Development of Nano-scale structure design and process technology by advanced composite cluster beam
Development of Nano-scale structure design and process technology by advanced composite cluster beam
批准号:
22760557
负责人:
SEKI Toshio
金额:
$2.58万
依托单位:
依托单位国家:
日本
项目类别:
Grant-in-Aid for Young Scientists (B)
财政年份:
2010
资助国家:
日本
项目状态:
已结题
起止时间:
2010 至 2012
中文摘要
构建了复合簇束生成装置,用氩气和甲醇、水、α-三氯乙烷等液体材料组成簇束。用CH3OH-Ar复合簇离子束辐照Si靶材时,复合簇离子从Si中释放出的二次离子强度是Ar簇离子的10倍。结果表明,CH3OH-Ar复合簇离子束可作为二次离子质谱的探测束。
英文摘要
Composite cluster beam generation apparatus was constructed and clusters composed with Ar gas and liquid materials, such as methanol, water or α-trichloroethane, were formed. When a Si target was irradiated with the CH3OH-Ar composite cluster ion beam, the intensity of secondary ions from the Si by composite cluster ion was 10 times higher than that by Ar cluster ion. This result shows that the CH3OH-Ar composite cluster ion beam is useful as probe beam of secondary ion mass spectroscopy.
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High Speed Si Etching with ClF3 Cluster Injection
使用 ClF3 簇注入进行高速硅蚀刻
DOI:
10.1063/1.3548393
发表时间:
2010
期刊:
AIP Conference Proceedings
影响因子:
--
作者:
[T. Seki, Y. Yoshino, T. Senoo, K. Koike, S. Ninomiya, T. Aoki, and J.Matsuo]
通讯作者:
and J.Matsuo
DOI:
10.1063/1.3548384
发表时间:
2011-01
期刊:
影响因子:
--
作者:
[K. Ichiki;S. Ninomiya;T. Seki;T. Aoki;J. Matsuo]
通讯作者:
K. Ichiki;S. Ninomiya;T. Seki;T. Aoki;J. Matsuo
Si Processing with Energetic Neutral Cluster Beam
用高能中性簇束进行硅加工
DOI:
--
发表时间:
2011
期刊:
影响因子:
--
作者:
[T.Seki, Y.Yoshino, T.Senoo, K.Koike, T.Aoki, T.Matsuo]
通讯作者:
T.Matsuo
“High-speed Processing with ClF3 Cluster Injection”
“利用 ClF3 簇注入进行高速处理”
DOI:
--
发表时间:
2012
期刊:
影响因子:
--
作者:
[Y.Tang, A.Hosoi, Y.Iwase, Y.Ju, T. Seki]
通讯作者:
T. Seki
High-speed Si etching with ClF3 neutral cluster beam
使用 ClF3 中性簇束进行高速硅蚀刻
DOI:
--
发表时间:
2010
期刊:
影响因子:
--
作者:
[T. Seki, Y. Yoshino, T. Senoo, K. Koike, T. Aoki and J. Matsuo]
通讯作者:
T. Aoki and J. Matsuo
共 29 条
Generation of nano-scale structure controlled composite cluster beam
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批准号:18681014
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项目类别:Grant-in-Aid for Young Scientists (A)
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资助金额:$18.72万
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财政年份:2006
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负责人:SEKI Toshio
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依托单位: