Study on improvement of reliability of the surface modification thin films based on fracture mechanics

在本研究中，一种用于评估表面修改薄膜之间接口的启动强度的新方法，以及一个基底已经开发出来，以提高表面修改薄膜的可靠性。ABS树脂板上的无电镍平板薄膜和混凝土表面上的油漆薄膜都被用作表面修改薄膜。对表面修改胶片的剥离测试已被运送出去。然后，一个强化板附着在表面修改膜上，所以它在剥皮测试期间不会破裂。在Peel测试期间，对启动负荷、启动长度和加载点的置换进行了测量。我们在能量释放率（G值）基础上对fracture mechanics as a parameter to evaluate the debonding strength of the surface modification film有特别的兴趣。从the debonding load and the displacement of the loading point measured during the peel test。作为一个结果，提供了接口条件保持相同的条件，在启动的传播中的关键能量释放率是恒定的和不受强化板影响的。因此，表面修改膜的初始强度可以通过使用关键能量释放率进行理性评估。这是清楚的，因为平板薄膜的膨胀强度与ABS树脂板的蚀刻时间有关。Furthermore，污染物对环境的影响是通过获得关键能量释放率而被回收的。

In this study, a new method for evaluating the debonding strength of the interface between a surface modification film and a substrate has been developed for improvement of reliability of the surface modification thin films. An electroless nickel plating film on ABS resin plate and a paint film on a concrete surface are used as the surface modification films. Peel tests on the surface modification films are carried out. Then, a reinforcement plate is attached to the surface modification film so that it does not break during the peel test. The debonding load, the debonding length and the displacement of the loading point are measured during the peel test. We are particularly interested in the energy release rate (G value) based on the fracture mechanics as a parameter to evaluate the debonding strength of the surface modification film. The critical energy release rage (GィイD2cィエD2 value) is obtained from the debonding load and the displacement of the loading point measured during the peel test. As a result, provided that the interface conditions remain the same, the critical energy release rate in the propagation of debonding is constant and unaffected by the reinforcement plate. Therefore, the debonding strength of the surface modification film can be rationally evaluated by using the critical energy release rate. It is cleared that the debonding strength of a plating film increases with the etching time of ABS resin plate. Furthermore, the influence of the environment on psint films are elucidated by obtaining the critical energy release rate.