment and personal exposure sampling : In a gallium arsenide wafers manufacturing plant, arsenic and gallium concentrations of area and personal samples were measured. Processes were Liquid Encapsulated Czochralski (LEC), ingot slicing, wafer lapping, wafer polishing, and Metal Organic Vapor Phase Epitaxy. Arsenic/gallium concentrations in most processes were extremely low. However, exposure levels to elemental arsenic of the LEC cleaning workers were relatively high. The ingot slicing workers could be exposed to high concentrations of gallium arsenide.2. Exposure assessment by biological monitoring : Biological monitoring of arsenic exposure in gallium arsenide wafer manufacturers was performed by chemical species determination of arsenic in urine and hair. It was suggested that urinary inorganic arsenic concentrations of the ingot slicing workers elevated.3. Health surveillance : Hematological, biochemical and immunological tests and determination of urinary porphyrin metabolites (coproporphyrins) were performed to assess the health status of the workers. There were no exposure-related change.4. Conclusion : The LEC cleaning and the ingot slicing processes were relatively high exposure levels to elemental arsenic and gallium arsenide. However, the health status of the workers could keep good if the proper control technology was used.