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Study on improvement of reliability of the surface modification thin films based on fracture mechanics

Study on improvement of reliability of the surface modification thin films based on fracture mechanics
基于断裂力学的表面改性薄膜可靠性提高研究
批准号:
09650794
负责人:
SEO Kenji
金额:
$2.43万
依托单位国家:
日本
项目类别:
Grant-in-Aid for Scientific Research (C)
财政年份:
1997
资助国家:
日本
项目状态:
已结题
起止时间:
1997 至 1999

项目摘要

项目成果

SEO Kenji的其他基金

相关文献

中文摘要
翻译
In this study,a new method for evaluating the debonding strength of the interface between a surface modification film and a substrate has been developed for improvement of reliability of the surface modification thin films.An electroless nickel plating film on ABS resin plate and a paint film on a concrete surface are used as the surface modification films。Peel tests on the surface modification films are carried out.Then,a reinforcement plate is attached to the surface modification film so that it does not break during the peel test.The debonding load,the debonding length and the displacement of the loading point are measured during the peel test.We are particularly interested in the energy release rate(Gvalue)based on the fracture mechanics as a parameter to evaluate the debonding strength of the surface modification film.The critical energy release rage(G I D 2c Ii Value)is obtained from the debonding load and the displacement of the loading point measured during the peel test.As a result,provided that the interface conditions remain the same,the critical energy release rate in the propagation of debonding is constant and unaffected by the reinforcement plate。Therefore,the debonding strength of the surface modification film can be rationally evaluated by using the critical energy release rate。It is cleared that the debonding strength of a plating film increases with the etching time of ABS resin plate.Furthermore,the influence of the environment on psint films are elucidated by obtaining the critical energy release rate。
英文摘要
In this study, a new method for evaluating the debonding strength of the interface between a surface modification film and a substrate has been developed for improvement of reliability of the surface modification thin films. An electroless nickel plating film on ABS resin plate and a paint film on a concrete surface are used as the surface modification films. Peel tests on the surface modification films are carried out. Then, a reinforcement plate is attached to the surface modification film so that it does not break during the peel test. The debonding load, the debonding length and the displacement of the loading point are measured during the peel test. We are particularly interested in the energy release rate (G value) based on the fracture mechanics as a parameter to evaluate the debonding strength of the surface modification film. The critical energy release rage (GィイD2cィエD2 value) is obtained from the debonding load and the displacement of the loading point measured during the peel test. As a result, provided that the interface conditions remain the same, the critical energy release rate in the propagation of debonding is constant and unaffected by the reinforcement plate. Therefore, the debonding strength of the surface modification film can be rationally evaluated by using the critical energy release rate. It is cleared that the debonding strength of a plating film increases with the etching time of ABS resin plate. Furthermore, the influence of the environment on psint films are elucidated by obtaining the critical energy release rate.
期刊论文(0)
专著(0)
科研奖励(0)
会议论文
K.Seo, M.Kusaka, M.Kimura and M.Horibe: "Evaluating Method of Adhesive Strength of Plating Ni Film on ABS Substrate"Prof.of 5th Symposium on "Microjoing and Assembly Technology in Electronics". 83-88 (1999)
K.Seo、M.Kusaka、M.Kimura 和 M.Horibe:“评估 ABS 基板上镀镍薄膜粘合强度的方法”第五届“电子微接合与组装技术”研讨会教授。
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通讯作者:
M.Kusaka, K.Seo, M.Kimura and M.Horibe: "Evaluation Method for Debonding Strength of Surface Modification Film"Proc,of International Conference on ADVANCED TECHNOLOGY IN EXPERIMENTAL MECHANICS '99. 228-233 (1999)
M.Kusaka、K.Seo、M.Kimura 和 M.Horibe:“表面改性薄膜脱粘强度的评估方法”Proc, of International Conference on ADVANCED TECHNOLOGY IN EXPERIMENTAL MECHHANICS 99。
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瀬尾健二ほか: "Niメッキ膜の接着強度評価方法"Proceedings of 5th Symposium on "Microjoining and Assembly Technology in Electronics". 83-88 (1999)
Kenji Seo 等人:“Ni 镀膜附着强度的评价方法”第五届“电子微连接和组装技术”研讨会论文集 83-88(1999 年)。
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