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On mechanism of microbubble emission boiling and the application for high heat flux cooling technology

On mechanism of microbubble emission boiling and the application for high heat flux cooling technology
微泡发射沸腾机理及高热流冷却技术应用
批准号:
23560246
负责人:
SUZUKI Koichi
金额:
$3.33万
依托单位国家:
日本
项目类别:
Grant-in-Aid for Scientific Research (C)
财政年份:
2011
资助国家:
日本
项目状态:
已结题
起止时间:
2011 至 2013

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中文摘要
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英文摘要
A subcooled pool boiling has been performed for the purpose of developing high heat flux cooling technology. Microbubble emission boiling (MEB) has occurred for a mixture of anti-freezing liquid and water. The heat flux increases higher than the critical heat flux (CHF). In the boiling of water under the pressurized condition of 0.1MPa in gage for an example, MEB occurs and the heat flux increases higher than the CHF. In subcooled flow boiling in a microchannel, the vapor fills whole of the channel and the boiling turns to film boiling. These experimental results give effective information for the practical cooling technology.In subcooled pool boiling of water in an acoustic field, MEB has been observed at frequency of 500Hz. According to the PIV analysis of microbubbles in MEB, the subcooled liquid has been observed to flow into the heating surface. The experimental results give the mechanism of MEB and solid-liquid contact.
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DOI: 10.5104/jiepeng.4.127
发表时间: 2011
期刊: Transactions of The Japan Institute of Electronics Packaging
影响因子: --
作者: [Koichi Suzuki;K. Yuki;M. Mochizuki]
通讯作者: Koichi Suzuki;K. Yuki;M. Mochizuki
RC248 電子実装における信頼性設計と熱制御に関する研究分科会
RC248 电子封装可靠性设计和热控制研究小组委员会
DOI: --
发表时间: 2012
期刊:
影响因子: --
作者: [鈴木康一, 結城和久, 洪 定杓]
通讯作者: 洪 定杓
Microbubble Emission Boiling of Binary Mixtures(Advanced cooling technology for future power electronics)
二元混合物的微泡发射沸腾(未来电力电子的先进冷却技术)
DOI: --
发表时间: 2013
期刊: Proceedings of International Conference on Multi-phase Flow 2013
影响因子: --
作者: [Koichi Suzuki, Kazuhisa Yuki, Gang Chen, Cyungpyo Hong]
通讯作者: Cyungpyo Hong
High Heat Flux Cooling Technology for Power Electronics (Subcooled Boiling of Water Mixture of Antifreeze Coolants)
电力电子高热通量冷却技术(防冻冷却剂水混合物过冷沸腾)
DOI: --
发表时间: 2012
期刊: Proc. ISTP23
影响因子: --
作者: [K. Suzuki, K. Yuki, G. Chen and C. Hong]
通讯作者: G. Chen and C. Hong
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