Thin Layer Deposition

薄层沉积

• 批准号: 528399093
• 金额: --
• 依托单位: Westsächsische Hochschule Zwickau
• 依托单位国家: 德国
• 项目类别: Major Research Instrumentation
• 财政年份: 2023
• 资助国家: 德国
• 起止时间: 2022-12-31 至 无数据
• 项目状态: 未结题
• 来源: https://gepris.dfg.de/gepris/projekt/528399093?language=en
• 关键词: Thin; Layer; Deposition

Thin layers with thicknesses in the range of nanometres up to a few micrometres are an integral component of modern micro and nano systems. They incur several functions within the finished MEMS. The layers can serve as contact surfaces, conducting paths, passivation layers or diffusion barriers. Furthermore, they serve as hard masks or as sacrificial layers within the processing of the MEMS device. Mostly standardized processes such as photolithography lift-off processes, wet chemical and dry etching processes allow the structuring of those layers in the lateral range of micrometres down to nanometres. A versatile standard method of depositing thin layers is the sputter deposition. Ions generated in a plasma are accelerated to the target material and therefor erode its surface. Starting from the target, a particle stream is created, the target material subsequently condenses as a growing layer on the wafer. The layer properties are mainly determined by the kinetic energy of the particles and thus the diffusion length on the surface. Accordingly, the properties can be influenced by a variety of parameters during the deposition. Here the superposition of a high-frequency field, the use of magnetic sources (magnetron) and the application of a bias should be mentioned. Last but not least, the wide range of possible materials to be deposited (metals, semiconductors, dielectrics) makes sputter deposition a fundamental process of the production of micro- and nanosystems. This selection can be further expanded by the consideration of reactive processes during deposition. As part of the high-tech centre of the University of Applied Sciences Zwickau, a laboratory complex with 680 square meters of ISO class 4 and 5 clean rooms is being built. The concept of this cleanroom includes the interdisciplinary research and teaching with a focus on microsystems technology and nanotechnology with the participation of two faculties. The sputtering tool plays a key role within in the closed process chain of research and development in these research fields. In addition to the use of the tool for routine tasks of the semiconductor device development such as metallization, it also offers the opportunity to continue and intensify existing fields of research and add fundamentally new aspects.

厚度在纳米到几微米范围内的薄层是现代微米和纳米系统的组成部分。它们在成品 MEMS 中具有多种功能。这些层可以用作接触表面、导电路径、钝化层或扩散阻挡层。此外，它们还充当 MEMS 器件加工过程中的硬掩模或牺牲层。大多数标准化工艺，例如光刻剥离工艺、湿化学和干蚀刻工艺，允许在微米到纳米的横向范围内构建这些层。沉积薄层的通用标准方法是溅射沉积。等离子体中产生的离子被加速到目标材料并因此侵蚀其表面。从目标开始，产生粒子流，目标材料随后凝结为晶圆上的生长层。层的性质主要由颗粒的动能以及表面上的扩散长度决定。因此，沉积过程中的各种参数都会影响性能。这里应该提到高频场的叠加、磁场源（磁控管）的使用以及偏置的应用。最后但并非最不重要的一点是，可沉积的材料（金属、半导体、电介质）范围广泛，使得溅射沉积成为微米和纳米系统生产的基本过程。通过考虑沉积过程中的反应过程，可以进一步扩展这种选择。作为茨维考应用科学大学高科技中心的一部分，正在建设一座拥有 680 平方米 ISO 4 级和 5 级洁净室的实验室综合体。这个洁净室的概念包括跨学科研究和教学，重点是微系统技术和纳米技术，有两个院系参与。溅射工具在这些研究领域的研发封闭流程链中发挥着关键作用。除了使用该工具执行金属化等半导体器件开发的常规任务外，它还提供了继续和加强现有研究领域并添加全新方面的机会。