Surface Patterning of Aluminum Using Pulsed-YAG Laser

在含有金属离子的溶液中，用脉冲Nd-YAG激光器对表面覆盖有多孔阳极氧化膜的铝试样进行辐照，然后进行电镀或化学镀。通过阳极氧化、激光照射、金属沉积、绝缘体胶合和金属基板溶解等一系列工艺，在绝缘有机板上形成精细图形，主要研究结果如下：1）激光照射过程中的反应研究发现，激光照射可以有效地去除基板上激光照射区域的阳极氧化膜，并且膜的去除可以根据金属衬底的激光烧蚀来解释。研究了激光辐照区的光斑尺寸D和线宽W与激光功率、透镜与试样的距离以及透镜的焦距的关系，发现D和W控制在15- 500 mm范围内。 关于我们 Ning Pd 2+，Cu 2+和Ni 2+离子，金属，Pd，Cu和Ni的细颗粒，沉积在激光照射区域的表面上，这通过XPS和静止电位测量来验证。这是由于金属离子与铝基体之间的氧化还原反应。2）激光辐照后的金属沉积在阴极极化过程中，激光辐照后的试样在含有Cu ~（2+）或Ni ~（2+）离子的溶液中仅在去膜区域沉积一层致密的Cu或Ni。通过改变化学镀液中Pb ~（2+）的浓度，在激光照射区域实现了局部化学镀Ni-P。在Ni-P化学镀的初期，激光照射下沉积的微粒是Ni-P沉积的核心。Pd颗粒对Ni-P沉积有很大的促进作用，而Cu颗粒对Ni-P沉积没有明显的促进作用。3）有机绝缘板上的精细图形化通过计算机控制，可以在激光照射后的铝上用Ni和Cu沉积绘制精细图形。将图案化的样品胶合在玻璃纤维增强的环氧树脂板上，并且通过在NaOH溶液中溶解来去除金属基底。连续的过程显示了在印刷线路板制造业中开发新技术的可能性。少

Aluminum specimen covered with porous anodic oxide films was irradiated with a pulsed Nd-YAG laser in solutions containing metal ions, and then electro- or electroless- plating was carried out. Fine pattern was produced on an insulating organic board by the successive processes of anodizing, laser irradiation, metal deposition, insulator gluing, and metal substrate dissolution.The main results obtained in this investigation are in the following.1) Reaction during laser irradiationIt was found that laser irradiation causes the anodic oxide film to be removed effectively from the substrate at the laser-irradiated area, and that the film removal can be explained in terms of the laser ablation of the metal substrate. Spot size, D, and line width, W, of laser irradiated area was examined as the functions of laser power, distance between lens and specimen, and focal length of lens, and the D and W was found to be controlled in the range 15- 500 mm.During laser irradiation in solutions contai … More ning Pd2+, Cu2+, and Ni2+ ions, fine particles of metals, Pd, Cu, and Ni, deposited on the surface at the laser-irradiated area, and this was verified by XPS and rest potential measurements. This is due to the redox reaction between metal ions and the aluminum substrate.2) Metal deposition after laser irradiationDuring cathodic polarization of the specimen in the solution containing Cu2+ or Ni2+ ions after laser irradiation lead to the deposition of a dense layer of Cu or Ni only at the film-removed area. The current efficiency for Cu or Ni deposition was about 100 %.Localized electroless plating of Ni-P was also accomplished at the laser-irradiated area by changing the Pb2+ ion concentration in the electroless plating solution. At the initial stage of the Ni-P electroless plating, the fine particles depositing during laser irradiation were observed to act as nuclei of Ni-P deposition. The Pd particles enhanced Ni-P deposition very much, while Cu particles did not show any effect.3) Fine patterning on organic insulating boardBy computer control, fine patterns could be drawn, using Ni and Cu deposition after laser irradiation on aluminum. The patterned specimen was glued on a glass fiber-reinforced epoxy resin board, and the metal substrate was removed by dissolution in NaOH solution. The successive processes showed a possibility of the development of a new technology in the printed wiring board manufacturing industry. Less