权益分类	功能权益	普通用户	{{item.name}}会员
{{category.name}}	{{benefitItem.name}}

Low Temperature Routes for Joining Ceramics for High-Temperature Application

高温应用陶瓷连接的低温途径

基本信息

批准号：
07555524
负责人：
MORI Katsumi
金额：
$ 0.7万
依托单位：
KYUSHU UNIVERSITY
依托单位国家：
日本
项目类别：
Grant-in-Aid for Scientific Research (A)
财政年份：
1995
资助国家：
日本
起止时间：
1995 至 1996
项目状态：
已结题

来源：
https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-07555524/
关键词：
Alumina Wettability PTLP bonding Ceramics Silicon nitride Copper Bending strength セラミック接合 PTLP法界面反応

项目摘要

A method of PTLP (Partial Transient Liquid-Phase) bonding that utilizes multilayr microdesigned metallic interlayrs for the joining of ceramics has been developed. The interlayrs are designed to produce a thin film of a transient liquid phase at relatively low bonding temperature. After homogenization of the interlayr, an alloy that remains solid to substantially higher temperature is produced. In this joining process, the transient liquid phase is sandwiched between a ceramic and a refractory core metal. The modifications to the transient liquid phase chemistry that reduce the contact angle on a ceramic is considered an important factor to lead to improved strength characteristics. In the present study, the effect of aditions on the wetting characteristics of liquid Cu on a Si_3N_4 were examined in parallel with the study of PTLP bonding of Si_3N_4 through the use of microdesigned multilayr Cu/80Ni・20Cr/Cu interlayrs.The addition of Cr can significantly improve the wettability of liquid Cu on a Si<@D23@>D2N<@D24@>D2, and similar benefits result even when Ni is introduced into the liquid. These results indicated that Cr beneficially impacted wetting led to PTLP bonding efforts in which Si<@D23@>D2N<@D24@>D2 was joined using a Cu/80Ni・20Cr/Cu interlayr. The average strength for Cu/80Ni・20Cr/Cu interlayr bonded Si<@D23@>D2N<@D24@>D2 was 101 MPa and a standard deviation of (]SY.+-。[)38 MPa. Failure occurred along the Si<@D23@>D2N<@D24@>D2/interlayr interface. At the bonding temperature, Cu, Cr, Si and N were diffused into the 80Ni・20Cr core refrectory metal. At near the si<@D23@>D2N<@D24@>D2/interface, there-phase structure has developed, and Cu was not detected in these phases. The strengths of bonded Si<@D23@>D2N<@D24@>D2 are strongly affected by the interfacial reaction products.

提出了一种利用多层微设计金属夹层连接陶瓷的PTLP （Partial Transient Liquid-Phase）键合方法。所述夹层被设计成在相对较低的键合温度下产生瞬态液相薄膜。在层间均匀化之后，合金在更高的温度下仍然是固体。在这种连接过程中，瞬态液相夹在陶瓷和耐火芯金属之间。对瞬态液相化学进行修饰，减少陶瓷表面的接触角，被认为是提高陶瓷强度特性的重要因素。在本研究中，通过微设计多层Cu/80Ni·20Cr/Cu中间层，研究了添加物对液态Cu对Si_3N_4润湿特性的影响，同时研究了Si_3N_4的PTLP键合。Cr的加入可以显著提高液体Cu在Si<@D23@>D2N<@D24@>D2上的润湿性，即使在液体中加入Ni也有类似的效果。这些结果表明，Cr有利于影响润湿导致PTLP键合，其中Si<@D23@>D2N<@D24@>D2通过Cu/80Ni·20Cr/Cu中间层连接。Cu/80Ni·20Cr/Cu层间键合Si<@D23@>D2N<@D24@>D2的平均强度为101 MPa，标准差为(]SY.+-。() 38 MPa。沿Si<@D23@>D2N<@D24@>D2/层间界面发生故障。在键合温度下，Cu、Cr、Si和N扩散到80Ni·20Cr的核心耐火金属中。在si<@D23@>D2N<@D24@>D2/界面附近，有相结构发育，这些相中未检测到Cu。界面反应产物对键合Si<@D23@>D2N<@D24@>D2的强度影响较大。