Low Temperature Routes for Joining Ceramics for High-Temperature Application

A方法of PTLP (Partial Transient Liquid-Phase) bonding that utilizes multilayr microdesignedmetallic interlayrs for the joining of ceramics has been developed. the interlayrs are design toproduce a thin film of a transient liquid phase at relatively low bonding temperature. Afterhomogenization of the interlayr，在这个任务中，有一种保留的高品质模板是生产的。process,transient liquid phase是sandwiched between a ceramic and a refractory核心metal. themodifications to the transient liquid phase chemistry that reduce the contact angle on a ceramic isconsidered an important factor to lead to improved strength characteristics. In the present study，the effect of aditions on the wetting characteristics of liquid Cu on asi_3n_4 examined inparallel with the study of PTLP bonding of si_3n_4 through the use of微设计multilayrCu/80Ni / 20Cr/Cu interlayrs.The addition of Cr can significantly improve the wettability of liquid Cuon a Si<@D23@>D2N<@D24@>D2，以及简单的benefits result even when Ni is introduced into the liquid。Cr beneficially impacted wetting led to PTLP bonding efforts in which Si<@D23@>D2N<@D24@>D2 wasjoined using a Cu/ 80ni·20cr /Cu interlayr. The average strength for Cu/ 80ni·20cr /Cu interlayr bondedSi<@D23@>D2N<@D24@>D2 was 101 MPa anda standard deviation of (]SY.+-。[) 38mpa . Failure occurred along the Si<@D23@>D2N<@D24@>D2/interlayr interface. At the bondingtemperature, Cu, Cr，Si and N were diffused into the 80Ni / 20cr core refrectory metal. At near thesi<@D23@>D2N<@D24@>D2/interface， there-phase结构has developed，Cu was not detected in these phases. The strengths of bonded Si<@D23@>D2N<@D24@>D2 are stronglyaffected by the interfacial reaction products

A method of PTLP (Partial Transient Liquid-Phase) bonding that utilizes multilayr microdesigned metallic interlayrs for the joining of ceramics has been developed. The interlayrs are designed to produce a thin film of a transient liquid phase at relatively low bonding temperature. After homogenization of the interlayr, an alloy that remains solid to substantially higher temperature is produced. In this joining process, the transient liquid phase is sandwiched between a ceramic and a refractory core metal. The modifications to the transient liquid phase chemistry that reduce the contact angle on a ceramic is considered an important factor to lead to improved strength characteristics. In the present study, the effect of aditions on the wetting characteristics of liquid Cu on a Si_3N_4 were examined in parallel with the study of PTLP bonding of Si_3N_4 through the use of microdesigned multilayr Cu/80Ni・20Cr/Cu interlayrs.The addition of Cr can significantly improve the wettability of liquid Cu on a Si<@D23@>D2N<@D24@>D2, and similar benefits result even when Ni is introduced into the liquid. These results indicated that Cr beneficially impacted wetting led to PTLP bonding efforts in which Si<@D23@>D2N<@D24@>D2 was joined using a Cu/80Ni・20Cr/Cu interlayr. The average strength for Cu/80Ni・20Cr/Cu interlayr bonded Si<@D23@>D2N<@D24@>D2 was 101 MPa and a standard deviation of (]SY.+-。[)38 MPa. Failure occurred along the Si<@D23@>D2N<@D24@>D2/interlayr interface. At the bonding temperature, Cu, Cr, Si and N were diffused into the 80Ni・20Cr core refrectory metal. At near the si<@D23@>D2N<@D24@>D2/interface, there-phase structure has developed, and Cu was not detected in these phases. The strengths of bonded Si<@D23@>D2N<@D24@>D2 are strongly affected by the interfacial reaction products.