Study on improvement of reliability of the super fine pitch microjoint in LSI devuce

LSI器件超细距微接头可靠性提高研究

• 批准号: 12650719
• 负责人: SEO Kenji
• 金额: $ 2.24万
• 依托单位: Himeji Institute of Technology
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (C)
• 财政年份: 2000
• 资助国家: 日本
• 起止时间: 2000 至 2002
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-12650719/
• 关键词: LSI device; Anisotoropic conductive adhesive; Flip-chip; Microjoints; Thermal stress; Finite element method; Energy release rate; Debonding strength; はく離; 熱変形; シヤーラグ理論

In this study, the improvement of reliability of the flip-chip microjoints in LSI using an anisotropic conductive adhesive has been examined. The research was conducted from three points of view as follows;(1) Theoretical study for thermal stress in flip-chip face-down interconnection using an anisotropics conductive adhesive.(2) Experimental study for debonding strength of an anisotropic conductive adhesive.(3) Experimental study for thermal stress evaluation of resin material by acoustic microscope.The main results obtained are the following.(1) Thermal stress distribution in flip-chip maicrojoints was analyzed and the effects of some factors (joints size, mechanical and physical properties of materials which composed the LSI) were clarified. The numerical-calculation results showed that the maximum compressive stress generated at the outer bump electrode.(2) The debonding strength of an anisotropic conductive adhesive was rationally evaluated by using the critical energy release rate.(3) The acoustoelasticity coefficient of acryic resin was examined. It became clear that the acoustoelastici coefficient was the same in tension and compression. On the basis of these results, a stress evaluation method of resin material using the acoustic micro scope was proposed.

在这项研究中，已经检查了使用各向异性导电粘合剂在LSI中Flip-Chip微连接的可靠性提高。该研究是从三个观点进行的；（1）使用各向异性导电粘合剂进行翻转芯片面对面互连的热应力研究理论研究。（2）实验研究，用于剥夺各向异性导电粘合剂的强度。分析了Flip-Chip Maicroxoints，并阐明了某些因素（关节大小，机械和物理特性）的影响。数值计算结果表明，通过使用关键的能量释放速率对各向异性导电粘合剂的剥离强度进行了理性评估。（3）检查了丙烯酸树脂的大声弹性系数。很明显，Acoustoelastici系数在张力和压缩方面相同。根据这些结果，提出了使用声学微观范围的树脂材料的应力评估方法。

项目成果

日下正広, 瀬尾健二, 木村真晃, 大坪健二: "超音波顕微鏡による樹脂封止デバイスの応力評価のための基礎的研究"Proc. of 8th Symposium on "Microjoining and Assembly Technology in Electronics". 515-520 (2002)

Masahiro Kusaka、Kenji Seo、Masaaki Kimura、Kenji Otsubo：“使用超声波显微镜进行树脂密封器件应力评估的基础研究”，第八届“电子微连接和组装技术”研讨会论文集（2002 年）。

K. Seo, M. Kusaka, M. Kimura and G. An: "Reliability of Microjoints with Anisotropic Conductive Adhesive"Preprints of the National Meeting of Japan Welding Society. No. 71. 108-109 (2002)

K. Seo、M. Kusaka、M. Kimura 和 G. An：“使用各向异性导电粘合剂的微接头的可靠性”日本焊接学会全国会议预印本。

瀬尾健二, 日下正広, 木村真晃, 安 圭栢: "異方導電性接着剤を用いた素子接合部の接合安定性"溶接学会全国大会講演概要. 第71集. 108-109 (2002)

Kenji Seo、Masahiro Kusaka、Masaaki Kimura、Keiho Yasu：“使用各向异性导电粘合剂连接设备接头的稳定性”日本焊接学会全国会议摘要第 71 卷 108-109 (2002)。

M. Kusaka, K. Seo, M. Kimura and K. Ohtsubo: "Basic Research on Stress Evaluation of Resin Packaged Electron Device by Acoustic Microscope"Proc. Of 8th Symposium on "Microjoing and Assembly Technology in Electronics". 515-520 (2002)

M. Kusaka、K. Seo、M. Kimura 和 K. Ohtsubo：“声学显微镜对树脂封装电子器件应力评估的基础研究”Proc。

M. Kusaka, K. Seo, M. Kimura and S. Akamatsu: "Stress Evaluation of Resin Material by Acoustic Microscope"Proc. Of 7th Symposium on "Microjoing and Assembly Technology in Electronics". 185-190 (2001)

M. Kusaka、K. Seo、M. Kimura 和 S. Akamatsu：“通过声学显微镜对树脂材料进行应力评估”Proc。