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STUDY ON DEVELOPMENT OF ATOMIC LAYER CONTROLLED CVD APPARATUS FOR FABRICATION PROCESS OF EXTREMELY LARGE SCALE INTEGRATED CIRCUITS

STUDY ON DEVELOPMENT OF ATOMIC LAYER CONTROLLED CVD APPARATUS FOR FABRICATION PROCESS OF EXTREMELY LARGE SCALE INTEGRATED CIRCUITS
超大规模集成电路制造工艺用原子层控制CVD装置的研制研究
批准号:
04555064
负责人:
MUROTA Junnichi
金额:
$10.69万
依托单位:
依托单位国家:
日本
项目类别:
Grant-in-Aid for Developmental Scientific Research (B)
财政年份:
1992
资助国家:
日本
项目状态:
已结题
起止时间:
1992 至 1994

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中文摘要
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英文摘要
Purpose of this study is to develop and to estabish novel CVD apparatus as an atomic layr epitaxy technology widely applied to Si extremely large scale integrated circuits. In this CVD,simple hydride gases, i.e.SiH_4 and GeH_4, are used as a reactant gas. In higher partial pressure range of the reactant gases (around a few Pa or a few hundreds Pa), adsorbed layr of the gases are formed, and then flash heating by the flash light shot results in the reaction of adsorbed molecules and single atomic layr epitaxy of Si and Ge. So far, we have developed flash heating CVD apparatus and have been realized the separation between adsorption and reaction of reactant gases. In this year, as the last year of the term, we have realized atomic layr growth of Si and Ge and an atomic layr superlattice structure of Si_1Ge_1. Finally, we have fabricated a double barrier resonant tunneling diode, and current peaks due to resonant tunneling effect were clearly observed in the current-voltage characteristic … More .Concretely itemizing,(1) concerning to control the crystal structure of the initial surface for atomic layr epitaxy, a dimer structure on Si (100) was clearly observed after exposing the surface to the air,(2) single atomic layr epitaxy of Ge on Si surface was realized by using flash heating CVD at 275゚C,(3) single atomic layr epitaxy of Si on Ge surface was realized by self-limiting thermal reaction of SiH_4 at 200-300゚C,(4) we have fabricated resonant tunneling diode with single Ge quantum well sandwiched by double Si_1 Ge_1 superlattice barriers, which were formed by alternately depositing the single atomic layrs of Si and Ge as stated in (2) and (3). All the process during/after growth of the double barrier structure were done below 300゚C.Negative resistance characteristic, in which clear current peaks appeared at the bias voltages of -0.6 V and 0.7 V approximately assigned to the predicted value, was observed.The success of this project supplies a key to atomic layr controlled process applied to device fabrication and we summarized this project. Less
期刊论文(33)
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会议论文
Junichi Murota: "Low-temperature epitaxial growth of Si/Si_<1-X>Ge_X/Si heterostructure by CVD(Invited)" Extended Abstracts of the 1993 International Conference on Solid State Devices and Materials. 240-242 (1993)
Junichi Murota:“通过CVD低温外延生长Si/Si_<1-X>Ge_X/Si异质结构(特邀)”1993年国际固态器件与材料会议的扩展摘要。
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櫻庭政夫: "Si(100)表面ダイマー構造の大気中での安定性" 電子情報通信学会技術報告. ED93-105. 1-6 (1993)
Masao Sakuraba:“Si(100) 表面二聚体结构在大气中的稳定性”IEICE 技术报告 ED93-105 (1993)。
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J.Murota: "Atomic Layer-by-Layer Epitaxy of Silicon and Germanium Using Flash Heating in CVD" Journal of de Physique IV. (発表予定). (1995)
J.Murota:“在 CVD 中使用快速加热进行硅和锗的原子层外延”,《Physique IV》杂志(即将出版)。
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Masao Sakuraba: "Stability of the dimer structure formed on Si(100) surface by ultraclean low-pressure chemical vapor deposition" Journal of Applied Physics. (発表予定). (1994)
Masao Sakuraba:“通过超净低压化学气相沉积在 Si(100) 表面形成的二聚体结构的稳定性”应用物理学杂志(即将出版)。
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