Production technology of wood based boards using a non-formaldehyde resin

使用无醛树脂的人造板生产技术

• 批准号: 11660162
• 负责人: SUZUKI Shigehiko
• 金额: $ 2.24万
• 依托单位: Shizuoka University
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (C)
• 财政年份: 1999
• 资助国家: 日本
• 起止时间: 1999 至 2001
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-11660162/
• 关键词: wood based board; adhesive; formaldehyde emission; strand board; PEG base resin; open assembly time; mechanical properties; 単板積層材

To evaluate potential utilization of a PEG based binder to the wood based panel products, laminated veneer board, mat foramolding, particleboard, and strand board were produced using a non-formaldehyde resin, PEG base binder. The results obtained are summarized as follows.Boards could be manufactured using this resin at the temperature beyond 150 ℃, however, complete curing of the resin was obtained over 200 ℃. There was no significant effect of open assembly time after the glue spreading on the mechanical properties of the boards within the range form 30 minutes to 3 months. It was proved that this type of resin had a long pot life.Also laminated veneer board can be produced using this resin.Pressing condition of the molding products was examined. It was found that preferable pre-press temperature was about 80 ℃ and the press time was 4 minutes. The mat can be stored for a long and be handled to the successive process operation. The strength degradation with increasing assembly time could not be found.The manufacturing variables for the mat-formed panel production were determined. High elastic constants were obtained using hinoki strand, which has high quality comparing with sugi. Although, board can be produced at press temperature over 120 ℃, temperature of 150 ℃ or higher than this was preferable for the production. It was found that PEG base binder was appropriate not only for flat type board, but also mold products.

为了评估基于PEG的粘合剂对基于木材的面板产品的潜在利用，使用非甲醛树脂PEG基粘合剂生产层压单板、垫成型、刨花板和刨花板。实验结果表明，该树脂在150 ℃以上可以制得板材，但在200 ℃以上树脂完全固化。在30分钟至3个月的范围内，涂胶后的开放组装时间对板的机械性能没有显著影响。结果表明，该树脂具有较长的适用期，可用于生产胶合板。结果表明，预压温度在80 ℃左右，预压时间在4min左右较为适宜。可长期存放，并可进行后续加工操作。没有发现强度随组装时间的增加而降低。确定了垫成形板生产的制造变量。使用与杉相比质量更高的扁柏股获得了高弹性常数。虽然在超过120 ℃的压制温度下可以生产板，但是对于生产来说，150 ℃或更高的温度是优选的。结果表明，PEG基粘结剂不仅适用于平板型板材，而且适用于模具制品。