Development of graded heat-resisting Ti base material by gas-deposition

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Titanium-aluminide is expected as a material for high-temperature use because it has the excellent properties up to 1000 degrees centigrade. For example, it increases strength with increase of temperature and keeps fairly good resistance to oxidation up to 900 degrees centigrade. However, the main reason not to get the reliability for actual usage is its low ductility at room temperature.The aim of this study is to develop the material that has the graded composition between the high temperature side of titanium-aluminide and the low temperature side of a titanium alloy so as to make up for the low ductility of titanium aluminide and reduce the thermal stress by gas deposition method.Gas deposition system has three chambers, two chambers are for evaporation of aluminum and titanium and one is for deposition of aluminum and titanium fine particles.The conditions of evaporation and gradation of titanium and alminum are elucidated through this study.