Study on improvement of reliability of the surface modification thin films based on fracture mechanics

基于断裂力学的表面改性薄膜可靠性提高研究

基本信息

批准号：
09650794
负责人：
SEO Kenji
金额：
$ 2.43万
依托单位：
Himeji Institute of Technology
依托单位国家：
日本
项目类别：
Grant-in-Aid for Scientific Research (C)
财政年份：
1997
资助国家：
日本
起止时间：
1997 至 1999
项目状态：
已结题

来源：
https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-09650794/
关键词：
Surface Modification Thin Films Ffracture Mechanics Debonding Strength Energy Release Rate Reinforcement Plate Peel Test Electroless Nickel Plating Film Paint Film 接着強度窒化チタン薄膜ピ-ル試験

项目摘要

In this study, a new method for evaluating the debonding strength of the interface between a surface modification film and a substrate has been developed for improvement of reliability of the surface modification thin films. An electroless nickel plating film on ABS resin plate and a paint film on a concrete surface are used as the surface modification films. Peel tests on the surface modification films are carried out. Then, a reinforcement plate is attached to the surface modification film so that it does not break during the peel test. The debonding load, the debonding length and the displacement of the loading point are measured during the peel test. We are particularly interested in the energy release rate (G value) based on the fracture mechanics as a parameter to evaluate the debonding strength of the surface modification film. The critical energy release rage (GィイD2cィエD2 value) is obtained from the debonding load and the displacement of the loading point measured during the peel test. As a result, provided that the interface conditions remain the same, the critical energy release rate in the propagation of debonding is constant and unaffected by the reinforcement plate. Therefore, the debonding strength of the surface modification film can be rationally evaluated by using the critical energy release rate. It is cleared that the debonding strength of a plating film increases with the etching time of ABS resin plate. Furthermore, the influence of the environment on psint films are elucidated by obtaining the critical energy release rate.

在这项研究中，已经开发了一种新方法，用于评估表面修饰膜和底物之间界面的剥离强度，以提高表面修饰薄膜的可靠性。在ABS树脂板上的电镍镀膜和混凝土表面上的油漆膜用作表面修饰膜。进行表面修饰膜上的果皮测试。然后，将加固板连接到表面修饰膜上，以免在果皮测试中破裂。在果皮测试期间测量了脱键负荷，脱束长度和负载点的位移。我们对基于断裂机制的能源释放速率（G值）特别感兴趣，作为评估表面修饰膜的剥离强度的参数。临界能量释放的愤怒（GII D2CIE D2值）是从剥离负载和果皮测试期间测得的加载点的位移获得的。结果，只要界面条件保持不变，剥离的传播中的临界能量释放速率是恒定的，不受加固板的影响。因此，可以使用临界能量释放速率合理评估表面修饰膜的脱键强度。可以清楚地看出，镀层膜的剥离强度随着ABS树脂板的蚀刻时间增加。此外，通过获得临界能量释放速率来阐明环境对PSINT膜的影响。