Decrease of Thermal Expansion of Ball Screw Used for Precision Positioning Devices by Peltier Module Cooling

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In order to decrease the thermal expansion of the precision positioning device, so far, many cooling methods have been suggested and some of them have been already applied to the actual positioning system. In this paper, a new method of employing Peltier modules on the basis of feedback to cool the stage as well as the bearing is proposed. A specially-designed experimental system was established for the verification. As a result of a serial of experiments, it was found that the total thermal expansion of the ball screw was within 2 μm.