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Surface Patterning of Aluminum Using Pulsed-YAG Laser

使用脉冲 YAG 激光对铝进行表面图案化

基本信息

批准号：
08455326
负责人：
TAKAHASHI Hideaki
金额：
$ 4.48万
依托单位：
HOKKAIDO UNIVERSITY
依托单位国家：
日本
项目类别：
Grant-in-Aid for Scientific Research (B)
财政年份：
1996
资助国家：
日本
起止时间：
1996 至 1998
项目状态：
已结题

项目摘要

Aluminum specimen covered with porous anodic oxide films was irradiated with a pulsed Nd-YAG laser in solutions containing metal ions, and then electro- or electroless- plating was carried out. Fine pattern was produced on an insulating organic board by the successive processes of anodizing, laser irradiation, metal deposition, insulator gluing, and metal substrate dissolution.The main results obtained in this investigation are in the following.1) Reaction during laser irradiationIt was found that laser irradiation causes the anodic oxide film to be removed effectively from the substrate at the laser-irradiated area, and that the film removal can be explained in terms of the laser ablation of the metal substrate. Spot size, D, and line width, W, of laser irradiated area was examined as the functions of laser power, distance between lens and specimen, and focal length of lens, and the D and W was found to be controlled in the range 15- 500 mm.During laser irradiation in solutions contai … More ning Pd2+, Cu2+, and Ni2+ ions, fine particles of metals, Pd, Cu, and Ni, deposited on the surface at the laser-irradiated area, and this was verified by XPS and rest potential measurements. This is due to the redox reaction between metal ions and the aluminum substrate.2) Metal deposition after laser irradiationDuring cathodic polarization of the specimen in the solution containing Cu2+ or Ni2+ ions after laser irradiation lead to the deposition of a dense layer of Cu or Ni only at the film-removed area. The current efficiency for Cu or Ni deposition was about 100 %.Localized electroless plating of Ni-P was also accomplished at the laser-irradiated area by changing the Pb2+ ion concentration in the electroless plating solution. At the initial stage of the Ni-P electroless plating, the fine particles depositing during laser irradiation were observed to act as nuclei of Ni-P deposition. The Pd particles enhanced Ni-P deposition very much, while Cu particles did not show any effect.3) Fine patterning on organic insulating boardBy computer control, fine patterns could be drawn, using Ni and Cu deposition after laser irradiation on aluminum. The patterned specimen was glued on a glass fiber-reinforced epoxy resin board, and the metal substrate was removed by dissolution in NaOH solution. The successive processes showed a possibility of the development of a new technology in the printed wiring board manufacturing industry. Less

在含有金属离子的溶液中，用脉冲激光照射覆盖有多孔阳极氧化膜的铝试件，进行电镀或化学镀。通过阳极氧化、激光照射、金属沉积、绝缘体粘合和金属基板溶解等一系列工艺过程，在绝缘有机基板上形成了精细的图形。主要研究结果如下：1)激光照射过程中的反应发现，激光照射可以有效地从激光照射区域的基板上去除氧化膜，并且膜的去除可以用激光烧蚀金属基板来解释。研究了激光照射区域的光斑大小D和线宽W随激光功率、透镜与样品的距离和透镜焦距的变化，发现D和W控制在15-500 mm范围内。在含有…的溶液中进行激光照射时，D值和W值均控制在15-500 mm之间在激光辐照区域表面沉积了更多的Pd2+，Cu2+和Ni2+离子，金属Pd，Cu2+和Ni2+的细小颗粒，这一点通过XPS和静态电位测量得到了证实。这是由于金属离子和铝衬底之间的氧化还原反应造成的。2)激光照射后的金属沉积在含有Cu2+或Ni2+的溶液中的阴极极化过程中，激光照射后样品在含有Cu2+或Ni2+离子的溶液中只在去除薄膜的区域沉积了一层致密的铜或镍。通过改变镀液中Pb2+离子的浓度，在激光照射区域实现了化学镀镍磷的局域化。在化学镀Ni-P初期，观察到激光辐照过程中沉积的微粒是化学镀Ni-P的核心。Pd颗粒对Ni-P的沉积有很大的促进作用，而Cu颗粒没有明显的促进作用。3)在有机绝缘板上进行精细图案化。通过计算机控制，利用激光照射铝后沉积的Ni和Cu，可以绘制出精细的图样。将图案化的试件粘在玻璃纤维增强的环氧树脂板上，用氢氧化钠溶液溶解去除金属衬底。连续的工艺表明，在印刷线路板制造业中开发一种新技术是可能的。较少