Damage-free machining of hard brittle-materials under high hydrostatic pressure

高静水压下硬脆材料的无损伤加工

• 批准号: 11650117
• 负责人: YOSHINO Masahiko
• 金额: $ 2.18万
• 依托单位: Tokyo Institute of Technology
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (C)
• 财政年份: 1999
• 资助国家: 日本
• 起止时间: 1999 至 2000
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-11650117/
• 关键词: High hydrostatic pressure; Machining; Hard-brittle material; Machining defect; Turning; Quartz; Silicon wafer; Machinability; 切削加工; 施削

This project proposes machining under high hydrostatic pressure as a new damage-free machining method for hard-brittle materials. A special apparatus was designed to investigate effect of hydrostatic pressure on machinability of hard-brittle materials. The apparatus is constructed with a pressure vessel, a turntable and a cutting tool system equiped in the vessel, motors that drive the turntable and cutting tool installed outside of the vessel, a high pressure pump, and control systems. The apparatus was designed to stand for hydrostatic pressure of 500 MPa, whose pressure medium is turbine oil. A load cell that measures principal cutting force and tangential force under high hydrostatic pressure was developed so that machining status could be monitored from variation of cutting forces. The apparatus was desinged to conduct precision end-face turning test by using a diamond cutting tool under high hydrostatic pressure environment of 5OOMPa. Several performance evaluation tests were conducted on the apparatus, and it was verified that fundamental performance of the apparatus has satisfactory.

该项目提出将高静水压加工作为硬脆材料的一种新的无损伤加工方法。设计了一种专用装置，研究了静液压对硬脆材料切削性能的影响。该装置由压力容器、安装在容器内的转台和切削工具系统、安装在容器外部的驱动转台和切削工具的马达、高压泵和控制系统构成。该装置设计承受500 MPa的静水压力，其压力介质为涡轮机油。为了从切削力的变化监测加工状态，研制了一种测量高静压下主切削力和切向力的称重传感器。该装置是在500MPa的高静水压环境下，用金刚石刀具进行精密端面车削试验而设计的。对该装置进行了多项性能评价试验，结果表明该装置的基本性能令人满意。

项目成果

吉野 雅彦 ほか: "高静水圧環境下における硬脆材料の引っかき加工試験"精密工学会誌. 65-10. 1481-1485 (1999)

Masahiko Yoshino 等人：“高静水压力环境下硬脆材料的刮擦试验”日本精密工程学会杂志 65-10 1481-1485（1999）。

M.Yoshino et al.: "Some experiments onthe scratching of silicon"Int.J.Mechanical Science. 掲載決定.

M. Yoshino 等人：“关于硅划痕的一些实验”，Int. J. Mechanical Science，已接受出版。

M.Yoshino et al.: "Scratching Test of Hard-brittle Materials under High Hydrostatic Pressure"trans.ASME,J.Manufacturing Science and Engineering. Feb.(未定). (2001)

M.Yoshino 等人：“高静水压下硬脆材料的刮擦测试”，trans.ASME，J.Manufacturing Science and Engineering Feb. (TBD)。

M.Yoshino et al.: "Finite elemet simulation of plane strain plastic-elastic indentation on single cryseal silicon"Int.J.Mechanical Science. (掲載決定).

M. Yoshino 等人：“单晶硅上平面应变塑性弹性压痕的有限元模拟”，《机械科学》杂志（已出版）。