Development of high precision coordinate measurement machine with internal monitoring and thermal deformation compensation capability
开发具有内部监控和热变形补偿能力的高精度三坐标测量机
基本信息
- 批准号:07555357
- 负责人:
- 金额:$ 1.22万
- 依托单位:
- 依托单位国家:日本
- 项目类别:Grant-in-Aid for Scientific Research (A)
- 财政年份:1995
- 资助国家:日本
- 起止时间:1995 至 1996
- 项目状态:已结题
- 来源:
- 关键词:
项目摘要
To measure a mechanical part in high accuracy, a coordinate measurement machine (CMM) is generally located in the constant temperature room. However, it is rather difficult to locate a manufacturing tool in the constant temperature room. Therefore, clamp and unclamp sequences are repeated for machining and measurement. It reduces the machining accuracy. To overcome the problem, a coordinate measurement machine with high accuracy even in the variable temperature condition was developed in this research.Ten deformation sensors were attached on the structure of the CMM.As the deformation sensor is made of super-invar material with very low thermal expansion, only the thermal distortion of the machine itself is measured without influence of the thermal changes in the environment or in the machine structure.In the experiment the standard gauge was made using super-invar material. To compensate for the thermal deformation, a measurement space compensation matrix was prepared. Each element of the compensation matrix was calculated by a neural network integrated with genetic algorithm. The input to the neural network is the output from deformation sensors and temperature information of air and optical scales.Edge length and angle between two edges were maintained less than 15% and 30%, respectively.
为了高精度地测量机械零件,坐标测量机(CMM)通常位于恒温室中。然而,在恒温室中定位制造工具相当困难。因此,重复夹紧和松开顺序进行加工和测量。降低了加工精度。为了解决这一问题,本研究开发了一种在变温条件下仍具有高精度的三坐标测量机,在三坐标测量机的结构上安装了10个变形传感器,由于变形传感器采用热膨胀系数很小的超因瓦材料,仅测量机器本身的热变形,而不受环境或机器中的热变化的影响实验中用超因瓦材料制作了标准应变片。为了补偿热变形,准备了测量空间补偿矩阵。补偿矩阵的每个元素由一个神经网络结合遗传算法计算。神经网络的输入为变形传感器的输出以及空气秤和光学秤的温度信息,边缘长度和两边缘之间的夹角分别保持在15%和30%以内。
项目成果
期刊论文数量(8)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)
Okumura, T., Mitsuishi, M., Nagao, T., Nakao, M., Fukui, T.and Yoshioka, H.: ""High precision coordinate measurement machine in variable temperature environment, "" Prepr.Jpn.Soc.Prec.Eng.(Autumn Meeting). 559-560 (1995)
Okumura, T.、Mitsuishi, M.、Nagao, T.、Nakao, M.、Fukui, T. 和 Yoshioka, H.:““可变温度环境下的高精度坐标测量机”,“Prepr.Jpn.Soc.”
- DOI:
- 发表时间:
- 期刊:
- 影响因子:0
- 作者:
- 通讯作者:
Okumura,T.,et al.: "Thermal deformation compensation for a CMM using internal monitoring method" Proceedings of the 3rd CIRP Workshop on Design and Implementation of Intelligent Manufacturing Systems. 3. 214-217 (1996)
Okumura,T.,et al.:“使用内部监控方法对 CMM 进行热变形补偿”第三届 CIRP 智能制造系统设计与实施研讨会论文集。
- DOI:
- 发表时间:
- 期刊:
- 影响因子:0
- 作者:
- 通讯作者:
奥村努,光石衛,長尾高明,中尾政之,福井豊治,吉岡裕樹: "変温環境における三次元測定機の高精度化" 1995年度精密工学会秋季大会学術講演会論文集. 559-560 (1995)
Tsutomu Okumura、Mamoru Mitsuishi、Takaaki Nagao、Masayuki Nakao、Toyoharu Fukui、Hiroki Yoshioka:“提高可变温度环境下坐标测量机的精度”1995 年日本精密工程学会秋季会议学术会议论文集 559-560(1995 年)。 ) )
- DOI:
- 发表时间:
- 期刊:
- 影响因子:0
- 作者:
- 通讯作者:
Mitsuishi,M.,et al.: "System construction for intelligent manufacturing" Proceedings of the 3rd CIRP Workshop on Design and Implementation of Intelligent Manufacturing Systems. 3. 51-65 (1996)
Mitsuishi,M.,et al.:“智能制造的系统构建”第三届 CIRP 智能制造系统设计与实现研讨会论文集。
- DOI:
- 发表时间:
- 期刊:
- 影响因子:0
- 作者:
- 通讯作者:
