Research on robust and reliable RF-MEMS switch using conductive soft material

本研究对一种导电软材料的柔韧性和力学性能进行了评价，以探讨其在RF-MEMS开关中应用的可能性。此外，还开发了提高腐蚀损伤单晶硅断裂强度的工艺技术。结果，作为导电聚合物的聚苯胺膜的杨氏模数约为5 Gpa，与金属的粘附力被评估为相对较低。此外，还证明了在适当的条件下进行氢退火可以使硅表面的粗糙度因腐蚀损伤而变得平坦。

In this study, the flexibility and mechanical property of a conductive soft material was evaluated in order to investigate its application possibility to RF-MEMS switch. In addition, process technology for improvement of fracture strength of the single crystal silicon which was damaged by etching process was developed. As a result, Young's modulus of a thin polyaniline film as a conductive polymer measured approximately 5 GPa, and the adhesion force to metals was evaluated to be relatively low. Furthermore, it was demonstrated that hydrogen annealing in appropriate condition can lead to flattening of the asperity of the silicon surface due to etching damage.