Development of a PTFE Printed Circuit board that is used in High-Frequency Devices of Terahertz band

研究了在树脂基片上化学镀铜作为生产柔性印刷电路板（PCB）的方法。为了提高未来高频电子设备的速度，需要具有低介电损耗特性的树脂基板。聚四氟乙烯（PTFE）是树脂中最理想的材料。但是，由于PTFE表面是低表面自由能的，铜层与PTFE表面的结合强度很弱。因此，需要对PTFE进行表面改性。此外，为了减小信号互连延迟，需要保持PTFE表面的光滑，本研究尝试采用大气压等离子体（APP）处理与表面改性涂层形成相结合的方法对PTFE表面进行改性。因此，可以改善PTFE的粘附性以及平滑性。

Electroless copper plating on resin substrates has been studied as method for producing flexible printed circuit boards [PCB] . For increased speed of future high-frequency electronics devices, resin substrate having a characteristic of low dielectric loss is necessary. Polytetrafluoroethylene [PTFE] is the most ideal material among resins. However, the adhesion strength between copper layers and PTFE surface is greatly weak, because the PTFE surface is low surface free energy. Therefore, surface modification of PTFE has been required. Furthermore, in order to reduce the signal interconnection delay, it is necessary to keep the smooth PTFE surface.In this study, we tried to modify the PTFE surface by combination of atmospheric-pressure plasma [APP] treatment and coating formation of surface modification. Then, it was possible to improve the adhesion of PTFE as well as smoothing.