Mitsuishi, M., et al.: "System construction for intelligent manufacturing" Proceedings of the 3nd CIRP Workshop on Design and Implementation of Intelligent Manufacturing Systems. 51-65 (1996)
Mitsuishi, M., et al.:“智能制造的系统构建”第三届 CIRP 智能制造系统设计与实现研讨会论文集。
- DOI:
- 发表时间:
- 期刊:
- 影响因子:0
- 作者:
- 通讯作者:
{{
item.title }}
{{ item.translation_title }}
- DOI:
{{ item.doi }} - 发表时间:
{{ item.publish_year }} - 期刊:
- 影响因子:{{ item.factor }}
- 作者:
{{ item.authors }} - 通讯作者:
{{ item.author }}
数据更新时间:{{ journalArticles.updateTime }}
{{ item.title }}
- 作者:
{{ item.author }}
数据更新时间:{{ monograph.updateTime }}
{{ item.title }}
- 作者:
{{ item.author }}
数据更新时间:{{ sciAawards.updateTime }}
{{ item.title }}
- 作者:
{{ item.author }}
数据更新时间:{{ conferencePapers.updateTime }}
{{ item.title }}
- 作者:
{{ item.author }}
数据更新时间:{{ patent.updateTime }}
NAGAO Takaaki其他文献
NAGAO Takaaki的其他文献
{{
item.title }}
{{ item.translation_title }}
- DOI:
{{ item.doi }} - 发表时间:
{{ item.publish_year }} - 期刊:
- 影响因子:{{ item.factor }}
- 作者:
{{ item.authors }} - 通讯作者:
{{ item.author }}
{{ truncateString('NAGAO Takaaki', 18)}}的其他基金
A study on ultra high speed micro-machining under SEM environment
SEM环境下超高速微加工研究
- 批准号:
08455068 - 财政年份:1996
- 资助金额:
$ 1.22万 - 项目类别:
Grant-in-Aid for Scientific Research (B)
相似海外基金
Determination of thermal deformation compensation formula for heat distortion, focusing on robustness and cost-efficiency
确定热变形的热变形补偿公式,重点关注稳健性和成本效益
- 批准号:
20K14632 - 财政年份:2020
- 资助金额:
$ 1.22万 - 项目类别:
Grant-in-Aid for Early-Career Scientists
Development of a technology to realize high-precision, space-based reflectors by quantification of thermal deformation due to manufacturing error
开发通过量化制造误差引起的热变形来实现高精度天基反射器的技术
- 批准号:
19J12182 - 财政年份:2019
- 资助金额:
$ 1.22万 - 项目类别:
Grant-in-Aid for JSPS Fellows
Investigation of photo-thermal deformation process in semi-shell nanostructures for developing dynamic plasmonic devices
研究半壳纳米结构的光热变形过程以开发动态等离子体器件
- 批准号:
15K13281 - 财政年份:2015
- 资助金额:
$ 1.22万 - 项目类别:
Grant-in-Aid for Challenging Exploratory Research
A Study on an Efficient Scheme for Steady-State Temperature and Thermal Deformation Predictions
稳态温度和热变形预测的有效方案研究
- 批准号:
24760667 - 财政年份:2012
- 资助金额:
$ 1.22万 - 项目类别:
Grant-in-Aid for Young Scientists (B)
Development of a simulation system of workpiece thermal deformation in grinding process
磨削过程中工件热变形模拟系统的研制
- 批准号:
23560127 - 财政年份:2011
- 资助金额:
$ 1.22万 - 项目类别:
Grant-in-Aid for Scientific Research (C)
Self-damage detection composite structure using thermal deformation caused by Joule heating
利用焦耳热引起的热变形检测自损伤复合结构
- 批准号:
21560079 - 财政年份:2009
- 资助金额:
$ 1.22万 - 项目类别:
Grant-in-Aid for Scientific Research (C)
Small Ultraprecision Positioning Device with Sub-nanometer Resolution Considering Thermal Deformation Drift
考虑热变形漂移的亚纳米分辨率小型超精密定位装置
- 批准号:
14350076 - 财政年份:2002
- 资助金额:
$ 1.22万 - 项目类别:
Grant-in-Aid for Scientific Research (B)
Thermal Deformation Analysis of Electronic Packages by Moire Interferometry and Phase-Shifting Method
莫尔干涉和相移法对电子封装的热变形分析
- 批准号:
13650091 - 财政年份:2001
- 资助金额:
$ 1.22万 - 项目类别:
Grant-in-Aid for Scientific Research (C)
Feedback system for compensating of joint runout and thermal deformation in parallel kinematic machine
并联运动机中补偿关节跳动和热变形的反馈系统
- 批准号:
13650150 - 财政年份:2001
- 资助金额:
$ 1.22万 - 项目类别:
Grant-in-Aid for Scientific Research (C)
Development of thermal deformation speed controlled super precision grinding
热变形速度控制超精密磨削的开发
- 批准号:
10650115 - 财政年份:1998
- 资助金额:
$ 1.22万 - 项目类别:
Grant-in-Aid for Scientific Research (C)














{{item.name}}会员




