Investigation on the flexible printed circuit fabricated by direct electroless Cu plating on a polyimide film.

研究在聚酰亚胺薄膜上直接化学镀铜制备柔性印刷电路。

• 批准号: 21760260
• 负责人: IKEDA Akihiro
• 金额: $ 3万
• 依托单位: Kyushu University
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Young Scientists (B)
• 财政年份: 2009
• 资助国家: 日本
• 起止时间: 2009 至 2011
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-21760260/
• 关键词: プラズマ改質; 無電解めっき; FPC; 高周波信号; バンドパスフィルタ; フィルム直接めっき; PEN; シランカップリング; FT-IR; 無電解銅めっき; ポリイミド; KOH改質

I have developed the electroless Cu plating directly on polyimide and poly-ethylene naphthalate films by KOH and O2 plasma modifications on the film surfaces, respectively. Using the electroless plating technique, flexible printed circuits(FPC) were formed on the films. I confirmed that these FPC showed smaller signal transmission losses for GHz signals in comparison to a conventional Cu foil laminated FPC. Also, I have fabricated the low loss band pass filter using the electroless Cu plating for 5 GHz wireless band.

我已经开发了化学镀铜直接聚酰亚胺和聚萘二甲酸乙二醇酯薄膜的KOH和O2等离子体改性的薄膜表面上，分别。使用化学镀技术，在膜上形成柔性印刷电路（FPC）。我证实，与传统的铜箔层压FPC相比，这些FPC显示出更小的GHz信号传输损耗。此外，我已经制作了低损耗带通滤波器使用化学镀铜5 GHz无线频段。

项目成果

Electroless Ni-B plating on SiO2 with 3-aminopropyl-triethoxysilane as a barrier layer against Cu diffusion for through-Si via interconnections in a 3-dimensional multi-chip package

• DOI: 10.1016/j.tsf.2008.09.068
• 发表时间: 2009
• 期刊: Thin Solid Films
• 影响因子: 2.1
• 作者: A. Ikeda;A. Sakamoto;R. Hattori;Y. Kuroki

Low-Temperature Bonding of LSI Chips to Polymer Substrate using Au Cone Bump for Flexible Electronics

使用金锥凸块将 LSI 芯片低温键合到聚合物基板上，用于柔性电子产品

• 发表时间: 2011
• 期刊: Proceedings of the 61st Electronic Components and Technology Conference
• 作者: T.Shuto;N.Watanabe;A.Ikeda;Tanemasa Asano
• 通讯作者: Tanemasa Asano

High-frequency signal transmission characteristics of coplanar waveguides with cone bump interconnections

具有锥体凸块互连的共面波导的高频信号传输特性

• 发表时间: 2010
• 期刊: Proceeding of the IEEE Region 10 Conference (TENCON) 2010
• 作者: A Ikeda;K.Kajiwara;N.Watanabe;T.Asano
• 通讯作者: T.Asano

Low-Temperature Bonding of LSI Chips to Polymer Substrate using Au Cone Bump for Fjexible Electronics

使用金锥凸块将 LSI 芯片低温键合到聚合物基板上，用于柔性电子产品

• 发表时间: 2011
• 期刊: Proceedings of the 61st Electronic Components and Technology Conference
• 作者: Takanori Shuto;Naoya Watanabe;Akihiro Ikeda;Takao Higashimachi;Tanemasa Asano
• 通讯作者: Tanemasa Asano

Compliant Bump Technology for Back-Side IIIuminated CMOS Image Sensor

适用于背面 III 照明 CMOS 图像传感器的顺应凸块技术

• 发表时间: 2009
• 期刊: Proceedings of 59th Electronic Components and technology Conference
• 作者: T.Asano;N.Watanabe;A.Ikeda;et al.
• 通讯作者: et al.