Investigation on the flexible printed circuit fabricated by direct electroless Cu plating on a polyimide film.

在聚酰亚胺和聚萘二甲酸乙酯薄膜表面分别进行KOH和O2等离子体改性，开发了直接化学镀铜的方法。利用化学镀技术，在薄膜上形成柔性印刷电路。我证实，与传统的铜箔层压FPC相比，这些FPC在GHz信号中显示出更小的信号传输损耗。此外，我已经制造了低损耗带通滤波器使用化学镀铜5 GHz无线频段。

I have developed the electroless Cu plating directly on polyimide and poly-ethylene naphthalate films by KOH and O2 plasma modifications on the film surfaces, respectively. Using the electroless plating technique, flexible printed circuits(FPC) were formed on the films. I confirmed that these FPC showed smaller signal transmission losses for GHz signals in comparison to a conventional Cu foil laminated FPC. Also, I have fabricated the low loss band pass filter using the electroless Cu plating for 5 GHz wireless band.