Influence of base layer thickness in orthodontic adhesive whose bond strength is changed by heating

加热改变粘合强度的正畸粘合剂基层厚度的影响

• 批准号: 20791593
• 负责人: NAMURA Yasuhiro
• 金额: $ 1万
• 依托单位: Nihon University
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Young Scientists (B)
• 财政年份: 2008
• 资助国家: 日本
• 起止时间: 2008 至 2009
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-20791593/
• 关键词: 科矯正用接着材; マイクロカプセル; 歯学; 歯科矯正用接着材; 矯正接着材; 矯正

We have developed an orthodontic adhesive whose bond strength is markedly decreased by heating and evaluated relationship between thickness and bond strength in the adhesive,Thicknesses of the adhesive (50-200μm) were set and the bond strengths were measured with each thickness.As the results,it was found that the bond strength of l00μm thickness is appropriate and available.In addition,We measured bond strength of existing adhesive using bracket built the adhesive layer and it was confirmed that bonding using a bracket with the layer of 100μm is acceptable.

我们开发了一种加热后粘结强度明显降低的正畸胶粘剂，并评估了胶粘剂厚度与粘结强度之间的关系，设置了胶粘剂的厚度（50-200μm），并测量了每种厚度的粘结强度。结果表明，厚度为100 μm的粘结强度是合适的、可行的。此外，我们使用支架构建粘接层来测量现有胶粘剂的粘接强度，确认使用100μm层的支架进行粘接是可以接受的。

项目成果

熱膨張接着材の厚さがセラミックブラケットの接着強さへ与える影響

热膨胀胶厚度对陶瓷托槽粘接强度的影响

• 发表时间: 2009
• 作者: 龍智弥子;納村泰弘;濱友彦;清水典佳
• 通讯作者: 清水典佳