On mechanism of microbubble emission boiling and the application for high heat flux cooling technology

微泡发射沸腾机理及高热流冷却技术应用

• 批准号: 23560246
• 负责人: SUZUKI Koichi
• 金额: $ 3.33万
• 依托单位: Tokyo University of Science, Yamaguchi
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (C)
• 财政年份: 2011
• 资助国家: 日本
• 起止时间: 2011 至 2013
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-23560246/
• 关键词: サブクール沸騰; 気泡微細化沸騰; 高熱流束; パワーエレクトロニクス; 沸騰冷却; 不凍液媒体; マイクロチャンネル; 気液界面; 限界熱流束; 気液界面の不安定; 高熱流束沸騰冷却; 混合媒体; 狭隘流路; 音響振動

A subcooled pool boiling has been performed for the purpose of developing high heat flux cooling technology. Microbubble emission boiling (MEB) has occurred for a mixture of anti-freezing liquid and water. The heat flux increases higher than the critical heat flux (CHF). In the boiling of water under the pressurized condition of 0.1MPa in gage for an example, MEB occurs and the heat flux increases higher than the CHF. In subcooled flow boiling in a microchannel, the vapor fills whole of the channel and the boiling turns to film boiling. These experimental results give effective information for the practical cooling technology.In subcooled pool boiling of water in an acoustic field, MEB has been observed at frequency of 500Hz. According to the PIV analysis of microbubbles in MEB, the subcooled liquid has been observed to flow into the heating surface. The experimental results give the mechanism of MEB and solid-liquid contact.

为了发展高热流密度冷却技术，进行了过冷池沸腾。防冻液与水的混合物发生了微泡发射沸腾(MEB)。热流密度高于临界热流密度(CHF)。以加压压力为0.1 Mpa的水沸腾为例，发生了MEB，热流密度增加幅度大于CHF。在微通道内的过冷流动沸腾中，蒸汽充满整个通道，沸腾转变为膜沸腾。这些实验结果为实际冷却技术提供了有效的信息。在声场中水的过冷池沸腾中，在500赫兹的频率下观察到了MEB。根据对MEB内微泡的PIV分析，观察到过冷液体流入了受热面。实验结果给出了微碰撞和固液接触的机理。

项目成果

Microbubble Emission Boiling of Binary Mixtures(Advanced cooling technology for future power electronics)

二元混合物的微泡发射沸腾（未来电力电子的先进冷却技术）

• 发表时间: 2013
• 期刊: Proceedings of International Conference on Multi-phase Flow 2013
• 作者: Koichi Suzuki;Kazuhisa Yuki;Gang Chen;Cyungpyo Hong
• 通讯作者: Cyungpyo Hong

High Heat Flux Cooling Technology for Power Electronics (Subcooled Boiling of Water Mixture of Antifreeze Coolants)

电力电子高热通量冷却技术（防冻冷却剂水混合物过冷沸腾）

• 发表时间: 2012
• 期刊: Proc. ISTP23
• 作者: K. Suzuki;K. Yuki;G. Chen and C. Hong
• 通讯作者: G. Chen and C. Hong

RC248 電子実装における信頼性設計と熱制御に関する研究分科会

RC248 电子封装可靠性设计和热控制研究小组委员会

• 发表时间: 2012
• 作者: 鈴木康一;結城和久;洪 定杓
• 通讯作者: 洪 定杓

Application of Boiling Heat Transfer to High-Heat-Flux Cooling Technology in Power Electronics

• DOI: 10.5104/jiepeng.4.127
• 发表时间: 2011
• 期刊: Transactions of The Japan Institute of Electronics Packaging
• 作者: Koichi Suzuki;K. Yuki;M. Mochizuki

Subcooled Boiling of Water Mixture of Anti-Freezing Liquid with Microbubble Emission

微泡防冻液水混合物的过冷沸腾

• 发表时间: 2013
• 期刊: Proceedings of ITTWS2013 on Two-Phase Systems for Ground and Space
• 作者: Koichi Suzuki;Kazuhisa Yuki;Hiroshi Kawamura;Haruhiko Ohta;Yoshiyuki Abe
• 通讯作者: Yoshiyuki Abe