Fabrication of High-quality SiC-MOSFETs for Advanced Power Electronics
Fabrication of High-quality SiC-MOSFETs for Advanced Power Electronics
批准号:
19676001
负责人:
WATANABE Heiji
金额:
$57.16万
依托单位:
依托单位国家:
日本
项目类别:
Grant-in-Aid for Young Scientists (S)
财政年份:
2007
资助国家:
日本
项目状态:
已结题
起止时间:
2007 至 2011
中文摘要
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英文摘要
Silicon carbide(SiC) has gained considerable attention for power electronics. Among the various types of power devices, metal-oxide-semiconductor(MOS) should become a key component for next generation SiC switching devices. In this study, we investigated fundamental aspects of SiC oxidation and MOS interfaces, and proposed novel methods for improving electrical properties of SiC-MOS devices. We also fabricated MOS transistors with high-permittivity gate dielectrics and successfully demonstrated superior device performance.
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Reduction of Charge Trapping Sites in Al2O3/SiO2 Stacked Gate Dielectrics by Incorporating Nitrogen for Highly Reliable 4H-SiC MIS Devices
通过掺入氮减少 Al2O3/SiO2 堆叠栅极电介质中的电荷捕获位点,实现高度可靠的 4H-SiC MIS 器件
DOI:
10.4028/www.scientific.net/msf.679-680.496
发表时间:
2011
期刊:
Materials Science Forum
影响因子:
--
作者:
[T. Hosoi, Yusuke Kagei, Takashi Kirino, Shuhei Mitani, Y. Nakano, Takashi Nakamura, T. Shimura, Heiji Watanabe]
通讯作者:
Heiji Watanabe
Investigation of Mobile Ion Generation in Thermal Oxide of 4H-SiC(0001) MOS Devices with High-Temperature Hydrogen Annealing
高温氢气退火 4H-SiC(0001) MOS 器件热氧化中移动离子生成的研究
DOI:
--
发表时间:
2011
期刊:
影响因子:
--
作者:
[A.Chanthaphan, et al]
通讯作者:
et al
熱酸化SiO_2/SiC構造における紫外線誘起欠陥の評価
热氧化SiO_2/SiC结构中紫外诱导缺陷的评估
DOI:
--
发表时间:
2011
期刊:
影响因子:
--
作者:
[池口大輔, 他]
通讯作者:
他
Correlation between surface morphology and breakdown characteristics of thermally grown SiO_2 dielectrics in 4H-SiC MOS devices
4H-SiC MOS器件中热生长SiO_2电介质表面形貌与击穿特性的相关性
DOI:
--
发表时间:
2011
期刊:
影响因子:
--
作者:
[Y.Uenishi, et al]
通讯作者:
et al
放射光XPSによるSiO2/4H-SiC構造の伝導帯オフセット評価
使用同步辐射 XPS 评估 SiO2/4H-SiC 结构的导带偏移
DOI:
--
发表时间:
2010
期刊:
影响因子:
--
作者:
[桐野嵩史, 他]
通讯作者:
他
共 60 条
Creation of high performance and highly reliable GaN MOS devices based on interface engineering
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批准号:19H00767
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项目类别:Grant-in-Aid for Scientific Research (A)
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资助金额:$28.7万
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财政年份:2019
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负责人:WATANABE Heiji
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依托单位:
海外基金