A study on ultra high speed micro-machining under SEM environment

SEM环境下超高速微加工研究

• 批准号: 08455068
• 负责人: NAGAO Takaaki
• 金额: $ 4.35万
• 依托单位: The University of Tokyo
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (B)
• 财政年份: 1996
• 资助国家: 日本
• 起止时间: 1996 至 1997
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-08455068/
• 关键词: Micro-Cutting; Single Crystal Silicon; Scanning Electron Microscope; Ductile-Mode Cutting; Brittle-Mode Cutting; Dependency of Crystal Direction; Tele-Micro-Cutting; Stereo Vision; 超精密加工; 硬脆材料; 真空中加工; 応力場制御; ガラスの加工; 酸化マグネシウムの加工; クラック

The possibility of ductile mode cutting considering the crystal direction of silicon was examined using the micro machining machine (MMM) which has the stereo vision and micro force measurement capability.The micro-machining machine (MMM) has three degrees of freedom. The workpiece table translates in the X and Y directions and the tool moves in the Z direction. The translational mechanism uses ball screws and cross roller guides and is driven by ultrasonic motors with encoders. The working table is inclined at an angle of 60 degrees for optimal viewing under the SEM.The MMM has a rough positioning table to set the machining point at the center of the field of observation, with a three-axis force sensing table mounted on the XY-table. The sensing table is made of aluminum alloy and incorporates a parallel plate structure with strain gauge sensors.Dependency of crystal direction while scratching a single crystal silicon was examined. Cutting experiments were performed in 4 directions, s … More uch as {100}<100>.{100}<110>, {110}<100> and {110}<100>. The friction coefficient in {100}<100> direction was larger than friction coefficients in other directions. Furthermore, the depth of cut while cutting in {100}<100> direction was larger than the other cases. Concerning the surface damage, crack and shell type wear were appeared on silicon after cutting tool's passing while cutting in <110> direction where the friction coefficient was small.At <100> two sliding surfaces are active and, on the contrary, at <110> three sliding surfaces are active. At the same vertical force the depth of cut becomes large in <100> direction cutting and, therfore, the friction coefficient is large.Based on the crystal direction dependency analysis, cutting experiment was performed for single crystal silicon. Ductile mode cutting was realized by reducing the depth of cut and considering the crystal direction.Furthermore, the MMM was controlled from the remote place using the optical fiber and computer network. It is possible to control the system using stereo vision and a 3 dimensional joystick with force feedback capability. Less

利用具有立体视觉和微力测量功能的三自由度微机械加工机床（MMM），研究了考虑硅晶向的延性模式切削的可能性。工件台在X和Y方向平移，刀具在Z方向移动。平移机构使用滚珠丝杠和交叉滚子导轨，并由带编码器的超声波电机驱动。工作台倾斜60度，以便在扫描电镜下进行最佳观察。MMM有一个粗略定位台，用于将加工点设置在观察区域的中心，XY工作台上安装有一个三轴力传感台。传感台由铝合金制成，采用平行板结构，并带有应变片传感器，研究了单晶硅划痕时的晶向依赖性。在4个方向上进行了切割实验， ...更多信息 例如{100}<100>。{100}<110>，{110}<100>和{110}<100>。{100}方向的摩擦系数<100>大于其他方向的摩擦系数。此外，沿{100}方向切割时的切割深度<100>大于其他情况。在表面损伤方面，沿摩擦系数较小的方向切削时，刀具通过后，硅片表面出现裂纹和壳型磨损<110>，<100>两个滑动面处为活动面，<110>三个滑动面处为活动面。在相同的垂直力作用下，定向切削的切削深度变大<100>，摩擦系数增大。在分析晶体方向相关性的基础上，对单晶硅进行了定向切削实验。通过减小切割深度并考虑晶向，实现延性模式切割，并利用光纤和计算机网络远程控制MMM。可以使用立体视觉和具有力反馈能力的三维操纵杆来控制系统。少

项目成果

Mitsuishi, M., Sugita, N., Nagata, T., Hatamura, Y.and Nagao, T.: "Tele-Micro Machining System Under Scanning Electron Microscope with Operational Environment Transmission Capability" Proc.JSME 72nd Spring Meeting. no.VI. 289-292 (1995)

Mitsuishi, M.、Sugita, N.、Nagata, T.、Hatamura, Y.和 Nagao, T.：“具有操作环境传输能力的扫描电子显微镜下的远程微加工系统”Proc.JSME 第 72 届春季会议。

Sugita, N., Ohya, S., Mitsuishi, M.and Nagao, T.: "A research on micro-cutting under scanning electron microscope" Proc.JSME Robotics and Mechatronics Meeting. 93-94 (1997)

Sugita, N.、Ohya, S.、Mitsuishi, M. 和 Nagao, T.：“扫描电子显微镜下微切割的研究”Proc.JSME 机器人与机电一体化会议。

Mitsuishi, M., Sugita, N., Nagao, T., Hashimoto, H.and Hatamura, Y.: "A trial of tele-micro-machining with endmill between Japan and German using ISDN" Proc.JSME 73rd Spring Meeting. no.IV. 486-487 (1996)

Mitsuishi, M.、Sugita, N.、Nagao, T.、Hashimoto, H. 和 Hatamura, Y.：“日本和德国之间使用 ISDN 进行远程微加工立铣刀试验”Proc.JSME 第 73 届春季会议。

Nakao, M., Kai, M., Hatamura, Y.and Mitsuishi, M.: "Development of a lathe for a micro-diameter workpiece cutting using ultra high speed spindle" Proc.JSME 75th Spring Meeting. (will appear). (1998)

Nakao, M.、Kai, M.、Hatamura, Y. 和 Mitsuishi, M.：“开发使用超高速主轴进行微直径工件切削的车床”Proc.JSME 第 75 届春季会议。

光石 衛, 他: "SEM環境下のマイクロ・マシニング・システムを用いた切削力の測定" 1995年度精密工学会秋季大会学術講演会論文集. 63-64 (1995)

Mamoru Mitsuishi等人：“SEM环境下使用微加工系统测量切削力”1995年日本精密工程学会秋季会议学术会议记录63-64（1995）。