Effect of miniaturization of solder joint for electronics packagingon interfacial reaction between solder and substrate and impact reliability of the joint

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As solder bumps become increasingly miniaturized to meet the severdemands of future electronic packaging, it is important to consider whether the solderjoint size and geometry could become reliability issues and thereby affect implementationof the Pb-free solders. In this study, the effect of the solder bump size on the interfacialreaction between the solder and a substrate and the impact reliability using a miniatureimpact tester was investigated. Experimental results suggest that the solder bump sizecan influence the interfacial reaction and the impact reliability of the solder bump.