DEVELOPMENT OF TUNNELING-CURRENT-CONTROLLED THIN FILM TRANSISTORS APPLYING SCHOTTKY CONTACTS

应用肖特基接触的隧道电流控制薄膜晶体管的开发

基本信息

项目摘要

We made attempts to develop tunneling-current controlled thin film transistor (TFTs) applying Schottky contacts at source and drain, and obtained the results as follws :(1)Improvements of fabrication process for Schottky contacts in poly-Si TFTsPd silicide which was prepared by evaporating Pd and annealing at 250゚C was found to be most suitable for Schottky contacts. However, there was still a problem in which the source/drain was short-circuited to the gate electrode due to the deposited Pd on the side wall of gate insulator. This problem was solved by improving the progress in the following way.・The etching period for removing native oxide before Pd evaporation was increased in order to assure sufficient side-etching of the gate oxide.・The thickness of Pd was minimized to form silicide entirely during the annealing at 250゚C.(2)Operation as a p-channel conventional FETAlthough the tunneling-current-controlled TFTs were found to have a high transconductance, a large leakage current was observed because of hole injection from the drain. However, when the TFTs were operated in conventional p-channel FET mode, the hole field-effect mobility as high as 15 cm^2/Vs was achieved with a low leakage surrent. This value can be well compared to those for electrons of 20 cm^2/Vs in conventional n-channel poly-Si TFTs. This result may suggest tunneling-current-controlled mode to be suitable for p-channel FETs with a high transconductance.3)Precise measurement of contact resistance at source/drain with Schottky barrier contact by Gate-Four-Probe methodWe measured precisely the contact resistance at source/drain with Schottky barrier contact using a Gate-Four-Probe method. It was found that the contact resistance decreased exponentially with increasing gate voltage ; this confirmed that the tunneling-current through the Schottky barrier was able to be controlled by gate voltage.
我们尝试在源极和漏极处采用肖特基触点来开发隧道电流控制薄膜晶体管(TFTs),并取得了以下结果:(1)改进了采用蒸发Pd并在250℃下退火制备的聚硅TFTsPd硅化物中肖特基触点的制备工艺,得到了最适合肖特基触点的材料。但是,由于栅极绝缘子侧壁上沉积的Pd,仍然存在源极/漏极短路到栅极的问题。通过以下方式改进进度,解决了这个问题。·增加了Pd蒸发前去除原生氧化物的蚀刻周期,以确保栅极氧化物有足够的侧蚀刻。在250℃的退火过程中,Pd的厚度被最小化以完全形成硅化物。(2)作为p沟道的传统晶体管工作虽然发现隧道电流控制的tft具有高的跨导性,但由于漏极的空穴注入而观察到大的泄漏电流。然而,当TFTs在传统p沟道FET模式下工作时,空穴场效应迁移率高达15 cm^2/Vs,漏电流低。这个值可以很好地与传统n沟道多晶硅tft中20 cm^2/Vs的电子相比较。这一结果可能表明隧道电流控制模式适用于具有高跨导的p沟道场效应管。采用栅极四探针法精确测量了肖特基势垒触点源漏端接触电阻,测量了肖特基势垒触点源漏端的接触电阻。接触电阻随栅极电压的增大呈指数减小;这证实了通过肖特基势垒的隧穿电流可以由栅极电压控制。

项目成果

期刊论文数量(3)
专著数量(0)
科研奖励数量(0)
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Junj Shirafuji: ""Polycrystalline Si TFTs with Schottky-Barrier Contracts at Source and Drain"" Technology Report of the Osaka University. Vol.47, No.2290. 195-203 (1997)
Junj Shirafuji:““源极和漏极具有肖特基势垒契约的多晶硅 TFT””大阪大学的技术报告。
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JUNJI SHIRAFUJI: "Polycrystalline Si TFTs with Schottky-Barrier Contacts at Source and Drain" Technology Report of the Osaka University. 47. 195-203 (1997)
JUNJI SHIRAFUJI:大阪大学的技术报告“在源极和漏极具有肖特基势垒接触的多晶硅 TFT”。
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SHIRAFUJI Junji其他文献

SHIRAFUJI Junji的其他文献

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{{ truncateString('SHIRAFUJI Junji', 18)}}的其他基金

DIELECTRIC PROPERTIES IN ORIENTED THIN FILMS OF TUNGUSTEN-BRONZE-TYPE FERROELECTRIC Ba_6Ti_2Nb_8O_<30>
钨青铜型铁电体Ba_6Ti_2Nb_8O_<30>定向薄膜的介电性能
  • 批准号:
    12650326
  • 财政年份:
    2000
  • 资助金额:
    $ 4.48万
  • 项目类别:
    Grant-in-Aid for Scientific Research (C)
Electrical Conduction Mechanism and Improvement of Odor Discrimination Ability in Chemisorption-Type Solid-State Sensors
化学吸附型固态传感器的导电机制及气味辨别能力的提高
  • 批准号:
    10650347
  • 财政年份:
    1998
  • 资助金额:
    $ 4.48万
  • 项目类别:
    Grant-in-Aid for Scientific Research (C)
Tunnel injection of electron into diamond and its application to cold cathode
电子隧道注入金刚石及其在冷阴极中的应用
  • 批准号:
    07455141
  • 财政年份:
    1995
  • 资助金额:
    $ 4.48万
  • 项目类别:
    Grant-in-Aid for Scientific Research (B)

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